Method of mass producing and packaging integrated optical subsystems

• US 6,235,141 B1
• Filed: 01/08/1999
• Issued: 05/22/2001
• Est. Priority Date: 09/27/1996
• Status: Expired due to Term

• Current Assignee: FLIR Systems Trading Belgium BVBA
• Original Assignee: Digital Optics Corp. (Adeia Inc.)
• Inventors: Kathman, Alan D., Feldman, Michael R.
• Primary Examiner(s): MAYES, MELVIN C
• Application Number:
  US09/227,531
• Time in Patent Office: 865 Days
• Field of Search: 257/98, 369/112, 369/44.12, 369/103, 369/109, 385/91, 385/89, 385/88, 385/37, 385/14, 156/297, 156/298, 156/299, 156/300, 156/64, 156/250, 156/291
• US Class Current: 156/250
• CPC Class Codes: B29C 65/483 Reactive adhesives, e.g. chemically curing adhesives
• CPC Class Codes: B29C 65/4845 Radiation curing adhesives, e.g. UV light curing adhesives
• CPC Class Codes: B29C 66/1122 Single lap to lap joints, i.e. overlap joints B29C66/45, B29C66/472, B29C66/52272 take precedence
• CPC Class Codes: B29C 66/342 Preventing air-inclusions
• CPC Class Codes: B29C 66/452 the article having a disc form, e.g. making CDs or DVDs
• CPC Class Codes: B29C 66/71 characterised by the composition of the plastics material of the parts to be joined welding bar compositions B29C65/125
• CPC Class Codes: B29K 2033/08 Polymers of acrylic acid esters, e.g. PMA, i.e. polymethylacrylate
• CPC Class Codes: B29K 2033/12 Polymers of methacrylic acid esters, e.g. PMMA, i.e. polymethylmethacrylate
• CPC Class Codes: B29K 2069/00 Use of PC, i.e. polycarbonates or derivatives thereof, as moulding material
• CPC Class Codes: G02B 2006/12102 Lens
• CPC Class Codes: G02B 2006/12107 Grating
• CPC Class Codes: G02B 6/4206 Optical features G02B6/4207, G02B6/421 take precedence
• CPC Class Codes: G02B 6/4214 the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device G02B6/4246 takes precedence
• CPC Class Codes: G02B 6/4224 using visual alignment markings, e.g. index methods
• CPC Class Codes: G02B 6/4231 with intermediate elements, e.g. rods and balls, between the elements
• CPC Class Codes: G02B 6/4232 using the surface tension of fluid solder to align the elements, e.g. solder bump techniques flip-chip mounting techniques in assembly of semiconductor devices H01L24/81
• CPC Class Codes: G02B 6/4238 Soldering
• CPC Class Codes: G02B 6/4239 Adhesive bonding; Encapsulation with polymer material
• CPC Class Codes: G11B 7/123 Integrated head arrangements, e.g. with source and detectors mounted on the same substrate
• CPC Class Codes: G11B 7/1353 Diffractive elements, e.g. holograms or gratings diffraction gratings per se G02B5/18; holograms per se G02B5/32; grating systems G02B27/44
• CPC Class Codes: G11B 7/1362 : Mirrors
• CPC Class Codes: G11B 7/1372 : Lenses
• CPC Class Codes: G11B 7/22 : Apparatus or processes for the manufacture of optical heads, e.g. assembly
• CPC Class Codes: H01L 25/167 : comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 27/14618 : Containers
• CPC Class Codes: H01L 27/14625 : Optical elements or arrangements associated with the device
• CPC Class Codes: H01L 27/14627 : Microlenses
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 : Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01S 3/005 : Optical devices external to the laser cavity, specially adapted for lasers, e.g. for homogenisation of the beam or for manipulating laser pulses, e.g. pulse shaping shaping laser beam for working metal or other materials B23K26/06; optical elements, systems or apparatus in general G02B
• CPC Class Codes: H01S 5/005 : Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping H01S5/026, H01S5/18388 take precedence
• CPC Class Codes: H01S 5/02255 : using beam deflecting elements
• CPC Class Codes: H01S 5/02325 : Mechanically integrated components on mount members or optical micro-benches
• CPC Class Codes: Y10T 156/1052 : with cutting, punching, tearing or severing
• CPC Class Codes: Y10T 156/1089 : of discrete laminae to single face of additional lamina

Abstract

Mass production of integrated optical subsystems may be realized by providing a bonding material surround each die in an array of first dies on a wafer. A plurality of second dies are then aligned with the dies on the wafer. The bonding material is then treated to bond the aligned dies. The bonded dies are then diced to form a bonded pair of dies containing at least one optical element, thus forming an integrated optical subsystem. The bonding material may be provided over at least part of the optical path of each first die, over an entire surface of the wafer or around the perimeter of each first die. The second dies may be provided on another wafer. Either die may contain active elements, e.g., a laser or a detector. The optical elements may be formed in the die or may be of a different material than that of the die.

Claims

1. A method for forming an integrated optical subsystem comprising:

providing a bonding material surrounding each die in an array of first dies on a first wafer;

aligning a plurality of second dies with the first dies, each first die having a second die aligned therewith, at least one of said array of first dies and said plurality of said second dies include a corresponding number of lithographically formed individual passive optical elements;

treating the bonding material to thereby bond the aligned dies; and

dicing the bonded dies, each diced, bonded pair of dies containing at least one passive optical element, thereby forming an integrated optical subsystem.

2. The method according to claim 1, wherein said providing includes providing the bonding material over at least part of the optical path of each die on the first wafer.

3. The method according to claim 1, wherein said providing includes providing the bonding material over an entire surface of each die on the first wafer.

4. The method according to claim 1, wherein said providing includes sealing a perimeter of each die.

5. The method according to claim 1, wherein the second dies are on a second wafer and said aligning includes aligning the first and second wafers.

6. The method according to claim 1, wherein the second dies are separate from one another and said aligning includes aligning each second die with a corresponding first die.

7. The method according to claim 1, wherein one of said first and second dies is a semiconductor die.

8. The method according to claim 7, wherein a semiconductor die contains a vertical cavity side emitting laser.

9. The method according to claim 7, wherein a semiconductor die contains a detector.

10. The method according to claim 7, further comprising mounting discrete devices on one of said first and second dies.

11. The method according to claim 10, wherein said mounting includes mounting at least one of a mirror and a laser.

12. The method according to claim 10, wherein said mounting includes mounting optics.

13. The method according to claim 10, wherein said mounting includes mounting an optical fiber.

14. The method according to claim 10, wherein one of said first and second dies is a polarizer.

15. The method according to claim 1, wherein the at least one passive optical element is formed of a material different from a material of its respective substrate.

16. The method according to claim 15, wherein the at least one passive optical element is formed in photoresist.

17. The method according to claim 1, wherein the at least one passive optical element is formed in its respective substrate.

18. The method according to claim 1, further comprising, before said dicing, aligning a plurality of third dies with said first and second dies.

19. The method according to claim 18, wherein the first die is a wafer of collimating elements, the second die is a wafer of focusing elements, and the third die is a wafer serving as a spacer between the first and second dies.

20. The method according to claim 1, wherein at least one of the first and second dies is made of silicon.