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Grooved semiconductor die for flip-chip heat sink attachment

  • US 6,225,695 B1
  • Filed: 06/05/1997
  • Issued: 05/01/2001
  • Est. Priority Date: 06/05/1997
  • Status: Expired due to Term
First Claim
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1. A flip-chip semiconductor package comprising:

  • a package substrate having an upper surface, a lower surface and a plurality of conductive traces, the upper surface having an upper plurality of electrical contacts coupled to the conductive traces, the lower surface having a lower plurality of electrical contacts coupled to the conductive traces;

    a semiconductor die having an active surface and a non-active surface, the active surface having a plurality of circuit elements and a plurality of bond pads formed thereon, the bond pads being attached to the upper plurality of electrical contacts by solder bumps, the non-active surface having a plurality of grooves formed thereon, the grooves increasing the surface area of the non-active surface of the semiconductor die;

    a heat sink attached to the non-active surface of the semiconductor die with an adhesive, the adhesive filling the grooves between the heat sink and the semiconductor die, the grooves increasing the contact area of the adhesive to the semiconductor die thereby increasing the mechanical bond strength and thermal conductivity between the semiconductor die and the heat sink; and

    wherein at least a portion of one of the plurality of grooves is directly underneath a portion of the heat sink at a point where the portion of the heat sink is attached to the semiconductor die.

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