Method and device for mounting electronic component

• US 6,230,393 B1
• Filed: 07/02/1998
• Issued: 05/15/2001
• Est. Priority Date: 07/07/1997
• Status: Expired due to Fees

• Current Assignee: Panasonic Corporation (Panasonic Holdings Corporation)
• Original Assignee: Matsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
• Inventors: Hirano, Masato, Sakai, Yoshinori, Nakashima, Tateo
• Primary Examiner(s): Harrison, Jessica J.
• Assistant Examiner(s): NGUYEN, BINH AN DUC
• Application Number:
  US09/109,352
• Time in Patent Office: 1,048 Days
• Field of Search: 297/20, 297/40, 294/070.1, 294/070.4, 294/070.9, 294/071, 294/30, 297/01, 297/02, 297/03, 294/06, 297/05, 297/39, 297/71, 297/09, 297/83, 298/33, 298/34, 297/00, 296/50, 250/222.1, 250/215, 250/216
• US Class Current: 29/740
• CPC Class Codes: H05K 13/04 Mounting of components , e.g. of leadless components
• CPC Class Codes: H05K 13/041 having multiple pick-up tools
• CPC Class Codes: H05K 13/0413 with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
• CPC Class Codes: H05K 13/0815 Controlling of component placement on the substrate during or after manufacturing
• CPC Class Codes: Y10T 29/49004 including measuring or testing of device or component part
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49131 by utilizing optical sighting device
• CPC Class Codes: Y10T 29/49133 with component orienting
• CPC Class Codes: Y10T 29/49137 Different components
• CPC Class Codes: Y10T 29/49762 Center locating and shaping
• CPC Class Codes: Y10T 29/49764 with testing or indicating
• CPC Class Codes: Y10T 29/53 Means to assemble or disassemble
• CPC Class Codes: Y10T 29/53039 with control means energized in response to activator stimulated by condition sensor
• CPC Class Codes: Y10T 29/53087 with signal, scale, illuminator, or optical viewer
• CPC Class Codes: Y10T 29/53174 Means to fasten electrical component to wiring board, base, or substrate
• CPC Class Codes: Y10T 29/53178 Chip component
• CPC Class Codes: Y10T 29/53191 Means to apply vacuum directly to position or hold work part

Abstract

In a component mounting device in which a component is picked up and mounted on a circuit board by a suction nozzle, an amount of displacement between a center position of the suction nozzle 11 and that of the picked-up component 12 is measured, and when it is larger than a preliminarily determined value, a warning is generated indicating that the parts cassette 3 from which the component 12 has been fed is in abnormal condition, as well as the mounting action of the component 12 is stopped.

Claims

1. A component mounting device in which an electronic component fed from parts cassettes set in a component feeding unit is mounted on a circuit substrate, comprising:

at least one component suction nozzle for picking up the component from the parts cassettes and mounting said component on the circuit substrate which is moved to a mounting position;

a sensor for measuring an amount of displacement between said component suction nozzle and the component held by the component suction nozzle; and

means for informing that a particular parts cassette from which the component has been fed is in abnormal condition when the amount of displacement detected by said sensor is larger than a predetermined value which is obtained with reference to a pitch space between previously mounted components.

2. The component mounting device according to claim 1 wherein the amount of displacement between the component suction nozzle and the component held by the component suction nozzle is obtained by measuring a center position of the component suction nozzle and a center position of the component held by the component suction nozzle.

3. The component mounting device according to claim 1 wherein said predetermined value is a value such that the component suction nozzle does not collide with nearby previously mounted components.

4. A component mounting device in which an electronic component fed from parts cassettes set in a component feeding unit is mounted on a circuit substrate, comprising:

at least one component suction nozzle for picking up the component from the parts cassettes and mounting said component on the circuit substrate which is moved to a mounting position;

a sensor for measuring an amount of displacement between said component suction nozzle and the component held by the component suction nozzle; and

a mechanism for stopping the action of mounting the component in response to a determination that the amount of displacement is larger than a predetermined value which is obtained with reference to a pitch space between previously mounted components.

5. The component mounting device according to claim 4 wherein the amount of displacement between the component suction nozzle and the component held by the component suction nozzle is obtained by measuring a center position of the component suction nozzle and a center position of the component held by the component suction nozzle.

6. The component mounting device according to claim 4 wherein said predetermined value is a value such that the component suction nozzle does not collide with nearby previously mounted components.

7. A component mounting device in which an electronic component fed from parts cassettes set in a component feeding unit is mounted on a circuit substrate, comprising:

at least one component suction nozzle for picking up the component from the parts cassettes and mounting said component on the circuit substrate which is moved to a mounting position;

a sensor for measuring an amount of displacement between a center position of said component suction nozzle and a center position of the component held by the component suction nozzle;

an indicator for informing that a particular parts cassette from which the component has been fed is in abnormal condition when the amount of displacement detected by said sensor is larger than a predetermined value which is obtained with reference to a pitch space between previously mounted components; and

a mechanism for stopping the action of mounting the component in response to a determination that the amount of displacement is larger than said predetermined value.

8. The component mounting device according to claim 7 wherein said predetermined value is a value such that the component suction nozzle does not collide with nearby previously mounted components.

9. A component mounting device in which an electronic component fed from parts cassettes set in a component feeding unit is mounted on a circuit substrate, comprising:

at least one component suction nozzle for picking up the component from the parts cassettes and mounting said component on the circuit substrate which is moved to a mounting position;

a sensor for measuring an amount of displacement between a center position of said component suction nozzle and a center position of the component held by the component suction nozzle;

a detector which detects and informs that one of a particular one of said at least one component suction nozzle and a particular one of the parts cassette from which the component has been fed is in abnormal condition based on resultant data of measurement by said sensor, measurement of the displacement amount of the component being effected in a preparatory step before commencement of actual production; and

a mechanism for stopping the action of mounting the component in response to a determination that the displacement amount is larger than a predetermined value, which is obtained with reference to a pitch space between previously mounted components.

10. The component mounting device according to claim 9 wherein said predetermined value is a value such that the component suction nozzle does not collide with nearby previously mounted components.