Method and apparatus for concurrent pad conditioning and wafer buff in chemical mechanical polishing

• US 6,234,883 B1
• Filed: 10/01/1997
• Issued: 05/22/2001
• Est. Priority Date: 10/01/1997
• Status: Expired due to Term

• Current Assignee: Bell Semiconductor, LLC (Hilco Inc. (d/b/a Hilco Global)), Integrated Processing Equipment Corporation
• Original Assignee: LSI Logic Corporation (Broadcom, Inc.)
• Inventors: Holland, Karey L., Berman, Michael J.
• Primary Examiner(s): Hail, III, Joseph J.
• Assistant Examiner(s): NGUYEN, DUNG V
• Application Number:
  US08/942,006
• Time in Patent Office: 1,329 Days
• Field of Search: 451/57, 451/65, 451/56, 451/285, 451/286, 451/287, 451/288, 451/290, 451/443, 451/444
• US Class Current: 451/286
• CPC Class Codes: B24B 53/017 Devices or means for dressing, cleaning or otherwise conditioning lapping tools

Abstract

Provided are an apparatus and method for concurrently pad conditioning and wafer buffing on a single station of a CMP apparatus. In a preferred embodiment, the apparatus includes a two-sided conditioning/buffing device having a pad conditioner on one side and a buff pad on the other. In operation, the device is inserted between a polishing pad and a polished wafer following CMP. A differential velocity is developed between the pad conditioner and the polishing pad, for example, by contacting the pad conditioner with a rotating or orbiting polishing pad. Concurrently, the polished wafer is contacted with the buff pad on the other side of the device, and a differential velocity is developed between the two, for example, by rotating the wafer, so that the wafer is buffed. Once conditioning and buffing are completed, the finished wafer is removed from the buffing pad and stored or removed from the CMP apparatus, and the conditioning/buffing device is removed and positioned away from the polishing pad, which is now ready to receive and polish another wafer. This concurrent conditioning and buffing allows all stations on a CMP apparatus to be used for polishing, and improves the through-put of the apparatus.

Claims

1. A device for concurrently pad conditioning and wafer buffing at a single station on a chemical mechanical polishing apparatus, comprising:

a positioning mechanism for positioning said device within said apparatus;

a body connected to a distal end of said positioning mechanism, said body having upper and lower surfaces;

a buffing pad on one of the upper and lower surfaces of said body; and

a pad conditioner on the other of the upper and lower surfaces of said body.

2. The device of claim 1 further comprising at least one transport line for at least one of conditioning and buffing supplies.

3. The device of claim 1 wherein said positioning mechanism comprises an articulated arm assembly.

4. The device of claim 3 wherein said arm assembly is capable of providing a force to said body.

5. The device of claim 4 wherein said force is about 2 to 5 psi.

6. The device of claim 1 wherein said pad conditioner comprises a diamond grit.

7. The device of claim 1 wherein said pad conditioner comprises an abrasive pivotable arm.

8. The device of claim 1 wherein said pad conditioner comprises an abrasive rotatable disk.

9. The device of claim 1 wherein said buff pad comprises polyurethane impregnated felt.

10. A chemical mechanical polishing apparatus, comprising:

a wafer carrier;

one or more polishing pads, each polishing pad at a polishing station; and

a device for concurrently pad conditioning and wafer buffing at a single station on said chemical mechanical polishing apparatus, said device having,

a positioning mechanism for positioning said device within said apparatus;

a body connected to a distal end of said positioning mechanism, said body having upper and lower surfaces;

a buffing pad on the upper surface of said body; and

a pad conditioner on the lower surface of said body.

11. The device of claim 10 wherein said apparatus comprises a plurality of said devices.

12. A chemical mechanical polishing apparatus module, comprising:

one or more polishing pads, each polishing pad at a polishing station; and

a device for concurrently pad conditioning and wafer buffing at a single station on said chemical mechanical polishing apparatus module, said device having,

a positioning mechanism for positioning said device relative to said apparatus module;

a body connected to a distal end of said positioning mechanism, said body having upper and lower surfaces;

a buffing pad on one of the upper and lower surfaces of said body; and

a pad conditioner on the other of the upper and lower surfaces of said body.

13. A device for concurrently performing pad conditioning and a wafer polishing operation at a single station on a chemical mechanical polishing apparatus, comprising:

a positioning mechanism for positioning said device within said apparatus;

a body connected to a distal end of said positioning mechanism, said body having upper and lower surfaces;

a polishing pad on one of the upper or lower surfaces of said body; and

a pad conditioner on the other surface of said body.

14. A means for concurrently pad conditioning and wafer buffing at a single station on a chemical mechanical polishing apparatus, comprising:

buffing means on a first side of a support means;

pad conditioning means on a second side of said support means; and

means for positioning said support means between a semiconductor wafer and polishing pad at a polishing station, said support means and positioning means capable of concurrently pad conditioning and wafer buffing at said polishing station.