Near chip size integrated circuit package

• US 6,228,676 B1
• Filed: 07/07/1999
• Issued: 05/08/2001
• Est. Priority Date: 10/31/1996
• Status: Expired due to Term

• Current Assignee: Amkor Technology Singapore Holding Pte., Ltd. (Amkor Technology Incorporated)
• Original Assignee: Amkor Technology Incorporated
• Inventors: Glenn, Thomas P., Hollaway, Roy D., Panczak, Anthony E.
• Primary Examiner(s): Niebling, John F.
• Assistant Examiner(s): Zarneke, David A
• Application Number:
  US09/348,772
• Time in Patent Office: 671 Days
• Field of Search: 438/106, 438/107, 438/109, 438/110, 438/111, 438/112, 438/113, 438/121, 438/124, 438/125, 438/126, 438/127, 438/14, 438/15, 438/460, 438/464
• US Class Current: 438/107
• CPC Class Codes: H01L 21/56 Encapsulations, e.g. encapsulation layers, coatings
• CPC Class Codes: H01L 21/561 Batch processing
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49175 Parallel arrangements
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/81 using a bump connector
• CPC Class Codes: H01L 2224/83 using a layer connector
• CPC Class Codes: H01L 2224/85 using a wire connector
• CPC Class Codes: H01L 2224/92247 the second connecting process involving a wire connector
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 23/3128 the substrate having spherical bumps for external connection
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 : of a plurality of wire connectors
• CPC Class Codes: H01L 24/97 : the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01019 : Potassium [K]
• CPC Class Codes: H01L 2924/01028 : Nickel [Ni]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/0105 : Tin [Sn]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/01087 : Francium [Fr]
• CPC Class Codes: H01L 2924/01322 : Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15173 : in a single layer of the multilayer substrate
• CPC Class Codes: H01L 2924/15183 : in a single layer of the multilayer substrate
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding

Abstract

A plurality of integrated circuit chip (IC chip) packages are fabricated simultaneously from a single insulating substrate having sections. In each section, an IC chip is attached. Bonding pads on the IC chip are electrically connected to first metallizations on a substrate first surface. The first metallizations, IC chip including bonding pads and first substrate surface are then encapsulated. Interconnection balls or pads are formed at substrate bonding locations on a substrate second surface, the interconnection pads or balls being electrically connected to corresponding first metallizations. The substrate and encapsulant are then cut along the periphery of each section to form the plurality of IC chip packages.

Claims

1. A method of forming a plurality of integrated circuit chip packages from a substrate, said method comprising:

providing a substrate having a plurality of sections, each of said sections having first metallizations formed on a first surface of said substrate;

mounting an integrated circuit chip in a corresponding one of each of said sections of said substrate;

electrically connecting each said integrated circuit chip to said first metallizations on said corresponding one of said sections;

encapsulating said integrated circuit chips, said first metallizations and said first surface of said substrate with a layer of encapsulant;

affixing a tape onto the plurality of encapsulated sections; and

,

cutting said layer of encapsulant and said substrate along a periphery of each of said sections with said tape affixed thereon to form said plurality of integrated circuit chip packages affixed to said tape.

2. The method of claim 1, wherein said encapsulant has a first surface, and wherein said tape is affixed to said first surface of said encapsulant.

3. The method of claim 2, wherein said tape is not severed through during said cutting of said encapsulant and said substrate.

4. The method of claim 3, further comprising electrically testing said packages while said packages are affixed to said tape.

5. The method of claim 2, further comprising electrically testing said packages while said packages are affixed to said tape.

6. The method of claim 1, wherein each of said sections has second metallizations formed on a second surface of said substrate opposite said first surface and electrically conductive paths extending through said substrate from said first metallizations to said second metallizations.

7. The method of claim 6, further comprising forming interconnection balls on said second surface of said insulating substrate at each of said sections, each of said interconnection balls being in electrical connection with one of said second metallizations.

8. The method of claim 1, further comprising providing a heat slug in said layer of encapsulant adjacent to each said integrated circuit chip.

9. The method of claim 1, wherein said cutting is done with a saw.

10. The method of claim 2, wherein said cutting is done with a saw.

11. The method of claim 1, wherein said tape is an adhesive tape.

12. The method of claim 11, wherein said tape is wafer sawing tape.

13. A method of forming a plurality of integrated circuit chip packages from a substrate, said method comprising the steps of:

providing a substrate having a plurality of sections, each said section having first metallizations formed on a first surface of said substrate;

mounting an integrated circuit chip in a corresponding one of each of said sections of said substrate;

electrically connecting each said integrated circuit chip to said first metallizations on said corresponding one of said sections;

encapsulating said integrated circuit chips, said first metallizations and said first surface of said substrate with a layer of encapsulant;

cutting said layer of encapsulant and said substrate along a periphery of each of said sections to form said plurality of integrated circuit chip packages; and

,

immobilizing said encapsulated sections during said cutting with a tape.