×

Encapsulate resin LOC package and method of fabrication

  • US 6,236,107 B1
  • Filed: 06/07/1995
  • Issued: 05/22/2001
  • Est. Priority Date: 04/29/1994
  • Status: Expired due to Term
First Claim
Patent Images

1. A small form factor semiconductor chip comprising:

  • a lead frame;

    at least one section of adhesive securing said lead frame to an integrated circuit die, said lead frame being positioned above said integrated circuit die;

    at least one wire bond electrically connecting at least one contact pad to said lead frame; and

    a resin encapsulant covering only one surface of the integrated circuit die.

View all claims
  • 0 Assignments
Timeline View
Assignment View
    ×
    ×