Spot cooling evaporator cooling system for integrated circuit chip modules

• US 6,233,960 B1
• Filed: 10/12/1999
• Issued: 05/22/2001
• Est. Priority Date: 10/12/1999
• Status: Expired due to Fees

• Current Assignee: International Business Machines Corporation
• Original Assignee: International Business Machines Corporation
• Inventors: Singh, Prabjit, Schmidt, Roger R., Mahaney, Howard Victor Jr., Kang, Sukhvinder
• Primary Examiner(s): Doerrler, William
• Assistant Examiner(s): SHULMAN, MARK S
• Application Number:
  US09/417,187
• Time in Patent Office: 588 Days
• Field of Search: 622/592, 62/32, 62/37
• US Class Current: 62/259.2
• CPC Class Codes: H01L 23/445 the fluid being a liquefied gas, e.g. in a cryogenic vessel
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A cooling assembly for an integrated circuit chip module wherein a spot cooling evaporator is mounted on the hat of the module in a position opposite the integrated chip within the module.

Claims

1. A cooling system for an integrated circuit chip module mounted on a printed circuit board substrate comprising:

an integrated circuit chip enclosed within a module and in thermal communication with the inside surface of the hat of said module; and

,

a cooling evaporator attached to the top of said hat, and having a thermal interface in thermal communication with the outside surface of the top of said hat and positioned in a manner to focus its thermal interface on the top side of the hat opposite the position of the integrated circuit chip within the module.

2. The cooling system of claim 1 wherein the cooling evaporator is sized and positioned in a manner corresponding to the size and position of the integrated circuit chip within said module.

3. The cooling system of claim 1 wherein the module is enclosed within an insulated housing having its base attached to said printed circuit board substrate surrounding the outer perimeter of said module.

4. The cooling system of claim 3 wherein the hat of said module extends beyond the perimeter of the interface between the evaporator and the module hat so that the evaporator is not in direct thermal communication with the perimeter of the hat.

5. The cooling system of claim 1 wherein the module hat is a material having a thermal conductivity ranging from about 180 to about 400 W/m. °

K.

6. The cooling system of claim 5 wherein the module hat is a material having a thermal conductivity ranging from about 1 to about 5 W/m. °

K in the xy direction, and 500 to 1000 W/m. °

K in the z direction.

7. The cooling system of claim 5 wherein the module hat is a material selected from the group consisting of copper, copper tungsten, and the like.

8. The cooling system of claim 6 wherein the module hat is made from an anisotropic graphite epoxy material.