×

Method and apparatus for monitoring wafer characteristics and/or semiconductor processing consistency using wafer charge distribution measurements

  • US 6,232,134 B1
  • Filed: 01/24/2000
  • Issued: 05/15/2001
  • Est. Priority Date: 01/24/2000
  • Status: Expired due to Fees
First Claim
Patent Images

1. A method for processing a substrate, the method comprising the steps of:

  • collecting plasma charge data from a surface of the substrate; and

    using the plasma charge data to determine etching characteristics of a given process step.

View all claims
  • 4 Assignments
Timeline View
Assignment View
    ×
    ×