Power converter connector assembly
First Claim
1. An apparatus for providing a power connection between a power converter and a load comprising:
- a connector for physically interfacing with a power output terminal on the power converter to establish a removable electrical connection to the power output terminal;
an output termination for making an electrical connection to the load;
a component interface subassembly comprising an electronic component connected in series between the connector and the output termination to restrict the current flow in the power connection to one direction between said connector and said termination; and
an enclosure receiving the component interface subassembly and the connector wherein the apparatus is adapted to deliver power from the output terminal of the power converter to the load.
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Accused Products
Abstract
The invention features an apparatus, which allows a power converter module to be easily connected and disconnected from an external device and includes an electronic component. The apparatus includes a connector for making an electrical connection to a terminal on the power converter, a component interface subassembly which provides for making connections to the electronic component and an enclosure which encloses the electronic component and the connector. The component interface subassembly may include a thermally conductive plate which provides a low thermal impedance path for removing heat from the electronic component. The electronic component may be an OR diode or a MOSFET which may be connected in series between the power converter output and the external device. The apparatus may be attached to a heat sink for efficient removal of heat.
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Citations
49 Claims
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1. An apparatus for providing a power connection between a power converter and a load comprising:
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a connector for physically interfacing with a power output terminal on the power converter to establish a removable electrical connection to the power output terminal;
an output termination for making an electrical connection to the load;
a component interface subassembly comprising an electronic component connected in series between the connector and the output termination to restrict the current flow in the power connection to one direction between said connector and said termination; and
an enclosure receiving the component interface subassembly and the connector wherein the apparatus is adapted to deliver power from the output terminal of the power converter to the load. - View Dependent Claims (2, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44)
a thermally conductive plate comprising top and bottom surfaces;
a first insulation layer comprising top and bottom surfaces, wherein the bottom surface is in contact with the top surface of the thermally conductive plate;
a metal layer comprising top and bottom surfaces, wherein the bottom surface is in contact with the top surface of the first insulation layer;
an insulating plate comprising top and bottom surfaces, wherein the bottom surface is in contact with the top surface of the metal layer;
a metal plate comprising top and bottom surfaces, wherein the bottom surface is in contact with the top surface of the insulating plate;
a first ceramic substrate comprising top and bottom surfaces, the bottom surface comprising a metallic film which is bonded to the top surface of the metal layer, and the top surface comprising metallic pads covered with a metallic film; and
a first component mounted on the top of the first ceramic substrate surface, the first component having terminations which are connected to the pads.
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31. The apparatus of claim 30 wherein the component interface subassembly further comprises:
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a first conductive strap connecting a first pad on the top surface of the first ceramic substrate with the top surface of the metal layer;
a first conductive busbar comprising a first end attached to a second pad on the first ceramic substrate; and
a second conductive busbar comprising a first end attached to the top surface of the metal layer.
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32. The apparatus of claim 31 wherein the first conductive strap comprises copper.
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33. The apparatus of claim 31 wherein the first and second conductive busbars comprise copper.
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34. The apparatus of claim 31 wherein the first and second conductive busbars are adapted to provide a spring type action.
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35. The apparatus of claim 34 wherein said spring type action provides for movement of the component interface subassembly relative to the enclosure.
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36. The apparatus of claim 35 wherein the apparatus is adapted to have the bottom surface of the thermally conductive plate disposed for mating with an external surface, the external surface having a predetermined spatial relationship with the terminal.
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37. The apparatus of claim 31 wherein the component interface subassembly further comprises:
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a second ceramic substrate comprising top and bottom surfaces, the bottom surface comprising a continuous metallic film, the film providing a bond of the bottom ceramic substrate surface to the top surface of the metal layer, and the top surface comprising pads covered with a metallic film; and
a second component mounted on the top surface of the second ceramic substrate, the second component having terminations which are connected to the pads.
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38. The apparatus of claim 37 wherein the component interface subassembly further comprises:
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a second conductive strap for connecting a first pad on the top surface of the second ceramic substrate with the top surface of the metal layer; and
a second end on said first busbar for connecting to a second pad on said second ceramic substrate.
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39. The apparatus of claim 37 wherein said second component comprises a diode and wherein a first pad on said second ceramic substrate is connected to the cathode of the diode and a second pad on said second ceramic substrate is connected to the anode of the diode.
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40. The apparatus of claim 37 wherein said second component comprises a semiconductor control device.
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41. The apparatus of claim 30 wherein said first component comprises a diode and wherein a first pad on said first ceramic substrate is connected to the cathode of the diode and a second pad on said first ceramic substrate is connected to the anode of the diode.
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42. The apparatus of claim 30 wherein said first component comprises a MOSFET.
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43. The apparatus of claim 30 wherein the metal layer comprises a laminate comprising a layer of silver, a layer of copper and a layer of aluminum.
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44. The apparatus of claim 30 wherein the metallic film on the surface of the first ceramic substrate comprises a layer of copper in contact with the ceramic substrate and a layer of gold in contact with a surface of the copper layer opposite the ceramic substrate.
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3. An apparatus for providing a power connection between a power converter and a load comprising:
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a connector for physically interfacing with a power output terminal on the power converter to establish a removable electrical connection to the terminal;
an output termination for connection to the load;
a component interface subassembly comprising a power-dissipating electronic component electrically connected to the connector and the output termination, and a heat conductor thermally connected to the power-dissipating component and providing a low thermal impedance path between the electronic component and an external surface of the apparatus; and
wherein the electronic component is adapted to be electrically connected to the power converter and the load through the connector and output termination and thermally connected to a heat sink through the heat conductor. - View Dependent Claims (4, 5, 6, 7)
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8. An apparatus for electrically connecting a first device and a second device comprising:
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a circuit board having an output termination for making an electrical connection to the second device and a connector for physically interfacing with an output terminal of the first device to establish a removable electrical connection to the output terminal;
a component interface subassembly comprising a thermally conductive substrate and a power-dissipating electronic component mounted on the substrate, the substrate being mechanically separate from the circuit board; and
an enclosure receiving the component interface subassembly and the circuit board. - View Dependent Claims (9, 10, 11, 12, 45, 46, 47, 48, 49)
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Specification