Method for scanning a pulsed laser beam for surface ablation

• US 6,231,566 B1
• Filed: 08/10/1999
• Issued: 05/15/2001
• Est. Priority Date: 08/12/1998
• Status: Expired due to Fees

• Current Assignee: Katana Technologies GmbH
• Original Assignee: Katana Research, Inc.
• Inventors: Lai, Ming
• Primary Examiner(s): Cohen, Lee
• Assistant Examiner(s): FARAH, AHMED M
• Application Number:
  US09/371,968
• Time in Patent Office: 644 Days
• Field of Search: 606/2, 606/3-6, 606/10, 606/17, 606/18, 219/121.6, 219/121.73, 219/121.74, 219/121.75, 219/121.79, 219/121.8
• US Class Current: 606/5
• CPC Class Codes: A61F 2009/00872 Cornea
• CPC Class Codes: A61F 2009/00897 Scanning mechanisms or algorithms
• CPC Class Codes: A61F 9/00804 Refractive treatments
• CPC Class Codes: B23K 26/08 Devices involving relative movement between laser beam and workpiece
• CPC Class Codes: B23K 26/082 Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
• CPC Class Codes: B23K 26/388 Trepanning, i.e. boring by moving the beam spot about an axis
• CPC Class Codes: B23K 26/389 of fluid openings, e.g. nozzles, jets laser machining of inkjet nozzles B41J2/1634

Abstract

A fast and smooth scanning for achieving a uniform ablated surface without relying on any synchronization between the laser pulses and the scanner mirror positions. The scanning takes a series of close loops and the scanning speed on each loop is fine-tuned according to the perimeter of the loop. A uniform and close-packed pulse disposition along each loop can be achieved by multiple successive scans along the loop, while the consecutive pulses of a scan can be well separated. The scanning pattern is designed such that the energy distribution is uniform for every layer and the smoothness of the ablated surface remains substantially unchanged as the number of the layer increases.

Claims

1. A method for scanning a pulsed laser beam for uniform surface ablation comprising the steps of:

providing a laser source producing a pulsed laser beam having a predetermined laser wavelength, pulse energy, pulse duration, and a high repetition rate;

inserting an optical assembly into a laser beam path to obtain and control a small spot size of said laser beam on a target surface;

providing a two-dimensional scanner receiving said laser beam and scanning said laser beam on said target at a scanning rate;

providing a computer interfaced with said scanner to control the scanning of said laser beam in a programmable fashion so as to produce a scanning pattern of a series of smooth, close circular loops on a layer without synchronization between laser pulses and scanner positions and without predetermining pulse positions on the target;

controlling a scanning speed of said laser beam along each close circular loop so that consecutive laser pulses are uniformly separated in each scan on said target and that a plurality of successive scans are carried out on each close circular loop, wherein the scanning speed for a circular loop of a perimeter of P for a given pulse repetition rate K is mPK/(nm+1), where n is a number of laser pulses in each scan and m is a number of said plurality of successive scans on each close circular loop; and

scanning said laser beam smoothly from loop to loop and then from layer to layer according to said scanning pattern so that the smoothness of the ablated surface remains substantially unchanged as the number of layers increases.

2. A method as defined in claim 1 wherein said providing a laser source includes providing a laser source operated at a repetition rate ranging from about 0.2 kHz to about 10 kHz.

3. A method as defined in claim 1 wherein said providing a laser source includes providing a laser source operated in the spectral range of ultraviolet, visible, and infrared.

4. A method as defined in claim 1 wherein said providing a laser source includes providing a laser source operated in the spectrum of deep UV ranging from about 220 nm to about 180 nm.

5. A method as defined in claim 1 wherein said providing a laser source includes in particular providing a laser source operated at a wavelength of about 3 microns.

6. A method as defined in claim 1 wherein said providing a laser source includes providing a laser source operated at pulse energy in the range approximately from 40 uJ to 1000 uJ.

7. A method as defined in claim 1 wherein said providing a laser source includes providing a laser source operated at pulse duration in the range approximately from 0.1 ns to 10 ns.

8. A method as defined in claim 1 wherein said inserting an optical assembly includes inserting a focusing lens.

9. A method as defined in claim 1 wherein said providing a two-dimensional scanner includes providing a pair of Galvanometers.

10. A method as defined in claim 1 wherein said inserting an optical assembly includes inserting an optical assembly into said laser beam path to obtain and control a spot size ranging from 50 to 1000 microns on the target surface.

11. A method as defined in claim 1 wherein said selecting a scanning pattern includes selecting a scanning pattern that consists of a series of concentric rings on each layer.

12. A method as defined in claim 1 wherein two consecutive pulses are spaced from each other on the target by a distance to reduce an effect of a plume produced by one pulse on the ablation of the target by another pulse.

13. A method as defined in claim 1 wherein scanning of said laser beam from loop to loop is spirally inward and outward alternately.

14. A method as defined in claim 1 wherein scanning of said laser beam layer by layer displaces peaks and valleys ablated on the target from one layer to another successive layer so as to control the radial average over the layers.

15. The method as in claim 1, wherein the scanning rate in scanning said laser beam is higher than said high repetition rate.

16. The method as in claim 1, further comprising:

maintaining the scanning speed at a constant for scanning in different loops; and

adjusting the pulse repetition rate in response to a change in the loop perimeter when scanning the laser beam from one loop to another loop.

17. The method as in claim 1, further comprising:

maintaining the pulse repetition rate at a constant for scanning in different loops; and

adjusting the scanning speed in response to a change in the loop perimeter when scanning the laser beam from one loop to another loop.

18. An apparatus for scanning a pulsed laser beam for uniform surface ablation comprising:

A laser source producing a pulsed laser beam having a predetermined laser wavelength, pulse energy, pulse duration, and a high repetition rate;

An optical assembly inserted into a laser beam path to obtain and control a small spot size of said laser beam on a target surface;

A two-dimensional scanner receiving said laser beam and scanning said laser beam on said target at a scanning rate; and

A computer interfaced with said scanner to control scanning of said laser beam in a programmable fashion so as to produce a scanning pattern of a series of smooth, close circular loops of varying perimeters on a layer without synchronization between laser pulses and scanner positions and without predetermining pulse positions on the target,

wherein said computer is programmed to control said scanner so that a plurality of successive scans are carried out on each close circular loop, and the scanning speed for a circular loop of a perimeter of P for a given pulse repetition rate K of said laser is mPK/(nm+1), where n is a number of laser pulses in each scan and m is a number of said plurality of successive scans on each close circular loop.

19. The apparatus as in claim 18, wherein said computer is operable to control the scanning of said laser beam layer by layer to displace peaks and valleys ablated on the target from one layer to another successive layer so as to control a radial average over the layers.

20. The apparatus as in claim 18, wherein said pulse repetition rate K is maintained at a constant, and wherein said computer is programmed to control said scanning speed when switching from scanning in one loop to scanning in another loop.

21. The apparatus as in claim 18, wherein the scanning rate in scanning said laser beam is higher than said high repetition rate.