Method and apparatus for amplifying electrical test signals from a micromechanical device

• US 6,232,790 B1
• Filed: 03/08/1999
• Issued: 05/15/2001
• Est. Priority Date: 03/08/1999
• Status: Expired due to Fees

• Current Assignee: Honeywell Incorporated (Honeywell International Inc.)
• Original Assignee: Honeywell Incorporated (Honeywell International Inc.)
• Inventors: Deadwyler, Murden K., Bryan, Elizabeth Ruth, Green, David N., Murphy, Hugh Joseph, Heiertz, James L.
• Primary Examiner(s): Metjahic, Safet
• Assistant Examiner(s): Kobert, Russell M.
• Application Number:
  US09/264,836
• Time in Patent Office: 799 Days
• Field of Search: 324/754-758, 324/765
• US Class Current: 324/754.07
• CPC Class Codes: B81C 99/005 Test apparatus
• CPC Class Codes: G01R 1/07307 with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card

Abstract

An apparatus and method is provided for testing performance characteristics of a MEMs device. The apparatus includes a test probe that is electrically connected to a mechanical member of the MEMs device for receiving electrical data signals from the MEMs device that are indicative of the movement of the mechanical member due to external excitation . The apparatus also includes communications or transmitting the signals from the test probe and an analyzer for receiving the signals and for analyzing the signals to determine the performance characteristics of the MEMs device. The apparatus a so includes an amplifier connected between the test probe and the communications. The amplifier is placed in close proximity to the test probe such at it amplifies the signals prior to transmission of the signals by the communications. As such, the electrical data signals are amplified before sufficient noise is introduced into the signals to reduce their signal to noise ratio to less than a predetermined level. By amplifying the signals prior to the introduction of significant noise, the signals, which may have relatively small amplitude, are not obscured by the noise.

Claims

1. An apparatus for testing performance characteristics of a microelectromechanical device, said microelectromechanical device having movable mechanical members, wherein said apparatus comprises:

at least one test probe having one end in operable electrical communication with at least one of the movable mechanical members of the microelectromechanical device for receiving electrical signals indicative of the movement of the movable mechanical member;

an analyzer for receiving the electrical signals from said test probe at a location remote from the microelectromechanical device, wherein said analyzer analyzes the electrical signals to determine the performance characteristics of the microelectromechanical device;

communication means for transmitting the electrical signals from the test probe to the analyzer; and

an amplifier in operable electrical communication with said test probe and said communication means, wherein said amplifier is in close proximity to said test probe such that said amplifier amplifies the electrical signals prior to transmission of the electrical signals by said communication means such that the electrical signals are amplified before sufficient noise has been introduced into the electrical signals to reduce a signal to noise ratio of the electrical signals to less than 10 decibels.

2. An apparatus according to claim 1, wherein said communication means comprises an electrically conductive cable having a shielding layer that prevents the introduction of electrical noise into the electrical signal.

3. An apparatus according to claim 1, wherein said amplifier is in direct electrical connection with said test probe so as to minimize the introduction of electrical noise into the electrical signals received by said test probe.

4. An apparatus according to claim 1, wherein said amplifier is located on said test probe in close proximity to the end of the test probe that is in electrical communication with the mechanical member so as to minimize the introduction of electrical noise into the electrical signals received by said test probe.

5. An apparatus according to claim 1 further comprising a probe station resistant to electromagnetic fields, wherein said microelectromechanical device, test probe, and amplifier are located inside said probe station and are substantially shielded from the affects of electromagnetic fields.

6. An apparatus according to claim 1, further comprising an electromagnetic field resistant case for encasing said amplifier such that said amplifier is substantially shielded from the effects of electromagnetic fields.

7. An apparatus according to claim 6, wherein said electromagnetic field resistant case comprises pinout leads for connecting said amplifier to said test probe and said communication means, wherein respective pinout leads are wirebonded to input and output terminals of said amplifier such that electrical noise is not introduced into said electrical signals.

8. An apparatus according to claim 1, further comprising at least one excitation probe operably electrically connected to at least one of said mechanical members for providing an electrical signal to said mechanical member, thereby causing the mechanical member to move and generate electrical output.

9. An apparatus according to claim 8, wherein said analyzer determines the performance characteristics of said mechanical member based on the movement of the mechanical member caused by the electrical excitation of the mechanical member by said excitation probe.

10. An apparatus according to claim 9, wherein said amplifier further uses the electrical signals received from said test probe as feedback and adjusts the electrical signals provided by said excitation probe to the mechanical member of the microelectromechanical device based on the electrical signals received from said test probe.

11. An apparatus according to claim 8, wherein said excitation probe provides an electrical signal to said mechanical member that causes said mechanical member to move a distance in the range of 1 to 20 micrometers (zero to peak).

12. An apparatus according to claim 11, wherein said test probe detects an electrical signal in the range of 0.4 to 1000 microvolts in response to the movement of said mechanical member.

13. An apparatus according to claim 12, wherein said amplifier is a charge amplifier.

14. An apparatus for determining performance characteristics of a plurality of microelectromechanical devices located on a common wafer, wherein each microelectromechanical device has at least one movable mechanical member, wherein said apparatus comprises:

at least one test probe having one end in operable electrical communication with an output of at least one of the movable mechanical members of at least one of the microelectromechanical devices for receiving electrical signals indicative of the movement of the movable mechanical member;

an excitation probe connected to an input of at least one of the movable mechanical members of at least one of the microelectromechanical devices, wherein said excitation probe provides an electrical signal to the movable mechanical member, thereby causing the movable mechanical member to move and generate electrical output;

an analyzer for receiving the electrical signals from said test probe at a location remote from the microelectromechanical device, wherein said analyzer analyzes the electrical signals to determine the performance characteristics of the microelectromechanical device;

communication means for transmitting the electrical signals from the test probe to the analyzer; and

an amplifier in operable electrical communication with said test probe and said communication means, wherein said amplifier is in close proximity to said test probe such that said amplifier amplifies the electrical signals prior to transmission of the electrical signals by said communication means such that the electrical signals are amplified before sufficient noise has been introduced into the electrical signals to reduce a signal to noise ratio of the electrical signals to less than 10 decibels, and wherein said analyzer determines the performance characteristics of the microelectromechanical device without initially separating the microelectromechanical device from the wafer.

15. An apparatus according to claim 14, wherein an excitation probe and a test probe are connected to at least one of the movable mechanical members of each of the plurality of the microelectromechanical devices at the same time, wherein said amplifier separately amplifies the electrical signals received from each of said test probes such that the electrical signals are amplified before sufficient noise has been introduced into the electrical signals to reduce the signal to noise ratio to less than 10 decibels, and wherein said analyzer analyzes the electrical signals at the remote location to determine the performance characteristics of each microelectromechanical device without initially separating the microelectromechanical devices from the wafer.