×

Multi-chip chip scale package

  • US 6,236,109 B1
  • Filed: 02/01/1999
  • Issued: 05/22/2001
  • Est. Priority Date: 01/29/1999
  • Status: Expired due to Term
First Claim
Patent Images

1. A multi-chip chip scale package, comprising:

  • a film carrier, further comprising;

    an insulation film; and

    a plurality of conductive wires, arranged on the insulation film;

    a first chip, disposed on a first side of the insulation film of the film carrier, and having a first bump connecting to one of the conducting wires;

    a second chip, disposed on a second side of the film carrier opposite to the first side, and having a second bump connecting to one of the conducting wires;

    an insulation material, infilled between the first and the second chips on both the first and the second sides of the film carrier; and

    a printed circuit board directly connected to the conducting wires of the film carrier.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×