Flip chip package for micromachined semiconductors

• US 6,225,692 B1
• Filed: 06/03/1999
• Issued: 05/01/2001
• Est. Priority Date: 06/03/1999
• Status: Expired due to Fees

• Current Assignee: CTS Corporation
• Original Assignee: CTS Corporation
• Inventors: Hinds, Ronald L.
• Primary Examiner(s): Lee, Eddie C.
• Assistant Examiner(s): CLARK, JASMINE JHIHAN B
• Application Number:
  US09/325,282
• Time in Patent Office: 698 Days
• Field of Search: 257/698, 257/700, 257/703, 257/705, 257/685, 257/686, 257/693, 361/795, 361/536, 438/109
• US Class Current: 257/698
• CPC Class Codes: B81B 7/007 Interconnections between the MEMS and external electrical signals
• CPC Class Codes: H01L 21/4857 Multilayer substrates multilayer metallisation on monolayer substrate H01L21/4846
• CPC Class Codes: H01L 23/10 characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]

Abstract

A hermetic multilayered ceramic semiconductor package for micromachined semiconductor devices. A low temperature co-fired ceramic assembly has a cavity and a top and bottom surface. Several vias extend between the top and bottom surfaces and several solder spheres are located on the top surface and are electrically connected to the vias. A micromachined semiconductor device abuts the bottom surface and covers the cavity such that a movable portion of the micromachined semiconductor device is unconstrained to move within the cavity. Solder is used to connect the vias to solder bumps on the semiconductor device. A seal ring is located between the micromachined semiconductor device and the ceramic assembly for hermetically sealing the micromachined semiconductor device.

Claims

1. A semiconductor package for containing a micromachined semiconductor device, comprising:

a) a first substrate having a cavity located therein, the micromachined semiconductor device located adjacent the first substrate;

b) a second substrate, located adjacent the first substrate;

c) a third substrate, located adjacent the second substrate;

d) a plurality of vias, extending through the first, second and third substrates;

e) a plurality of conductor lines, located on the first and second substrate and electrically connected to the vias;

f) electrical connection means, located between the vias and the micromachined semiconductor device, for electrically connecting the vias to the semiconductor device; and

g) a solder ring, located between the micromachined semiconductor device and the first substrate for hermetically sealing the micromachined semiconductor device.

2. The semiconductor package according to claim 1, wherein the electrical connection means includes:

a) a plurality of bond pads located on the micromachined semiconductor; and

b) a plurality of solder joints connected between the bond pads and the vias.

3. The semiconductor package according to claim 1, wherein the substrate is a low temperature co-fired ceramic.

4. The semiconductor package according to claim 1, wherein a plurality of solder spheres are located on the third substrate and connected to the vias.