Multi-chip chip scale package
First Claim
Patent Images
1. A multi-chip chip scale package, comprising:
- a film carrier, further comprising;
an insulation film; and
a plurality of conductive wires, arranged on the insulation film;
a first chip, disposed on a first side of the insulation film of the film carrier, and having a first bump connecting to one of the conducting wires;
a second chip, disposed on a second side of the film carrier opposite to the first side, and having a second bump connecting to one of the conducting wires;
an insulation material, infilled between the first and the second chips on both the first and the second sides of the film carrier; and
a printed circuit board directly connected to the conducting wires of the film carrier.
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Accused Products
Abstract
A multi-chip chip scale package. A film carrier is in use. Two chips with different sizes can be disposed on the same film carrier. The flip chip technique is used to arrange each chip on each side of the film carrier face to face. A bump is formed on each chip to electrically connect with the film carrier. An insulation material is infilled between the chips to leave one side of each chip exposed. The conductive wires of the film carrier are connected with the chip directly without going through other carrier.
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Citations
19 Claims
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1. A multi-chip chip scale package, comprising:
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a film carrier, further comprising;
an insulation film; and
a plurality of conductive wires, arranged on the insulation film;
a first chip, disposed on a first side of the insulation film of the film carrier, and having a first bump connecting to one of the conducting wires;
a second chip, disposed on a second side of the film carrier opposite to the first side, and having a second bump connecting to one of the conducting wires;
an insulation material, infilled between the first and the second chips on both the first and the second sides of the film carrier; and
a printed circuit board directly connected to the conducting wires of the film carrier. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A printed circuit board having a package disposed thereon, comprising:
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a substrate; and
a plurality of printed circuits on the substrate;
wherein the package comprises;
a film carrier, further comprising;
an insulation film; and
a plurality of conductive wires, arranged on the insulation film, and directly connected to one of the printed circuits;
a first chip, disposed on a first side having the insulation film of the film carrier, and having a first bump connecting to the film carrier;
a second chip, disposed on a second side of the film carrier opposite to the first side, and having a second bump connecting to the film carrier, one of the first chip and the second chip is connected to the substrate; and
an insulation material, infilled between the first and the second chips on both the first and the second sides of the film carrier. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16, 17, 18, 19)
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Specification