RF waveguide signal transition apparatus

• US 6,232,849 B1
• Filed: 04/30/1998
• Issued: 05/15/2001
• Est. Priority Date: 07/23/1992
• Status: Expired due to Fees

• Current Assignee: Channel Master LLC (CommScope Holding Company, Inc.)
• Original Assignee: Channel Master LLC (CommScope Holding Company, Inc.)
• Inventors: Baird, Andrew Patrick, Flynn, Stephen John
• Primary Examiner(s): LEE, BENNY T
• Application Number:
  US09/069,911
• Time in Patent Office: 1,111 Days
• Field of Search: 333/26, 333/33
• US Class Current: 333/26
• CPC Class Codes: H01P 5/107 Hollow-waveguide/strip-line transitions
• CPC Class Codes: H05K 1/0222 for shielding around a single via or around a group of vias, e.g. coaxial vias or vias surrounded by a grounded via fence
• CPC Class Codes: H05K 1/024 Dielectric details, e.g. changing the dielectric material around a transmission line
• CPC Class Codes: H05K 1/0251 related to vias or transitions between vias and transmission lines
• CPC Class Codes: H05K 2201/015 Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
• CPC Class Codes: H05K 2201/09509 Blind vias, i.e. vias having one side closed
• CPC Class Codes: H05K 2201/09618 Via fence, i.e. one-dimensional array of vias
• CPC Class Codes: H05K 2201/09809 Coaxial layout reduction of cross-talk, noise or interference by printed shielding conductors for shielding around a single via or around a group of vias H05K1/0222
• CPC Class Codes: H05K 2201/10356 Cables
• CPC Class Codes: H05K 3/429 Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
• CPC Class Codes: H05K 3/4623 the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards H05K3/462 takes precedence
• CPC Class Codes: H05K 3/4688 Composite multilayer circuits, i.e. comprising insulating layers having different properties having a special base or central core H05K3/4602

Abstract

An RF waveguide signal transition apparatus for minimizing leakage at RF frequency is described which consists of providing a plurality of plated through-holes (16) of blind holes in a circuit board (10). The plated holes (16) are disposed on the circumference of a circle around the RF waveguide to microstrip transition of probe (14) and each of the plated holes (16) is connected to a ground plane (24). The size of distribution of the plated holes provides a barrier to signal leakage at RF frequencies in the range 10.95-11.7 GHz and they also provide a transition impedance similar to the 50 ohm characteristic impedance providing satisfactory matching and minimizing leakage into the board. The apparatus can also be used to minimise leakage from microstrip to microstrip transitions passing through the circuit board.

Claims

1. A transition for minimizing the leakage of electromagnetic energy from a signal passing between microstrip circuits, comprising:

a circuit board including a circuit board ground plane;

a first microstrip circuit located on one side of said circuit board for carrying said signal, said first microstrip circuit comprising a first microstrip conductor separated from a first ground plane by a first insulating layer;

a second microstrip circuit located on a side of the circuit board opposite to said one side for receiving said signal, said second microstrip circuit comprising a second microstrip conductor separated from a second ground plane by a second insulating layer;

signal conducting means passing through said circuit board and connected to first and second microstrip circuit conductors of the first and second microstrip circuits, respectively; and

a plurality of plated holes disposed in said circuit board and surrounding said signal conducting means, said plurality of plated holes being coupled to said first, second, and circuit-board ground plane to minimize leakage of electromagnetic energy from said signal conducting means to said board as said signal passes through said board between the first and second microstrip circuits.

2. For use with a microstrip circuit comprising a signal conductor separated from a ground plane by a first electrically insulating layer, a method of minimizing the leakage of signals in a waveguide transition to the microstrip circuit, comprising the steps of:

providing a circuit board, separate from the microstrip circuit, the circuit board being supported between the microstrip circuit and a waveguide;

extending a probe from the signal conductor of the microstrip circuit through the circuit board and a waveguide wall into the waveguide; and

disposing a plurality of holes at least in the circuit board so as to surround the probe, respectively plating each of the plurality of holes with a corresponding conductive material, and connecting the plurality of plated holes to the ground plane.

3. A method as claimed in claim 2, wherein the step of disposing a plurality of holes in the circuit board further comprises extending said plurality of holes through both the microstrip circuit and the circuit board.

4. A method as claimed in claim 2 wherein the step of disposing a plurality of holes in the circuit board so as to surround the probe includes the further step of extending said plurality of holes only through the circuit board.

5. A waveguide to microstrip circuit transition, comprising:

a microstrip circuit comprising a signal conductor separated from a ground plane by a first electrically insulating layer;

a circuit board defining a second insulating layer disposed between a waveguide and the ground plane of the microstrip circuit;

a waveguide probe extending from the waveguide and passing through the circuit board and microstrip circuit, the probe being coupled to the signal conductor of the microstrip circuit; and

a plurality of plated holes disposed at least in the circuit board and surrounding the waveguide probe, the plurality of plated holes being coupled to the ground plane and being arranged to reduce leakage of electromagnetic energy propagating on the waveguide probe.

6. A waveguide to microstrip transition as claimed in claim 5, wherein the plurality of plated holes are arranged to match an electrical impedance of the transition to the characteristic electrical impedance associated with the signal conductor.

7. A waveguide to microstrip circuit transition as claimed in claim 5, wherein the plurality of plated holes are plated through-holes extending through both the circuit board and the microstrip circuit.