Non-lot based method for assembling integrated circuit devices

• US 6,226,394 B1
• Filed: 11/16/1999
• Issued: 05/01/2001
• Est. Priority Date: 02/20/1998
• Status: Expired due to Term

• Current Assignee: Micron Technology, Inc.
• Original Assignee: Micron Technology, Inc.
• Inventors: Wilson, Kevin, Hjorth, Ron
• Primary Examiner(s): Boudreau, Leo H.
• Assistant Examiner(s): Werner, Brian P.
• Application Number:
  US09/440,736
• Time in Patent Office: 532 Days
• Field of Search: 382/141, 382/145, 382/146-149, 382/152, 702/80-84, 702/185, 702/187, 702/118, 348/87, 348/126, 356/237.4, 356/237.5, 438/7, 438/15, 438/16, 250/559.34, 250/559.44, 209/577, 235/375, 700/108-110, 700/96, 700/115, 700/116, 700/121
• US Class Current: 382/145
• CPC Class Codes: G05B 19/4183 characterised by data acquisition, e.g. workpiece identification
• CPC Class Codes: G05B 2219/31307 Identification structure is partly a copy of operating structure
• CPC Class Codes: G05B 2219/36371 Barcode reader
• CPC Class Codes: G05B 2219/45031 Manufacturing semiconductor wafers
• CPC Class Codes: H01L 21/67276 Production flow monitoring, e.g. for increasing throughput program-control systems per se G05B19/00, e.g. total factory control G05B19/418
• CPC Class Codes: H01L 21/67294 using identification means, e.g. labels on substrates or labels on containers
• CPC Class Codes: H01L 2223/5444 for electrical read out
• CPC Class Codes: H01L 2223/54473 for use after dicing
• CPC Class Codes: H01L 2223/5448 Located on chip prior to dicing and remaining on chip after dicing
• CPC Class Codes: H01L 2223/54486 Located on package parts, e.g. encapsulation, leads, package substrate
• CPC Class Codes: H01L 23/544 Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps test patterns for characterising or monitoring manufacturing processes H01L22/00
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: Y02P 90/02 Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Abstract

An inventive method tracks IC devices through the assembly steps in a manufacturing process. Prior to die attach, a laser scribe marks the lead frame of each of the devices with a coded hole matrix that gives each device a unique ID code. During die attach, an optical hole reader retrieves the ID code of each of the IC devices, and a computer system stores the retrieved ID codes in association with the lot numbers of the ICs attached to the lead frames. The ID codes of the devices are then read at each step in assembly so the devices can be tracked through assembly individually, rather than by lots. As a result, the devices can proceed through assembly in a more efficient, continuous manner (i.e., without breaks between lots).

Claims

1. A method for tracking multiple lots of a plurality of integrated circuit devices through an assembly step in an integrated circuit manufacturing process, each integrated circuit device of the plurality of integrated circuit devices having a mounting substrate, the method comprising:

providing a mounting substrate;

providing a plurality of integrated circuit devices;

placing a substantially unique identification code on the mounting substrate in a readable position thereon;

placing an identification code on the each integrated circuit device of the plurality of integrated circuit devices;

associating the identification code of the integrated circuit device with a substrate code;

mounting at least one of the plurality of integrated circuit devices on the mounting substrate;

reading the mounting substrate identification code of the each integrated circuit device of the plurality of integrated circuit devices in each lot of the multiple lots;

advancing the plurality of integrated circuit devices in the multiple lots through a series of assembly steps in the manufacturing process in a substantially continuous manner;

generating data related to the advancement of the each integrated circuit devices of the plurality of integrated circuit devices through the assembly step; and

associating the data generated for the each integrated circuit device of the plurality of integrated circuit devices with the mounting substrate identification code of its associated integrated circuit device so the multiple lots of the plurality of integrated circuit devices may be tracked through the assembly step.

2. The method of claim 1, wherein the each integrated circuit device of the plurality of integrated circuit devices includes a mounting substrate selected from a group comprising a lead frame and a printed circuit board, wherein the each integrated circuit device of the plurality of integrated circuit devices is selected from a group comprising lead frame integrated circuit devices, Chip-on-Board (COB) integrated circuit devices, and flip-chip integrated circuit devices.

3. The method of claim 1, wherein the mounting substrate of the each integrated circuit device of the plurality of integrated circuit devices is marked with a unique, optically retrievable mounting substrate identification code, wherein the step of reading the mounting substrate identification code of the each integrated circuit device of the plurality of integrated circuit devices comprises optically retrieving the mounting substrate identification code of the each integrated circuit device of the plurality of integrated circuit devices.

4. The method of claim 3, wherein the unique, optically retrievable mounting substrate identification code comprises one of a bar code, an Optical Character Recognition (OCR) code, and a coded hole matrix and wherein the assembly step of optically retrieving the mounting substrate identification code of the each integrated circuit device of the plurality of integrated circuit devices comprises retrieving the code of the each integrated circuit device of the plurality of integrated circuit devices with one of a bar code reader, an OCR reader, and an optical hole reader.

5. The method of claim 1, wherein the assembly step of a series of assembly steps in the integrated circuit device manufacturing process includes one assembly step of die attach, die cure, wire bond, molding, de-flash, lead finish, trim and form, and opens/shorts testing.

6. The method of claim 1, wherein the reading the mounting substrate identification code of the each integrated circuit device of the plurality of integrated circuit devices occurs before the advancing the plurality of integrated circuit devices through the assembly step in the integrated circuit manufacturing process.

7. The method of claim 1, wherein the advancing the plurality of integrated circuit devices through a series of assembly steps in the manufacturing process comprises advancing the plurality of integrated circuit devices serially through multiple machines associated with the series of assembly steps.

8. The method of claim 1, wherein the advancing the plurality of integrated circuit devices through a series of assembly steps in the integrated circuit manufacturing process comprises advancing the plurality of integrated circuit devices through parallel machines associated with the series of assembly steps.

9. The method of claim 1, wherein the generating data related to the advancement of the each integrated circuit device of the plurality of integrated circuit devices through the assembly step comprises generating at least one of assembly equipment data, assembly personnel data, assembly set-up data, and time and date data.

10. The method of claim 1, further comprising the storing the mounting substrate identification code of the each integrated circuit device of the plurality of integrated circuit devices after it is read and wherein the associating the data generated for the each integrated circuit device of the plurality of integrated circuit devices with the mounting substrate identification code of its associated integrated circuit device comprises storing the data generated for the each integrated circuit device of the plurality of integrated circuit devices in association with the stored mounting substrate identification code of its associated integrated circuit device.

11. The method of claim 10, wherein the storing the data generated for the each integrated circuit device of the plurality of integrated circuit devices in association with the stored mounting substrate identification code of its associated integrated circuit device comprises storing the data in a decentralized manner within a computer system so at least partial access to the stored data may continue during a failure of a centralized portion of the computer system.

12. A method of manufacturing a plurality of integrated circuit devices, the method comprising:

providing a plurality of fabrication substrates in multiple lots;

fabricating a plurality of integrated circuit dice on each of the fabrication substrate of the plurality of fabrication substrates;

separating each integrated circuit die of the plurality of integrated circuit dice on each fabrication substrate of the plurality of fabrication substrates from its fabrication substrate to form one integrated circuit die of a plurality of integrated circuit dice;

providing a plurality of mounting substrates, each mounting substrate of the plurality of mounting substrates marked with a substantially unique mounting substrate identification code;

providing a front-end identification code associated with each substantially unique mounting substrate identification code associated with the each integrated circuit die of the plurality of integrated circuit dice;

reading a front-end identification code associated with the each integrated circuit die of the plurality of integrated circuit dice;

reading the substantially unique mounting substrate identification code marked on the each mounting substrate of the plurality of mounting substrates;

attaching the each integrated circuit die of the plurality of integrated circuit dice to one mounting substrate of the plurality of mounting substrates to form one integrated circuit device of a plurality of integrated circuit devices;

storing the front-end identification code of the each integrated circuit die of the plurality of integrated circuit dice in each integrated circuit device of the plurality of integrated circuit devices in association with the substantially unique mounting substrate identification code of the each mounting substrate of the plurality of mounting substrates to which the each integrated circuit die of the plurality of integrated circuit dice is attached;

advancing the each integrated circuit device of the plurality of integrated circuit devices through assembly including;

advancing the plurality of integrated circuit devices through at least one assembly step in a substantially continuous manner;

generating data related to the advancement of the each integrated circuit device of the plurality of integrated circuit devices through the assembly step; and

associating the data generated for the each integrated circuit device of the plurality of integrated circuit devices with the substantially unique mounting substrate identification code of the each mounting substrate of the plurality of mounting substrates of the each integrated circuit device of the plurality of integrated circuit devices so the plurality of integrated circuit devices may be tracked through the assembly step; and

back-end testing the each integrated circuit device of the plurality of integrated circuit devices.

13. The method of claim 12, further comprising:

storing a back-end identification code of the each integrated circuit device of the plurality of integrated circuit devices in association with the substantially unique mounting substrate identification code of the each mounting substrate of the plurality of mounting substrates to which the each integrated circuit die of the plurality of integrated circuit dice is attached; and

storing back-end testing-related data for the each integrated circuit device of the plurality of integrated circuit devices in association with the back-end identification code of the each integrated circuit device of the plurality of integrated circuit devices so the plurality of integrated circuit devices may be tracked through back-end testing.

14. The method of claim 13, wherein the step of storing a back-end identification code of the each integrated circuit device of the plurality of integrated circuit devices comprises storing at least one of a fuse ID code and a lot number.

15. The method of claim 13, wherein the front-end identification code and back-end identification code associated with the each integrated circuit device of the plurality of integrated circuit devices are identical.

16. The method of claim 12, wherein the providing the plurality of fabrication substrates comprises providing substrates selected from a group comprising semiconductor wafers, Silicon-on-Sapphire (SOS) substrates, Silicon-on-Insulator (SOI) substrates, and Silicon-on-Glass (SOG) substrates.

17. The method of claim 12, wherein the fabricating a plurality of integrated circuit dice on the each fabrication substrate of the plurality of fabrication substrates comprises fabricating integrated circuit dice selected from a group comprising Dynamic Random Access Memory (DRAM) ICs, Static Random Access Memory (SRAM) ICs, Synchronous DRAM (SDRAM) ICs, processor ICs, Application Specific ICs (ASICs), Read Only Memory (ROM) ICs, and Electrically Erasable Programmable ROM (EEPROM) ICs.

18. The method of claim 12, further comprising the programming the each integrated circuit die of the plurality of integrated circuit dice on the each of the fabrication substrate of the plurality of fabrication substrates to permanently store a substantially unique fuse ID code, wherein the reading a front-end identification code associated with the each integrated circuit die of the plurality of integrated circuit dice comprises reading a fuse ID code programmed into the each integrated circuit die of of the plurality of integrated circuit dice.

19. The method of claim 18, wherein the programming the each integrated circuit die of the plurality of integrated circuit dice on the each fabrication substrate of the plurality of fabrication substrates to permanently store a substantially unique fuse ID code comprises programming at least one of fuses and anti-fuses in the each integrated circuit die of the plurality of integrated circuit dice on the each fabrication substrate of the plurality of fabrication substrates to permanently store each substantially unique fuse ID.

20. The method of claim 12, wherein the providing the plurality of mounting substrates comprises marking the each mounting substrate of the plurality of mounting substrates with an optically readable, substantially unique mounting substrate ID code selected from a group comprising a bar code, an Optical Character Recognition (OCR) code, and a coded hole matrix.

21. The method of claim 20, wherein the each mounting substrate of the plurality of mounting substrates comprises one of a plurality of lead frames, wherein the marking the each mounting substrate of the plurality of mounting substrates comprises laser scribing a coded hole matrix in a lead frame rail of each lead frame of the plurality of lead frames.

22. The method of claim 12, wherein the reading a front-end identification code associated with the each integrated circuit die of the plurality of integrated circuit dice comprises reading at least one of a lot number, a wafer number, and a fuse ID code associated with the each integrated circuit die of the plurality of integrated circuit dice.

23. The method of claim 12, wherein the reading the substantially unique mounting substrate identification code marked on the each mounting substrate of the plurality of mounting substrates comprises reading the substantially unique mounting substrate identification codes with at least one of a bar code reader, an Optical Character Recognition (OCR) reader, and an optical hole reader.

24. The method of claim 12, wherein the reading the substantially unique mounting substrate identification code includes verifing the substantially unique mounting substrate identification code using a Cycle Redundancy Check (CRC).

25. The method of claim 12, wherein the providing the plurality of mounting substrates comprises providing at least one of a plurality of lead frames and a plurality of printed circuit boards.

26. The method of claim 12, further comprising the verifying that the plurality of integrated circuit devices are supposed to progress through the assembly before advancing the plurality of integrated circuit devices through the assembly.

27. The method of claim 12, wherein the attaching the plurality of integrated circuit dice comprises attaching the plurality of integrated circuit dice using at least one of a Chip-on-Board (COB) technique and a flip-chip technique.

28. A method of manufacturing multi-chip integrated circuit devices, the method comprising:

providing a plurality of fabrication substrates in multiple lots;

fabricating a plurality of integrated circuit dice on each fabrication substrate of the plurality of fabrication substrates;

separating each integrated circuit die of the plurality of integrated circuit dice on the each fabrication substrate of the plurality of fabrication substrates from its fabrication substrate to form one integrated circuit die of a plurality of integrated circuit dice;

providing a plurality of mounting substrates, each mounting substrate marked with a substantially unique mounting substrate identification code;

providing a front-end identification code associated with each substantially unique mounting substrate identification code associated with the each integrated circuit die of the plurality of integrated circuit dice;

reading a front-end identification code associated with the each integrated circuit die of the plurality of integrated circuit dice;

reading a mounting substrate identification code marked on the each mounting substrate of the plurality of mounting substrates;

attaching more than one integrated circuit die of the plurality of integrated circuit dice to the each mounting substrate of the plurality of mounting substrates to form a plurality of multi-chip integrated circuit devices;

storing the front-end identification code of the each integrated circuit die of the plurality of integrated circuit dice in each multi-chip integrated circuit device of the plurality of multi-chip integrated circuit devices in association with the substantially unique mounting substrate identification code of the each mounting substrate of the plurality of mounting substrates to which the each integrated circuit die of the plurality of integrated circuit dice is attached;

advancing the each multi-chip integrated circuit device of the plurality of multi-chip integrated circuit devices through assembly including;

advancing the plurality of multi-chip integrated circuit devices through at least one assembly step in a substantially continuous manner;

generating data related to the advancement of the each multi-chip integrated circuit device of the plurality of multi-chip integrated circuit devices through the at least one assembly step; and

associating the data generated for the each multi-chip integrated circuit device of the plurality of multi-chip integrated circuit devices with the substantially unique mounting substrate identification code of the each mounting substrate of plurality of mounting substrates the each multi-chip integrated circuit device of the plurality of multi-chip integrated circuit devices so the plurality of multi-chip integrated circuit devices may be tracked through the assembly step; and

back-end testing the each multi-chip integrated circuit device of the plurality of multi-chip integrated circuit devices.

29. The method of claim 28, further comprising:

storing a back-end identification code of the each integrated circuit die of the plurality of integrated circuit dice in the each multi-chip integrated circuit device of the plurality of multi-chip integrated circuit devices in association with the substantially unique mounting substrate identification code of the each mounting substrate of the plurality of mounting substrates to which the each integrated circuit die of the plurality of integrated circuit dice is attached; and

storing back-end testing-related data for the each integrated circuit device of the plurality of integrated circuit devices in association with the back-end identification code of the each integrated circuit die of the plurality of integrated circuit dice so the plurality of integrated circuit dice may be tracked through back-end testing.

30. The method of claim 28, wherein the attaching more than one integrated circuit die of the plurality of integrated circuit dice to the each mounting substrate of the plurality of mounting substrates to form the plurality of multi-chip integrated circuit devices comprises attaching more than one integrated circuit die of the plurality of integrated circuit dice to the each mounting substrate of the plurality of mounting substrates to form a plurality of multi-chip integrated circuit devices selected from a group comprising Single In-Line Memory Modules (SIMMs), Dual In-Line Memory Modules (DIMMs), Multi-Chip Modules (MCMs), and multi-chip printed circuit (PC) boards.

31. A method of locating an individual integrated circuit die of a plurality integrated circuit device having at least one integrated circuit die on an integrated circuit device manufacturing line on which a multitude of integrated circuit devices are being manufactured, the method comprising:

marking a mounting substrate of the at least one integrated circuit die of the plurality of integrated circuit devices with a substantially unique, optically-readable mounting substrate identification code;

advancing the plurality of integrated circuit devices through assembly in multiple lots; and

when one integrated circuit device of the plurality of integrated circuit devices is being processed by an assembly-related machine, reading the substantially unique, optically readable mounting substrate identification code associated with the at least one integrated circuit die of the integrated circuit device and storing the substantially unique, optically readable identification code in association with a machine identification number of the assembly-related machine;

when the one integrated circuit device of the plurality of integrated circuit devices is stored in an integrated circuit device carrier, reading the substantially unique, optically readable mounting substrate identification code associated with the at least one integrated circuit die of the integrated circuit device and storing the substantially unique, optically readable identification code in association with a carrier identification number of the integrated circuit device carrier;

reading the carrier identification numbers of the integrated circuit device carriers in which the integrated circuit devices are stored and storing the carrier identification numbers in association with a location code identifying a location of the integrated circuit device carriers on a manufacturing line; and

when the individual integrated circuit device is stored in the integrated circuit device carrier, locating the individual integrated circuit device on the manufacturing line by accessing the carrier identification number stored in association with the substantially unique, optically readable mounting substrate identification code of the at least one integrated circuit die of the individual integrated circuit device and by accessing the location code stored in association with the accessed carrier identification number; and

when the individual integrated circuit device is being processed by an assembly-related machine, locating the individual integrated circuit device on the manufacturing line by accessing a machine identification number stored in association with the substantially unique, optically readable mounting substrate identification code of the at least one integrated circuit die of the individual integrated circuit device.

32. The method of claim 31, wherein the reading the carrier identification numbers comprises reading carrier bar codes.

33. The method of claim 31, wherein the storing the carrier identification numbers in association with a location code identifying the location of the integrated circuit device carriers on the manufacturing line comprises storing the carrier identification numbers in association with a location code identifying the location of the integrated circuit device carriers as being a location selected from a group comprising on a storage shelf, in a storage bin, mounted to feed a plurality of integrated circuit devices into an assembly-related machine, and mounted to receive processed integrated circuit devices from an assembly-related machine.