Substrate cleaving tool and method

• US 6,221,740 B1
• Filed: 08/10/1999
• Issued: 04/24/2001
• Est. Priority Date: 08/10/1999
• Status: Expired due to Term

• Current Assignee: Silicon Genesis
• Original Assignee: Silicon Genesis
• Inventors: Kai, James K., Bryan, Michael A.
• Primary Examiner(s): Bowers, Charles
• Assistant Examiner(s): SARKAR, ASOK K
• Application Number:
  US09/371,436
• Time in Patent Office: 623 Days
• Field of Search: 125/23.01, 225/2, 414/17, 438/458
• US Class Current: 438/458
• CPC Class Codes: B28D 5/0011 with preliminary treatment, e.g. weakening by scoring
• CPC Class Codes: B28D 5/0023 rectilinearly
• CPC Class Codes: B28D 5/0064 Devices for the automatic drive or the program control of the machines
• CPC Class Codes: B28D 5/0082 for supporting, holding, feeding, conveying or discharging work
• CPC Class Codes: B32B 43/006 Delaminating
• CPC Class Codes: H01L 21/67092 Apparatus for mechanical treatment or grinding or cutting, see the relevant groups in subclasses B24B or B28D
• CPC Class Codes: Y10T 156/1939 Air blasting delaminating means]
• CPC Class Codes: Y10T 225/12 With preliminary weakening
• CPC Class Codes: Y10T 225/18 Progressively to or from one side edge
• CPC Class Codes: Y10T 225/30 Breaking or tearing apparatus
• CPC Class Codes: Y10T 225/386 Clamping supports
• CPC Class Codes: Y10T 29/53683 Spreading parts apart or separating them from face to face engagement

Abstract

A cleaving tool provides pressurized gas to the edge of a substrate to cleave the substrate at a selected interface. A substrate, such as a bonded substrate, is loaded into the cleaving tool, and two halves of the tool are brought together to apply a selected pressure to the substrate. A compliant pad of selected elastic resistance provides support to the substrate while allowing the substrate to expand during the cleaving process. Bringing the two halves of the tool together also compresses an edge seal against the perimeter of the substrate. A thin tube connected to a high-pressure gas source extends through the edge seal and provides a burst of gas to separate the substrate into at least two sheets. In a further embodiment, the perimeter of the substrate is struck with an edge prior to applying the gas pressure.

Claims

1. A method of cleaving a substrate, the method comprising:

placing the substrate on a first portion of a substrate cleaving shell;

placing a second portion of the substrate cleaving shell on the substrate, the substrate having a first perimeter edge and a second perimeter edge, to compress and seal a compliant member against the first perimeter edge and the second perimeter edge of the substrate to form a plenum; and

applying pressurized fluid through a gas port into the plenum.

2. The method of claim 1 wherein the pressurized gas is applied as a burst of pressurized gas.

3. The method of claim 2 wherein the pressurized gas is at a pressure of about 300 to 600 psig, and the burst has a duration of about 22 msec.

4. The method of claim 1 wherein the compliant member is an O-ring.

5. The method of claim 4 wherein the O-ring is hollow.

6. The method of claim 5 further comprising a step, after the step of placing the substrate onto the first portion of the cleaving shell, of pressurizing the O-ring.

7. The method of claim 1 wherein the substrate cleaving shell includes a compliant pad between the substrate and either the first portion or the second portion of the substrate cleaving shell, the step of placing the second portion of the substrate cleaving shell on the substrate further operating to compress the compliant pad against the substrate at a selected pressure.

8. The method of claim 7 wherein the compliant pad is a rubber pad with about 30 durometer.

9. The method of claim 1 further comprising a step, prior to the step of applying pressurized gas, of impacting at least the first perimeter edge or second perimeter edge with an edge of a tool.

10. A method of cleaving a substrate, the method comprising:

placing the substrate on a base;

compressing a top against the substrate through a compliant pad having a durometer of about 30 to apply a selected compressive pressure gradient to the substrate;

compressing and sealing an O-ring against a first perimeter edge of the substrate and a second perimeter edge of the substrate to form a plenum;

providing a gas port to the plenum; and

pressurizing the plenum with a burst of gas via the gas port to cleave the substrate, wherein the pressure gradient increases from an initial pressure near the gas port.