Method of forming a phase change heat sink

• US 6,237,223 B1
• Filed: 05/11/2000
• Issued: 05/29/2001
• Est. Priority Date: 05/06/1999
• Status: Expired due to Term

• Current Assignee: Ticona Polymers, Inc. (Celanese Corporation)
• Original Assignee: Chip Coolers, Inc.
• Inventors: McCullough, Kevin A.
• Primary Examiner(s): Rosenbaum, Irene Cuda
• Application Number:
  US09/568,748
• Time in Patent Office: 383 Days
• Field of Search: 29/890.032, 29/890.03, 165/104.26, 165/104.33
• US Class Current: 29/890.032
• CPC Class Codes: B22F 3/1103 with particular physical characteristics
• CPC Class Codes: B22F 7/08 with one or more parts not made from powder B22F7/062 takes precedence
• CPC Class Codes: B23P 15/26 heat exchangers or the like making heat exchangers by methods covered by other subclasses B21D53/02
• CPC Class Codes: B23P 2700/10 Heat sinks
• CPC Class Codes: F28D 15/0233 the conduits having a particular shape, e.g. non-circular cross-section, annular F28D15/0241, F28D15/0266 take precedence
• CPC Class Codes: F28D 15/046 characterised by the material or the construction of the capillary structure
• CPC Class Codes: H01L 23/4275 by melting or evaporation of solids
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: Y10T 29/4935 Heat exchanger or boiler making
• CPC Class Codes: Y10T 29/49353 Heat pipe device making

Abstract

A method of forming a phase change passive heat sink, with a base member and heat dissipating members, is provided. The base member is hollow and defines an evaporation chamber therein. A number of heat dissipating members are connected to the base member. Each of the heat dissipating members are substantially tubular in configuration with a closed end and an open end and defining respective condensation chambers therein. The open ends of the heat dissipating members are connected to the base member with the condensation chambers and are in fluid communication with the evaporation chamber. A heat transporting media resides in the base member which is movable into the condensation chambers upon application of heat to the base member. Heat is dissipated through the heat dissipating members.

Claims

1. A method of forming a phase change heat sink assembly, comprising the steps of:

forming a wick frame having a hollow base, with an base chamber, and a plurality of hollow upstanding members, with respective upstanding member chambers;

said base chamber being in fluid communication with said upstanding member chambers;

placing said wick frame into a mold;

overmolding an outer housing of moldable thermally conductive polymer material around said hollow base and said hollow upstanding members of said wick frame;

said outer housing formed around said hollow base being an evaporation region and said outer housing formed around said upstanding members being respective condensation chambers;

forming a load hole through said outer housing and said hollow base;

introducing heat transporting media through said load hole into said hollow base; and

sealing said load hole thereby trapping said heat transporting media within said outer housing.

2. The method of claim 1, further comprising the step of:

introducing a vacuum in said outer housing via said load hole.

3. The method of claim 1, wherein said plurality of upstanding members are posts.

4. The method of claim 1, wherein said plurality of upstanding members are in a pin grid array.

5. The method of claim 1, wherein said heat transporting media is water.

6. The method of claim 1, wherein said heat transporting media is ammonia.

7. The method of claim 1, further comprising the step of forming said wick structure by hot-pressing a layer of metal.

8. The method of claim 1, further comprising the step of forming said wick structure by sintering a layer of metal.

9. The method of claim 7, wherein said layer of metal is oxygen-free copper.

10. The method of claim 8, wherein said layer of metal is oxygen-free copper.