Grooved semiconductor die for flip-chip heat sink attachment
First Claim
1. A flip-chip semiconductor package comprising:
- a package substrate having an upper surface, a lower surface and a plurality of conductive traces, the upper surface having an upper plurality of electrical contacts coupled to the conductive traces, the lower surface having a lower plurality of electrical contacts coupled to the conductive traces;
a semiconductor die having an active surface and a non-active surface, the active surface having a plurality of circuit elements and a plurality of bond pads formed thereon, the bond pads being attached to the upper plurality of electrical contacts by solder bumps, the non-active surface having a plurality of grooves formed thereon, the grooves increasing the surface area of the non-active surface of the semiconductor die;
a heat sink attached to the non-active surface of the semiconductor die with an adhesive, the adhesive filling the grooves between the heat sink and the semiconductor die, the grooves increasing the contact area of the adhesive to the semiconductor die thereby increasing the mechanical bond strength and thermal conductivity between the semiconductor die and the heat sink; and
wherein at least a portion of one of the plurality of grooves is directly underneath a portion of the heat sink at a point where the portion of the heat sink is attached to the semiconductor die.
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Accused Products
Abstract
One aspect of the invention relates to a flip-chip semiconductor package. In one version of the invention, the flip-chip semiconductor package includes a package substrate having an upper surface, a lower surface and a plurality of conductive traces, the upper surface having an upper plurality of electrical contacts coupled to the conductive traces, the lower surface having a lower plurality of electrical contacts coupled to the conductive traces, the lower plurality of electrical contacts being attachable to electrical contacts on a printed circuit board; a semiconductor die having an active surface and a non-active surface, the active surface having a plurality of circuit elements and a plurality of bond pads formed thereon, the bond pads being attached to the upper plurality of electrical contacts by solder bumps, the non-active surface having a plurality of grooves formed thereon; and a heat sink attached to the non-active surface of the semiconductor die.
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Citations
16 Claims
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1. A flip-chip semiconductor package comprising:
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a package substrate having an upper surface, a lower surface and a plurality of conductive traces, the upper surface having an upper plurality of electrical contacts coupled to the conductive traces, the lower surface having a lower plurality of electrical contacts coupled to the conductive traces;
a semiconductor die having an active surface and a non-active surface, the active surface having a plurality of circuit elements and a plurality of bond pads formed thereon, the bond pads being attached to the upper plurality of electrical contacts by solder bumps, the non-active surface having a plurality of grooves formed thereon, the grooves increasing the surface area of the non-active surface of the semiconductor die;
a heat sink attached to the non-active surface of the semiconductor die with an adhesive, the adhesive filling the grooves between the heat sink and the semiconductor die, the grooves increasing the contact area of the adhesive to the semiconductor die thereby increasing the mechanical bond strength and thermal conductivity between the semiconductor die and the heat sink; and
whereinat least a portion of one of the plurality of grooves is directly underneath a portion of the heat sink at a point where the portion of the heat sink is attached to the semiconductor die. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A method for attaching a semiconductor die to a heat sink in a flip-chip package, the semiconductor die having an active surface with a plurality of circuit elements and bond pads formed thereon and a non-active surface, the method comprising:
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providing a semiconductor die with a plurality of grooves on the non-active surface, the grooves increasing the surface area of the non-active surface of the semiconductor die;
attaching the non-active surface to a surface of the heat sink with an adhesive, the adhesive filling the grooves between the heat sink and the semiconductor die, the grooves increasing the contact area of the adhesive to the semiconductor die thereby increasing the mechanical bond strength and thermal conductivity between the semiconductor die and the heat sink;
attaching the bond pads on the active surface on the semiconductor die to electrical contacts on a package substrate with solder bumps such that the active surface faces the package substrate; and
whereinthe step of attaching the non-active surface to a surface of the heat sink with an adhesive is performed such that at least a portion of one of the plurality of grooves is directly underneath a portion of the heat sink at a point where the portion of the heat sink is attached to the semiconductor die. - View Dependent Claims (9, 10, 11, 12, 13, 14, 15, 16)
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Specification