Procedure and system for inspecting a component with leads to determine its fitness for assembly

• US 6,222,629 B1
• Filed: 06/10/1999
• Issued: 04/24/2001
• Est. Priority Date: 06/10/1999
• Status: Expired due to Fees

• Current Assignee: Pmj Automec Oyj
• Original Assignee: Pmj Automec Oyj
• Inventors: Morris, Joseph
• Primary Examiner(s): Pham, Hoa Q.
• Assistant Examiner(s): Nguyen, Sang H.
• Application Number:
  US09/329,541
• Time in Patent Office: 684 Days
• Field of Search: 356/375, 356/237.1, 356/237.2, 356/237.3, 356/380, 356/376, 356/381, 356/383, 356/384, 356/385, 250/599.26
• US Class Current: 356/601
• CPC Class Codes: G01B 11/2433 for measuring outlines by shadow casting
• CPC Class Codes: H05K 13/0413 with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
• CPC Class Codes: H05K 13/0813 Controlling of single components prior to mounting, e.g. orientation, component geometry H05K13/0812 takes precedence

Abstract

Procedure and system for inspecting a component (1) with leads to determine its fitness for assembly before the component is placed on a circuit board. In the procedure, a narrow illuminating beam (10) is directed at a light-sensitive detector (11). The component (1) and the illuminating beam (10) are moved in relation to each other so that the position as a function of time is known and that the leads (4) of the component pass through the illuminating beam. The illuminating beam thus reaches the light-sensitive detector when it falls between leads, whereas when it falls on leads, the leads cast a shadow, preventing the beam from reaching the light-sensitive detector. The pulse produced by the light-sensitive detector as a result of the illuminating beam being intercepted by the shadowing effect of the leads is registered. Based on the pulse, the width of the lead row and/or the distance between adjacent lead rows are/is computed. The computed width and/or distance are/is compared with a specified allowed respective limit value. The component is placed on the circuit board if the width and/or the distance between adjacent lead rows computed on the basis of the measurement are/is within the allowed limits, or alternatively the component is rejected and removed without placing it on the circuit board if the measured value/values differ undesirably from the allowed limit value.

Claims

1. A method for inspecting a component with leads to determine fitness of the component for assembly in conjunction with automatic circuit board assembly performed using an assembly robot before the component is placed on a circuit board, said component having a row of at least two leads to be inserted into corresponding holes in the circuit board, said robot being equipped with a gripper for taking hold of the component, the method comprising:

directing a narrow illuminating beam at a light-sensitive detector,

translating the component and the illuminating beam in relation to each other in a direction of at least one of a width and length of the row of leads so that position of the component is known as a function of time and so that the leads of the component pass through the illuminating beam, the illuminating beam thus reaching the light-sensitive detector when passing between the leads, and the leads casting a shadow when the illuminating beam illuminates one of the leads, preventing the beam from reaching the light-sensitive detector,

recording a pulse produced by the light-sensitive detector when the illuminating beam is intercepted by the one of the leads,

computing, based on the pulse, at least one of a lead row width and a distance between adjacent leads rows,

comparing the at least one of the lead row width and the distance between adjacent leads rows with a specified allowed respective limit, and

placing the component on the circuit board when the computed at least one of the lead row width and the distance between adjacent lead rows is within the allowed respective limit, and rejecting and removing the component without placing the component on the circuit board when the computed at least one of the lead row width and the distance between adjacent lead rows differs from the allowed respective limit.

2. A method as defined in claim 1, wherein the gripper holding the component is a gripper of an xyzw-robot.

3. A method as defined in claim 1, further comprising inspecting the lead row of the component by moving the component in relation to a stationary illuminating beam.

4. A method as defined in claim 1, further comprising passing the component across the illuminating beam in one of a direction of the lead row width and the lead row length.

5. A method as defined in claim 1, further comprising computing the at least one of the lead row width and the distance between adjacent lead rows based on start and end instants of the pulse.

6. A method as defined in claim 1, wherein an x-direction is defined by a direction of travel of a conveyor holding the circuit board, and the illuminating beam is directed at the light-sensitive detector in a horizontal plane in the x-direction.

7. A method as defined in claim 1, further comprising rotating the component before moving the component through the illuminating beam, so that the lead row becomes parallel to the illuminating beam.

8. A method as defined in claim 6, further comprising setting the component, before being moved through the illuminating beam, to a position where the lead row lies in a horizontal plane in the x-direction, a y-direction lying orthogonal to the x-direction in the horizontal plane, and then moving the component is moved in the y-direction through the illuminating beam.

9. A method as defined in claim 1, wherein an x-direction is defined parallel to a direction of travel of a conveyor holding the circuit board and a y-direction lies orthogonal to the x-direction in a horizontal plane, and further comprising setting the component, before moving the component through the illuminating beam, to a position where the lead row lies in a horizontal plane in the y-direction and moving the component in the x-direction through the illuminating beam.

10. A method as defined in claim 1, wherein an x-direction is defined parallel to a direction of travel of a conveyor holding the circuit board and a y-direction lies orthogonal to the x-direction in a horizontal plane, and further comprising moving the component simultaneously in the x and y directions through the illuminating beam.

11. A method as defined in claim 1, wherein an x-direction is defined parallel to a direction of travel of a conveyor holding the circuit board and a y-direction lies orthogonal to the x-direction in a horizontal plane, and further comprising adjusting the component a z-direction, perpendicular to the x and y directions, to a position where the illuminating beam intersects the leads adjacent to their free ends.

12. A method as defined in claim 1, further comprising inspecting the lead row of the component by moving the component through a horizontal illuminating beam oriented in a direction parallel to a direction of motion of a conveyor that holds the circuit board, and then rotating the component through 90°

about a vertical axis; and

moving the component through the same illuminating beam.

13. A method as defined in claim 1, further comprising providing two parallel illuminating beams placed at a distance from each other and oriented in a direction parallel to a conveying direction of a conveyor that holds the circuit board;

inspecting the lead row of the component using a first illuminating beam;

rotating the component through 90°

about a vertical axis; and

inspecting the lead row of the component using a second illuminating beam.

14. A method as defined in claim 1, further comprising providing two mutually perpendicular illuminating beams;

and inspecting the lead row by moving the component through the two mutually perpendicular illuminating beams.

15. A method as defined in claim 1, further comprising, while moving the component through the illuminating beam,

registering supposed position coordinates of a specified lead of the component from a robot control unit based on position data for the gripper of the robot,

computing actual position coordinates of the specified lead, based on a pulse registration by the light-sensitive detector that corresponds to the specified lead, and

comparing the supposed position coordinates of the specified lead with the computed actual position coordinates of the specified lead, and

calibrating the supposed position coordinates of the lead of the component to correspond to the computed actual value to allow insertion coordinates for component placement to be determined, if the supposed position coordinates differ from the actual position coordinates by at least a predetermined amount.

16. A method as defined in claim 1, further comprising generating the illuminating beam using a laser.

17. A system for inspecting a component with leads to determine fitness of the component for assembly in conjunction with automatic circuit board assembly performed using an assembly robot before the component is placed on a circuit board, said component having a row of at least two leads to be inserted into corresponding holes in the circuit board, said robot being equipped with a gripper for taking hold of the component, the system comprising:

a first inspection device comprising a light sensitive detector and a light source that generates a first illuminating beam directed at the light-sensitive detector,

means for translating the component and the first illuminating beam relative to each other so that the position of the component relative to the first illuminating beam is known as a function of time and so that the leads of the component pass through the first illuminating beam, the illuminating beam passing between the component leads to reach the light-sensitive detector and being prevented from reaching the light-sensitive detector by the leads when the leads are interposed between the light source and the light sensitive detector,

means for registering an output pulse produced by the light-sensitive detector when a component lead passes either into or out of the first illuminating beam;

means for computing at least one of a width of a component lead row and a distance between adjacent lead rows based on the pulse, and

means for comparing the computed at least one of the width of the component lead row and the distance between adjacent lead rows with a specified allowed limit value.

18. A system as defined in claim 17, further comprising

means for registering supposed position coordinates of a specified lead of the component from the control unit of a robot based on position data for the gripper of the robot,

means for computing, based on the pulse registered by the light-sensitive detector and corresponding to the specified lead, the actual position coordinates of said specified lead, and

means for comparing the supposed position coordinates of the lead with the computed actual position coordinates and, if the supposed position coordinates differ from the computed actual coordinates, for calibrating position coordinates of the lead of the component so as to make the position coordinates of the lead correspond to the computed actual value to allow the insertion coordinates for the placement to be determined.

19. A system as defined in claim 17, wherein the means for moving the component are disposed to move the component in at least one of a direction parallel to and perpendicular to the lead row.

20. A system as defined in claim 17, wherein the first inspection device is fixedly mounted in place;

and the robot is arranged to move the component in relation to the first illuminating beam.

21. A system as defined in claim 17, wherein the light source is disposed so that the first illuminating beam is horizontal.

22. A system as defined in claim 17, wherein the assembly robot is a xyzw-robot.

23. A system as defined in claim 17, wherein the light source is disposed so that the first illuminating beam is parallel to an x-axis lying parallel to a direction of motion of a conveyor holding the circuit board and the circuit board lies in an xy-plane defined by the x-axis and a horizontal y-axis orthogonal to the x-axis.

24. A system as defined in claim 17, the system comprises a second illumination device having a second illuminating beam parallel to the first illuminating beam.

25. A system as defined in claim 17, further comprising a second illumination device having a second illumination beam perpendicular to the first illuminating beam.

26. A system as defined in claim 17, wherein the first inspection devices is disposed between component feed device and a circuit board conveyor holding the circuit board.

27. A system as defined in claim 26, wherein the first inspection is disposed on a component transfer route between the component feed station and the circuit board so that inspection of leads is performed as the root transfers the component between the component feed station and the circuit board substantially without stopping and substantially without diverging from the component transfer route between the component feed station and the circuit board.

28. A system as defined in claim 17, wherein the light source is a laser.

29. A system as defined in claim 17, wherein a width of the first illuminating beam is no more than a lead thickness.

30. A system as defined in claim 17, wherein the first illuminating beam has a diameter of approximately 0.1 mm.

31. A method for inspecting a component with leads to determine fitness of the component for assembly in conjunction with automatic circuit board assembly performed using an assembly robot before the component is placed on a circuit board, said component having leads to be inserted into corresponding holes in the circuit board, said robot being equipped with a gripper for taking hold of the component, comprising:

directing a narrow illuminating beam is directed at a light-sensitive detector,

translating the component and the illuminating beam in relation to each other so that a position of the component relative to the illuminating beam as a function of time is known and so that the leads of the component pass through the illuminating beam, the illuminating beam thus reaching the light-sensitive detector when passing between component leads, and being prevented from reaching the light-sensitive detector when incident on a component lead,

registering a pulse produced by the light-sensitive detector as a result of the illuminating beam being intercepted by a lead,

computing, based on the pulse, at least one of a lead width and a distance between adjacent leads,

comparing the at least one of the lead width and the distance between adjacent leads with a specified allowed respective limit range, and

placing the component on the circuit board when the at least one of the lead width and the distance between adjacent leads falls within the allowed respective limit range, and rejecting and removing the component when the at least one of the lead width and the distance between adjacent leads exceeds the respective limit range.

32. A system for inspecting a component having leads, to determine fitness of the component for assembly by a robot using automatic circuit board assembly before the component is placed on a circuit board, the component having at least two leads to be inserted into corresponding holes in the circuit board, the leads having a lead width, the system comprising:

a first inspection device including a first photodetector and a first light source directing a first illuminating beam having a width no more than approximately the lead width at the first photodetector;

a gripper arranged to hold the component and translate the component relative to the first illuminating beam so that at least one of the component leads of the component passes through the illuminating beam;

a controller coupled to the gripper to track a gripper position as a function of time, the controller being coupled to receive a detection signal generated by the first photodetector as at least one component lead passes through the illuminating beam and being arranged to determine at least one of lead row width and separation between adjacent lead rows based on the detection signal and the gripper position and to compare the at least one of the lead row width and the separation between adjacent lead rows to respective predetermined value ranges.