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Advanced RF electronics package

  • US 6,225,696 B1
  • Filed: 04/08/1998
  • Issued: 05/01/2001
  • Est. Priority Date: 09/18/1997
  • Status: Expired due to Term
First Claim
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1. An electronics package for housing one or more electronics components forming a circuit, the electronics package comprising:

  • one or more first electronic components, said first electronic components cast in ceramic forming one or more first modular ceramic preforms;

    one or more interconnect channels, cast in ceramic forming second modular preforms for connecting to said one or more first electronic components in said first modular ceramic preform; and

    a cast housing, said cast housing cast with first and second modular ceramic preforms and formed with one or more cavities for receiving said one or more second electronic components after said housing is cast, said one or more second electronic components adapted to be interconnected with said one or more first electronic components by way of said interconnect channels in said second modular ceramic preforms.

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