×

Pressure sensitive conductive adhesive having hot-melt properties and biomedical electrodes using same

  • US 6,232,366 B1
  • Filed: 06/09/1999
  • Issued: 05/15/2001
  • Est. Priority Date: 06/09/1999
  • Status: Expired due to Term
First Claim
Patent Images

1. A skin-compatible, hot-melt processible, pressure sensitive adhesive, comprising:

  • between about 30 to 45 parts by weight of a copolymer comprised of between about 30 to 45 parts by weight of an (meth)acrylate ester monomer having C4-C20 alkyl chains, and between about 55 to 70 parts by weight of an acidic comonomer;

    between about 0 to 35 parts by weight of a hydrophilic plasticizer;

    between about 20 to 40 parts by weight of water, between about 0 to 3 parts by weight of a water soluble salt, between about 10 to 20 parts by weight of a surfactant, and between about 0.5 to 10 parts by weight of a polymer having amine functionality.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×