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High conductivity, high strength, lead-free, low cost, electrically conducting materials and applications

  • US 6,238,599 B1
  • Filed: 06/18/1997
  • Issued: 05/29/2001
  • Est. Priority Date: 06/18/1997
  • Status: Expired due to Fees
First Claim
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1. A lead-free electrically conductive adhesive paste composition comprising:

  • a network of interconnected particles having spaces there-between;

    each of said particles has a coating thereon of a fusible material;

    adjacent particles in said network are isotropically adhered together through said fusible material, said spaces containing a polymer selected from the group consisting of a thermoplastic phenoxy polymer and a styrene allyl alcohol resin.

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