Electronic device workpiece processing apparatus and method of communicating signals within an electronic device workpiece processing apparatus

• US 6,229,322 B1
• Filed: 08/21/1998
• Issued: 05/08/2001
• Est. Priority Date: 08/21/1998
• Status: Expired due to Term

• Current Assignee: Micron Technology, Inc.
• Original Assignee: Micron Technology, Inc.
• Inventors: Hembree, David R.
• Primary Examiner(s): Nguyen, Vinh P.
• Application Number:
  US09/137,629
• Time in Patent Office: 991 Days
• Field of Search: 324/754, 324/755, 324/760, 324/765, 438/14, 438/17, 257/498, 439/66-72
• US Class Current: 340/584
• CPC Class Codes: H01L 21/67248 Temperature monitoring
• CPC Class Codes: H01L 21/67253 Process monitoring, e.g. flow or thickness monitoring

Abstract

The present invention includes an electronic device workpiece processing apparatus and method of communicating signals within an electronic device workpiece processing apparatus. One embodiment of an electronic device workpiece processing apparatus includes a chuck including a surface, an electrical coupling adjacent the surface, and electrical interconnect configured to connect with the electrical coupling of the chuck and conduct a signal within the chuck; an intermediate member having a first surface and a second surface and the intermediate member including: an electrical coupling adjacent the first surface and configured to couple with the electrical coupling of the chuck; an electrical coupling adjacent the second surface; and an electrical interconnect configured to connect the electrical coupling adjacent the first surface and the electrical coupling adjacent the second surface; and an electronic device workpiece configured to couple with the second surface of the intermediate member, the electronic device workpiece including a sensor and an electrical coupling configured to provide electrical connection of the sensor with the electrical coupling of the second surface of the intermediate member.

Claims

1. A method of communicating signals within an electronic device workpiece processing apparatus, the method comprising:

providing a workpiece holder;

providing an electronic device workpiece including a sensor;

electrically coupling the sensor of the electronic device workpiece with the workpiece holder;

sensing a process condition using the sensor;

generating a signal using the sensor responsive to the sensing; and

conducting the signal through the workpiece holder following the coupling.

2. The method according to claim 1, wherein the coupling comprises coupling circuitry of the electronic device workpiece with circuitry of the workpiece holder.

3. The method according to claim 1 further comprising breaking the coupling of the sensor and the workpiece holder.

4. The method according to claim 1 further comprising receiving the electronic device workpiece within the workpiece holder.

5. The method according to claim 1 wherein the coupling comprises coupling using an intermediate member.

6. The method according to claim 1 wherein the providing a workpiece holder comprises providing a chuck configured to receive an electronic device workpiece.

7. The method according to claim 1 wherein the sensing comprises sensing the process condition comprising temperature.

8. The method according to claim 1 wherein the sensing comprises sensing the process condition of the electronic device workpiece.

9. The method according to claim 1 further comprising supporting the electronic device workpiece using the workpiece holder.

10. The method according to claim 1 wherein the sensing comprises sensing the process condition regarding processing of electronic device workpieces within the electronic device workpiece processing apparatus.

11. The method according to claim 1 wherein the sensing comprises sensing the process condition at a location immediately adjacent the electronic device workpiece within the electronic device workpiece processing apparatus.