Communication devices, radio frequency identification devices, methods of forming a communication device, and methods of forming a radio frequency identification device

• US 6,229,441 B1
• Filed: 02/25/2000
• Issued: 05/08/2001
• Est. Priority Date: 11/13/1997
• Status: Expired due to Term

• Current Assignee: Round Rock Research LLC
• Original Assignee: Micron Technology, Inc.
• Inventors: Lake, Rickie C.
• Primary Examiner(s): MULLEN, THOMAS J
• Application Number:
  US09/513,297
• Time in Patent Office: 438 Days
• Field of Search: 340/572.1, 340/572.7, 340/572.8, 340/505, 340/10.1, 361/748, 361/760, 361/772, 361/774, 361/777, 361/779, 29/825, 29/829, 29/846, 29/854, 29/855, 257/679
• US Class Current: 340/572.1
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: H05K 3/4685 Manufacturing of cross-over conductors
• CPC Class Codes: Y10T 29/49171 with encapsulating

Abstract

The present invention provides electronic devices and methods of forming electronic devices. One embodiment of the present invention provides an electronic device which includes a substrate having a support surface; a first conductor over the support surface of the substrate, the first conductor including a predetermined portion which defines a first area and a second area of the support surface; at least one electrical component coupled with the first conductor; and a second conductor comprising a conductive adhesive, the second conductor being positioned over the support surface of the substrate and across the predetermined portion of the first conductor, the conductive adhesive being configured to electrically couple the first area with the second area.

Claims

1. A communication device comprising:

a substrate having a support surface;

a first conductor supported by the substrate; and

a second conductor comprising a conductive adhesive configured to electrically couple an area adjacent one side of the first conductor with another area adjacent an opposite side of the first conductor;

wherein the second conductor is substantially electrically insulated from the first conductor at a region intermediate the coupled areas.

2. The device according to claim 1 further comprising an electrical component coupled with at least one of the first conductor and the second conductor.

3. The device according to claim 2 wherein the electrical component comprises wireless communication circuitry.

4. The device according to claim 2 wherein the electrical component comprises radio frequency identification device communication circuitry.

5. The device according to claim 1 further comprising a dielectric layer intermediate the first conductor and the second conductor.

6. The device according to claim 1 wherein the first conductor comprises a polymer thick film.

7. A communication device comprising:

a substrate having a support surface;

a first conductor over the support surface;

a second conductor over the support surface and intersecting the first conductor to couple respective areas adjacent opposite sides of the first conductor and to define an intersection;

wherein the second conductor is substantially electrically insulated from the first conductor at the intersection of the first conductor and the second conductor; and

an electrical component comprising wireless communication circuitry coupled with at least one of the first conductor and the second conductor.

8. The device according to claim 7 wherein the electrical component comprises radio frequency identification device communication circuitry.

9. The device according to claim 7 wherein the second conductor comprises a conductive adhesive.

10. The device according to claim 7 further comprising a dielectric layer intermediate the first conductor and the second conductor.

11. The device according to claim 7 wherein the first conductor comprises a polymer thick film.

12. A radio frequency identification device comprising:

a substrate;

a conductor over the substrate;

an electrical component; and

conductive adhesive over the substrate and including a first portion over the conductor to couple respective areas adjacent opposite sides of the conductor and a second portion adapted to electrically couple with the electrical component.

13. The device according to claim 12 wherein the electrical component comprises radio frequency identification device communication circuitry.

14. The device according to claim 12 further comprising a dielectric layer intermediate the first conductor and the second conductor.

15. The device according to claim 12 wherein the first conductor comprises a polymer thick film.

16. A method of forming a communication device comprising:

providing a substrate;

providing a first conductor over the substrate;

providing a second conductor over the substrate configured to electrically couple respective areas adjacent opposite sides of the first conductor;

substantially electrically insulating the first conductor and the second conductor intermediate the areas; and

coupling an electrical component comprising wireless communication circuitry with at least one of the first conductor and the second conductor.

17. The method according to claim 16 wherein the insulating step comprises providing a dielectric layer intermediate the first conductor and the second conductor.

18. The method according to claim 16 wherein the step of providing the second conductor comprises forming using a conductive adhesive.

19. The method according to claim 16 wherein the coupling step comprises coupling an electrical component comprising radio frequency identification device communication circuitry.

20. The method according to claim 16 wherein the step of providing the first conductor comprises providing using a polymer thick film.

21. A method of forming a communication device comprising:

providing a substrate;

providing a conductor over the substrate;

providing a conductive adhesive over at least one portion of the substrate to electrically couple respective areas adjacent opposite sides of the conductor and the conductive adhesive being substantially electrically insulated from the conductor at a location intermediate the respective areas; and

coupling an electrical component with at least one of the conductor and the conductive adhesive.

22. The method according to claim 21 wherein the step of providing the conductive adhesive comprises providing a first portion of the conductive adhesive over the conductor to electrically couple the respective areas adjacent opposite sides of the conductor, and the coupling comprises coupling the electrical component with a second portion of the conductive adhesive.

23. The method according to claim 21 further comprising providing a dielectric layer intermediate the conductor and the conductive adhesive and intermediate the respective areas adjacent the opposite sides.

24. The method according to claim 21 wherein the coupling step comprises coupling an electrical component comprising wireless communication circuitry.

25. The method according to claim 21 wherein the coupling step comprises coupling an electrical component comprising radio frequency identification device communication circuitry.

26. The method according to claim 21 wherein the step of providing the conductor comprises providing using a polymer thick film.

27. A method of forming a radio frequency identification device comprising:

providing a substrate;

providing a conductor over the substrate;

providing conductive adhesive over the substrate including providing a first portion of conductive adhesive over the conductor to electrically couple respective areas adjacent opposite sides of the conductor, wherein the first portion of the conductive adhesive is substantially electrically insulated from the conductor intermediate the areas; and

coupling an electrical component comprising radio frequency identification device communication circuitry with a second portion of the conductive adhesive.

28. The method according to claim 27 further comprising providing a dielectric layer intermediate the conductor and the first portion of the conductive adhesive to substantially electrically insulate the conductor and the first portion of the conductive adhesive.

29. The method according to claim 27 wherein the step of providing the conductor comprises providing using a polymer thick film.

30. A communication device comprising:

a substrate having a support surface;

a first conductor supported by the substrate;

a second conductor configured to electrically couple an area adjacent one side of the first conductor with another area adjacent an opposite side of the first conductor;

wherein the second conductor is substantially electrically insulated from the first conductor at a region intermediate the coupled areas; and

an electrical component comprising wireless communication circuitry coupled with at least one of the first conductor and the second conductor.

31. The device of claim 30 wherein the wireless communication circuitry comprises radio frequency identification device circuitry.

32. A communication device comprising:

a substrate having a support surface;

a first conductor supported by the substrate;

a second conductor configured to electrically couple an area adjacent one side of the first conductor with another area adjacent an opposite side of the first conductor;

wherein the second conductor is substantially electrically insulated from the first conductor at a region intermediate the coupled areas; and

a dielectric layer intermediate the first conductor and the second conductor.

33. A communication device comprising:

a substrate having a support surface;

a first conductor comprising a polymer thick film supported by the substrate; and

a second conductor configured to electrically couple an area adjacent one side of the first conductor with another area adjacent an opposite side of the first conductor;

wherein the second conductor is substantially electrically insulated from the first conductor at a region intermediate the coupled areas.

34. A communication device comprising:

a substrate having a support surface;

a first conductor over the support surface;

a second conductor over the support surface and intersecting the first conductor to couple respective areas adjacent opposite sides of the first conductor and to define an intersection; and

a dielectric layer intermediate the first conductor and the second conductor configured to substantially electrically insulate the first conductor and the second conductor at the intersection of the first conductor and the second conductor.

35. A communication device comprising:

a substrate having a support surface;

a first conductor comprising a polymer thick film over the support surface; and

a second conductor over the support surface and intersecting the first conductor to couple respective areas adjacent opposite sides of the first conductor and to define an intersection;

wherein the second conductor is substantially electrically insulated from the first conductor at the intersection of the first conductor and the second conductor.

36. A method of forming a communication device comprising:

providing a substrate;

providing a first conductor over the substrate;

providing a second conductor over the substrate configured to electrically couple respective areas adjacent opposite sides of the first conductor; and

substantially electrically insulating the first conductor and the second conductor intermediate the areas, the insulating step comprising providing a dielectric layer intermediate the first conductor and the second conductor.

37. A method of forming a communication device comprising:

providing a substrate;

providing a first conductor comprising a polymer thick film over the substrate;

providing a second conductor over the substrate configured to electrically couple respective areas adjacent opposite sides of the first conductor; and

substantially electrically insulating the first conductor and the second conductor intermediate the areas.

38. A method of forming a communication device comprising:

providing a substrate;

providing a conductor over the substrate;

providing a conductive adhesive over at least one portion of the substrate to electrically couple respective areas adjacent opposite sides of the conductor; and

coupling an electrical component with at least one of the conductor and the conductive adhesive, wherein the step of providing the conductive adhesive comprises providing a first portion of the conductive adhesive over the conductor to electrically couple the respective areas adjacent opposite sides of the conductor, and the coupling comprises coupling the electrical component with a second portion of the conductive adhesive.

39. A method of forming a communication device comprising:

providing a substrate;

providing a conductor over the substrate;

providing a conductive adhesive over at least one portion of the substrate to electrically couple respective areas adjacent opposite sides of the conductor;

providing a dielectric layer intermediate the conductor and the conductive adhesive and intermediate the respective areas adjacent the opposite sides; and

coupling an electrical component with at least one of the conductor and the conductive adhesive.

40. A method of forming a communication device comprising:

providing a substrate;

providing a conductor over the substrate;

providing a conductive adhesive over at least one portion of the substrate to electrically couple respective areas adjacent opposite sides of the conductor; and

coupling an electrical component comprising wireless communication circuitry with at least one of the conductor and the conductive adhesive.

41. The method according to claim 40 wherein the coupling step comprises coupling an electrical component comprising radio frequency identification device communication circuitry.

42. A method of forming a communication device comprising:

providing a substrate;

providing a conductor comprising a polymer thick film over the substrate;

providing a conductive adhesive over at least one portion of the substrate to electrically couple respective areas adjacent opposite sides of the conductor; and

coupling an electrical component with at least one of the conductor and the conductive adhesive.