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Method and device for mounting electronic component

  • US 6,230,393 B1
  • Filed: 07/02/1998
  • Issued: 05/15/2001
  • Est. Priority Date: 07/07/1997
  • Status: Expired due to Fees
First Claim
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1. A component mounting device in which an electronic component fed from parts cassettes set in a component feeding unit is mounted on a circuit substrate, comprising:

  • at least one component suction nozzle for picking up the component from the parts cassettes and mounting said component on the circuit substrate which is moved to a mounting position;

    a sensor for measuring an amount of displacement between said component suction nozzle and the component held by the component suction nozzle; and

    means for informing that a particular parts cassette from which the component has been fed is in abnormal condition when the amount of displacement detected by said sensor is larger than a predetermined value which is obtained with reference to a pitch space between previously mounted components.

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