System for and method of providing a controlled deposition on wafers

• US 6,235,172 B1
• Filed: 08/31/1999
• Issued: 05/22/2001
• Est. Priority Date: 11/07/1995
• Status: Expired due to Term

• Current Assignee: MKS Instruments Incorporated
• Original Assignee: Agency For Science Technology and Research
• Inventors: Clarke, Peter J., Begin, Robert George
• Primary Examiner(s): MCDONALD, RODNEY GLENN
• Application Number:
  US09/387,370
• Time in Patent Office: 630 Days
• Field of Search: 204/298.27, 204/298.28, 204/298.25, 204/298.23, 204/298.15, 118/730, 118/729, 118/728, 118/725, 118/724, 118/719
• US Class Current: 204/298.27
• CPC Class Codes: C23C 14/34 Sputtering
• CPC Class Codes: C23C 14/3407 Cathode assembly for sputtering apparatus, e.g. Target
• CPC Class Codes: C23C 14/3464 using more than one target C23C14/56 takes precedence
• CPC Class Codes: C23C 14/505 for rotation of the substrates
• CPC Class Codes: C23C 14/56 Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
• CPC Class Codes: C23C 14/566 using a load-lock chamber
• CPC Class Codes: Y10S 414/135 Associated with semiconductor wafer handling
• CPC Class Codes: Y10S 414/136 including wafer orienting means
• CPC Class Codes: Y10S 414/137 including means for charging or discharging wafer cassette
• CPC Class Codes: Y10S 414/139 including wafer charging or discharging means for vacuum chamber
• CPC Class Codes: Y10S 414/141 includes means for gripping wafer

Abstract

A robotic arm assembly in a transport module is expansible to have an effector at its end receive a substrate in a cassette module and is then contracted and rotated with the effector to have the effector face a process module. Planets on a turntable in the process module are rotatable on first parallel axes. The turntable is rotatable on a second axis parallel to the first axes to move successive planets to a position facing the effector. At this position, an alignment assembly is aligned with, but axially displaced from, one of the planets. This assembly is moved axially into coupled relationship with such planet and then rotated to a position aligning the substrate on the effector axially with such planet when the arm assembly is expanded. A lifter assembly aligned with, and initially displaced from, such planet is moved axially to lift the substrate from the effector. The arm assembly is then contracted, rotated with the effector and expanded to receive the next cassette module substrate. The lifter assembly is then moved axially to deposit the substrate on the planet. When the substrates have been deposited on the planets, the planets are individually rotated on the first axes by a stator rotatable on the second axis with the turntable. Guns having a particular disposition relative to the planets provide controlled depositions on the substrates during such planet rotations. The planets and the end effector hold the substrates at peripheral positions displaced from the controlled substrate depositions.

Claims

1. In combination for providing a controlled deposition on a plurality of substrates,

a turntable rotatable on a first axis,

a plurality of planets each operatively coupled to the turntable for rotation with the turntable during the rotation of the turntable and each independently rotatable on a second axis displaced from the first axis,

a stator rotatable on the first axis and operatively coupled to the planets for rotating the planets on the second axis,

first means for providing a coupling between the turntable and the stator in a first relationship to provide a rotation of the stator with the turntable and for providing a decoupling of the stator from the turntable in a second relationship,

second means for providing a first movement of the planets on the first axis when the turntable is rotated in the first relationship,

third means for providing a second movement of the planets on the first axis when the turntable is rotated in the second relationship, and

fourth means for providing a rotation of the planets on the second axis independently of any movement of the turntable and the stator to position the planets for the transfer of the substrates to the planets.

2. In a combination as set forth in claim 1,

fifth means for providing a coupling between the turntable and each of the planets in the first relationship of the turntable and the stator to provide a first movement of each of the planets to a position for transferring one of the substrates to each of the planets,

the fourth means being operative to provide a second movement of each of the planets on the second axis, on a more refined basis then the first movement, to a position for transferring one of the substrates to each of the planets, and

sixth means for providing a coupling between the turntable and each of the planets in the second relationship of the turntable and the stator to provide for the deposition on each of the planets.

3. In a combination as set forth in claim 2,

seventh means for providing the deposition on each of the planets during the operation of the sixth means.

4. In a combination as set forth in claim 1,

fifth means for providing a trarnsfer of the substrates to the planets when the planets have been positioned by the second and fourth means to receive the substrates, and

sixth means for providing the controlled deposition on the substrates while the second means is rotating the turntable to obtain the rotation of the planets.

5. In a combination as set forth in claim 2,

seventh means for providing a transfer of the substrates to the planets when the planets have been positioned by the second and fourth means to receive the substrates, and

eighth means for providing the controlled deposition on the substrates while the second means is rotating the turntable to obtain the rotation of the planets.