Structure and process for thin film interconnect

• US 6,228,511 B1
• Filed: 10/29/1999
• Issued: 05/08/2001
• Est. Priority Date: 10/29/1991
• Status: Expired due to Fees

• Current Assignee: International Business Machines Corporation
• Original Assignee: International Business Machines Corporation
• Inventors: Sorce, Peter Jerome, Mc Guire, Kathleen Mary, Kellner, Benedikt Maria Johannes, Sachdev, Krishna Gandhi
• Primary Examiner(s): Jones, Deborah
• Assistant Examiner(s): LA VILLA, MICHAEL EUGENE
• Application Number:
  US09/429,814
• Time in Patent Office: 557 Days
• Field of Search: 428/548, 428/545, 428/595, 428/596, 428/597, 428/615, 428/621, 428/624, 428/626, 428/655, 428/668, 428/671, 428/672, 428/674, 428/676, 428/681, 428/680, 428/457 , 428/473.5, 428/458, 428/209, 428/901, 428/635, 428/623, 428/599, 428/192, 257/741, 257/750, 257/753, 257/773, 257/774, 257/499, 257/698, 257/702, 29/852, 29/846, 29/830, 216/18, 216/20, 216/38, 174/68.1, 174/261, 174/262, 174/268, 174/110 R, 174/110 SR, 174/126.4, 174/126.1, 174/126.3, 174/257, 174/258, 439/69
• US Class Current: 428/626
• CPC Class Codes: H01L 21/486 Via connections through the substrate with or without pins
• CPC Class Codes: H01L 23/5383 Multilayer substrates H01L23/5385 takes precedence; multilayer metallisation on monolayer substrates H01L23/538
• CPC Class Codes: H01L 23/5384 Conductive vias through the substrate with or without pins, e.g. buried coaxial conductors H01L23/5383, H01L23/5385 take precedence; pins attached to insulating substrates H01L23/49811
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 2201/0154 Polyimide
• CPC Class Codes: H05K 2201/068 wherein the coefficient of thermal expansion is important
• CPC Class Codes: H05K 2201/09554 Via connected to metal substrate
• CPC Class Codes: H05K 2201/09563 Metal filled via plated through-hole filled with insulating material H05K2201/0959
• CPC Class Codes: H05K 2201/096 Vertically aligned vias, holes or stacked vias
• CPC Class Codes: H05K 2203/0152 Temporary metallic carrier, e.g. for transferring material affixing a prefabricated conductor pattern formed by electroplating or electroforming on a metallic carrier H05K3/205
• CPC Class Codes: H05K 3/0032 of organic insulating material
• CPC Class Codes: H05K 3/0035 of blind holes, i.e. having a metal layer at the bottom
• CPC Class Codes: H05K 3/0061 onto a metallic substrate, e.g. a heat sink heat sinks for electric apparatus H05K7/20
• CPC Class Codes: H05K 3/007 Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier H05K1/187, H05K3/20 and H05K3/4682 take precedence
• CPC Class Codes: H05K 3/388 by the use of a metallic or inorganic thin film adhesion layer
• CPC Class Codes: H05K 3/4076 by thin-film techniques
• CPC Class Codes: H05K 3/423 characterised by electroplating method
• CPC Class Codes: H05K 3/445 having insulated holes or insulated via connections through the metal core
• CPC Class Codes: H05K 3/4614 the electrical connections between the circuit boards being made during lamination
• CPC Class Codes: H05K 3/4617 : characterized by laminating only or mainly similar single-sided circuit boards
• CPC Class Codes: H05K 3/4641 : having integrally laminated metal sheets or special power cores
• CPC Class Codes: Y10T 29/49165 : by forming conductive walled aperture in base
• CPC Class Codes: Y10T 428/12361 : having aperture or cut
• CPC Class Codes: Y10T 428/12382 : Defined configuration of both thickness and nonthickness surface or angle therebetween [e.g., rounded corners, etc.]
• CPC Class Codes: Y10T 428/12556 : Organic component
• CPC Class Codes: Y10T 428/12569 : Synthetic resin
• CPC Class Codes: Y10T 428/12806 : Refractory [Group IVB, VB, or VIB] metal-base component
• CPC Class Codes: Y10T 428/12812 : Diverse refractory group metal-base components: alternative to or next to each other
• CPC Class Codes: Y10T 428/24777 : Edge feature
• CPC Class Codes: Y10T 428/31678 : Of metal
• CPC Class Codes: Y10T 428/31681 : Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]

Abstract

This invention relates generally to a structure and process for thin film interconnect, and more particularly to a structure and process for a multilayer thin film interconnect structure with improved dimensional stability and electrical performance. The invention further relates to a process of fabrication of the multilayer thin film structures. The individual thin film structure is termed a compensator, and functions as both a ground/reference plane and as a stabilizing entity with regard to dimensional integrity. The compensator is comprised primarily of a metal sheet having a metallized via pattern and high-temperature stable polymer as an insulator.

Claims

1. A transferable compensator interconnect structure used in forming a multilayer thin-film structure, said transferable compensator comprising at least one metal layer, said metal layer having at least one opening, at least one layer of at least one polymer conformably coating said metal layer and lining said at least one opening, and wherein said opening is filled to form at least one via metal stud, and wherein adhesion between said at least one metal layer and said layer of polymer is achieved through at least one layer of at least one adhesion metal, such that said adhesion metal conformably coats said metal layer and lines said at least one opening.

2. The structure of claim 1, wherein said polymer is a high-temperature stable insulator.

3. The structure of claim 1, wherein said adhesion metal is selected from the group consisting of chromium, copper, nickel, tantalum, titanium, and alloys thereof.

4. The structure of claim 1, wherein the material for said at least one metal layer is selected from the group consisting of copper, iron-nickel alloy having 36% by weight nickel, molybdenum, tungsten, and alloys thereof.

5. The structure of claim 1, wherein said via metal stud is formed by electroplating, sputtering, or evaporation.

6. The structure of claim 1, wherein the material for said via metal stud is selected from the group consisting of aluminum, copper, gold, tungsten and alloys thereof.

7. The structure of claim 1, wherein said polymer is a high-temperature stable polyimide derived from polyamic acid or polyamic ester precursors.

8. The structure of claim 7, wherein said polyimide is low thermal expansion polyimide BPDA-PDA with in-plane thermal coefficient of expansion of 5-6 ppm/degrees C. at 100 degrees C. and formed from biphenic dianhydride—

p-phenylene diamine.

9. The structure of claim 1, wherein at least one blind via stud electrically contacts at least a portion of said metal layer.