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Method and apparatus for concurrent pad conditioning and wafer buff in chemical mechanical polishing

  • US 6,234,883 B1
  • Filed: 10/01/1997
  • Issued: 05/22/2001
  • Est. Priority Date: 10/01/1997
  • Status: Expired due to Term
First Claim
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1. A device for concurrently pad conditioning and wafer buffing at a single station on a chemical mechanical polishing apparatus, comprising:

  • a positioning mechanism for positioning said device within said apparatus;

    a body connected to a distal end of said positioning mechanism, said body having upper and lower surfaces;

    a buffing pad on one of the upper and lower surfaces of said body; and

    a pad conditioner on the other of the upper and lower surfaces of said body.

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