Dry powder delivery system apparatus

• US 6,237,590 B1
• Filed: 09/18/1997
• Issued: 05/29/2001
• Est. Priority Date: 09/18/1997
• Status: Expired due to Fees

• Current Assignee: Sarnoff Corporation (SRI International, Inc.)
• Original Assignee: Delsys Pharmaceutical Corporation (Perrigo Company PLC)
• Inventors: White, Allan Eugene, Leedom, Marvin Allan
• Primary Examiner(s): WEISS, JOHN
• Assistant Examiner(s): Martin, Todd M.
• Application Number:
  US08/932,489
• Time in Patent Office: 1,349 Days
• Field of Search: 128/315, 128/203.12, 128/203.21, 128/203.23, 128/205.15, 128/203.18, 128/203.14, 128/203.19, 128/203.24
• US Class Current: 128/203.15
• CPC Class Codes: A61M 15/0045 using multiple prepacked dosages on a same carrier, e.g. blisters
• CPC Class Codes: A61M 15/0048 the dosages being arranged in a plane, e.g. on diskettes
• CPC Class Codes: A61M 15/0051 the dosages being arranged on a tape, e.g. strips
• CPC Class Codes: A61M 15/02 with activated or ionised fluids, e.g. electrohydrodynamic [EHD] or electrostatic devices; Ozone-inhalators with radioactive tagged particles
• CPC Class Codes: A61M 2202/064 Powder
• CPC Class Codes: A61M 2205/0266 Shape memory materials
• CPC Class Codes: A61M 2206/16 Rotating swirling helical flow, e.g. by tangential inflows

Abstract

Provided is a powder delivery system which uses mechanical or electrical means to individually release covers that cover powder at a variety of powder aliquot locations on a rigid substrate.

Claims

1. A powder delivery system comprising:

a body having an internal cavity and an outlet port for delivering a powder into an aerosol form;

a substrate with one or more aliquots of powder, each aliquot at an aliquot location on the substrate, each aliquot sealed under an individually releasable cover; and

an electrical release element for electrically releasing each releasable cover, the substrate having electrical conductors for selectively applying voltage to the electrical release element to thereby selectively release the corresponding cover.

2. The powder delivery system of claim 1, further including a plurality of aliquots, corresponding covers and corresponding release elements and further comprising a plurality of electrical components for selectively addressably directing voltage to the electrical release elements, wherein the application of an electrical signal to the selected release elements results in selected release of the corresponding covers.

3. The powder delivery system of claim 1, including means for moving the substrate to align each aliquot to a release position, wherein when the substrate is moved to align an aliquot with its aliquot release position, electrical contacts are made that direct voltage to a selected electrical release element.

4. The powder delivery system of claim 1, wherein:

either (a) the releasable cover is secured by a reversibly thermosetting adhesive, or (b) the releasable cover is formed of a material having mechanical memory and is conditioned to favor a memory configuration, wherein, when secured to the substrate the cover in the closed condition is bent out of the memory configuration, or (c) both (a) and (b) apply.

5. The powder delivery system of claim 4, wherein the material having mechanical memory is a shape memory material that adopts its memory configuration when heated to a memory temperature.

6. The powder delivery system of claim 1, including a plurality of aliquot locations, the substrate having an upper electrically non-conductive surface and a lower surface wherein the aliquot locations are arrayed on the upper non-conducting surface of the substrate and further comprising a strip of conductive material applied to the lower surface of the substrate at each location.

7. The powder delivery system of claim 6, further comprising a voltage source for applying a powder release-assisting voltage to one or more of the strips of conductive material.

8. A substrate for delivering powder on which multiple aliquots of powder are at corresponding aliquot locations, each aliquot sealed under an individually releasable cover, the substrate including a plurality of electrical release elements, each element corresponding to a separate aliquot cover, each release element for releasing the corresponding cover.

9. The substrate of claim 8, wherein:

the release elements comprise a plurality of electrical pathways, each pathway corresponding to a different cover for selectively applying a received voltage to each electrical release element to thereby selectively release the covers.

10. The substrate of claim 8 wherein the covers are formed of a material having mechanical memory and are conditioned to favor a memory configuration, wherein, when covering a aliquot location each cover is out of the favored memory configuration, and wherein activation, for any aliquot location of the electrical release element for that aliquot location sufficiently releases the corresponding cover to allow it to seek the favored memory configuration and uncover an aliquot of powder.

11. A powder delivery system comprising:

a body having an internal cavity and an outlet port for delivering a powder into an aerosol form;

a substrate in the cavity with at least one aliquot of powder at a corresponding aliquot location on the substrate, the at least one aliquot being sealed under a corresponding separate, discrete individually releasable cover in a cover closed position, the cover having memory and favoring a predetermined memory configuration; and

means for selectively causing the cover to displace to a cover open favored memory configuration.

12. The powder delivery system of claim 11, wherein the means for selectively causing comprises at least one hole passing through the substrate, a mechanism for inserting a prong into the at least one hole, wherein the insertion of the prong into the at least one hole deflects the cover at an aliquot location causing the cover to adopt the memory configuration.

13. The system of claim 11 wherein the cover has a memory in a bent condition that favors the open position and the means for causing including means for retaining the cover closed against the force of the bent favored open position and including means for releasing the retaining means.

14. The system of claim 13 wherein the means for retaining comprises a reversibly thermosetting adhesive.

15. The system of claim 13 wherein the means for releasing comprises mechanical means coupled to the body for applying a displacement force to the cover.

16. The system of claim 11 wherein the cover has a first memory configuration in the closed position at a first temperature and a second memory configuration in the open configuration at a second temperature higher than the first temperature, the means for causing including means placing the cover at the second temperature.

17. The system of claim 16 wherein the means for placing includes electrical means for electrically heating the cover.

18. The system of claim 16 wherein the cover includes leads that have a first position at the first temperature and a second position at the second temperature, the leads for opening the cover when heated to the second temperature in response to an applied electrical signal.

19. A powder delivery system comprising:

a body having an internal cavity and an outlet port for delivering a powder into an aerosol form;

a substrate in the cavity with at least one aliquot of powder at a corresponding aliquot location on the substrate, the at least one aliquot being sealed under an individually releasable cover in a cover closed position;

an aliquot cover having an aliquot closed position and an open position; and

a cover release mechanism comprising an electrical release element responsive to an applied electrical signal for electrically releasing the cover.

20. A powder delivery system comprising:

a body having an internal cavity and an outlet port for delivering a powder into an aerosol form;

a substrate with one or more aliquots of powder, each aliquot at an aliquot location on the substrate, each aliquot sealed under an individually releasable cover, an electrical release element for electrically releasing each releasable cover; and

means for moving the substrate to align each aliquot to a release position, wherein when the substrate is moved to align an aliquot with its aliquot release position, electrical contacts are made that direct voltage to a selected electrical release element.

21. A powder delivery system comprising:

a body having an internal cavity and an outlet port for delivering a powder into an aerosol form;

a substrate with one or more aliquots of powder, each aliquot at an aliquot location on the substrate, each aliquot sealed under an individually releasable cover; and

an electrical release element for electrically releasing each releasable cover, the cover having a memory configuration in a cover open position including means for causing the closed cover to assume the cover open position from the sealed condition for each releasable cover, the cover material having a memory configuration comprising shape memory material that adopts its memory configuration when heated to a memory configuration.

22. A powder delivery system comprising:

a body having an internal cavity and an outlet port for delivering a powder into an aerosol form;

a substrate with one or more aliquots of powder, each aliquot at an aliquot location on the substrate, each aliquot sealed under an individually releasable cover, and

an electrical release element for electrically releasing each releasable cover and the corresponding aliquot of powder.

23. A powder delivery system comprising:

a body having an internal cavity and an outlet port for delivering a powder into an aerosol form;

a substrate with a plurality of aliquots of powder, each aliquot at a separate discrete aliquot location on the substrate, each aliquot sealed under an individually releasable cover; and

an electrical release element for electrically releasing each releasable cover;

the substrate having an upper electrically non-conductive surface and a lower surface wherein the aliquot locations are arrayed on the upper non-conducting surface of the substrate and further comprising a strip of conductive material applied to the lower surface of the substrate at each location.