Method of fabricating an electronic circuit device and apparatus for performing the method
First Claim
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1. A method of soldering for use in fabricating an electronic circuit device, comprising the steps of:
- removing at least one of an oxide layer and a contamination layer from respective surfaces of a solder material and at least one member to be connected thereto, by laser beam cleaning;
aligning said at least one member and said solder material in an oxidizing atmosphere; and
heating said solder material in a nonoxidizing atmosphere to melt the solder material.
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Abstract
In soldering together two members such as electronic circuit devices, after an oxide or contaminated layer has been removed from the surface of a solder material or bonding pad, for example, the members are aligned in an oxidizing atmosphere. Then the solder material is heated in a nonoxidizing atmosphere to melt the solder and bond the members. Cleaning of the solder material or bonding pad is performed by sputter-cleaning, laser cleaning, mechanical polishing, or cutting.
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Citations
20 Claims
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1. A method of soldering for use in fabricating an electronic circuit device, comprising the steps of:
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removing at least one of an oxide layer and a contamination layer from respective surfaces of a solder material and at least one member to be connected thereto, by laser beam cleaning;
aligning said at least one member and said solder material in an oxidizing atmosphere; and
heating said solder material in a nonoxidizing atmosphere to melt the solder material. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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16. A method of soldering for use in fabricating an electronic circuit device, comprising the steps of:
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removing at least one of an oxide layer and a contamination layer from respective surfaces of a solder material and at least one member to be connected thereto, by laser beam cleaning;
oxidizing said surfaces to form a thin oxide layer thereon;
aligning said at least one member and said solder material; and
heating said solder material in a nonoxidizing atmosphere to melt the solder material.
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17. A method of soldering for use in fabricating an electronic circuit device, comprising the steps of:
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processing a solder material to ensure that no oxide layer and no contamination layer are present thereon, by laser beam cleaning;
thereafter, aligning at least one electronic circuit device member and said solder material in an oxidizing atmosphere; and
then heating said solder material in a nonoxidizing atmosphere to melt the solder material. - View Dependent Claims (18, 19)
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20. A fluxless bonding method for bonding a connecting member of an integrated circuit, comprising the steps of:
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removing at least one of an oxide layer and a contamination layer from respective surfaces of a solder material and at least one connecting member to be connected thereto, by laser beam cleaning;
aligning said at least one connecting member and said solder material in an oxidizing atmosphere; and
heating said solder material in a nonoxidizing atmosphere to melt the solder material.
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Specification