Laminated electric part

• US 6,238,779 B1
• Filed: 10/21/1999
• Issued: 05/29/2001
• Est. Priority Date: 10/22/1998
• Status: Expired due to Term

• Current Assignee: Taiyo Yuden Company Limited (Taiyo Yuden Co)
• Original Assignee: Taiyo Yuden Company Limited (Taiyo Yuden Co)
• Inventors: Kawata, Toshifumi, Iwao, Hidemi
• Primary Examiner(s): LAM, CATHY FONG FONG
• Application Number:
  US09/422,496
• Time in Patent Office: 586 Days
• Field of Search: 257/531, 361/792, 361/795, 361/803, 361/299.2, 428/210, 174/261, 174/262
• US Class Current: 428/210
• CPC Class Codes: B32B 18/00 Layered products essentially comprising ceramics, e.g. refractory products
• CPC Class Codes: C04B 2237/32 Ceramic
• CPC Class Codes: C04B 2237/68 Forming laminates or joining articles wherein at least one substrate contains at least two different parts of macro-size, e.g. one ceramic substrate layer containing an embedded conductor or electrode
• CPC Class Codes: H01F 27/2804 Printed windings
• CPC Class Codes: Y10T 428/24926 including ceramic, glass, porcelain or quartz layer

Abstract

A multilayer type electronic part includes a laminated structure formed by stacking a plurality of first and second ceramic layers, the first ceramic layers being provided with internal electrode patterns on top thereof, the second ceramic layers having no internal electrode pattern and being located at a top and a bottom portions of the laminated structure, respectively, the internal electrode patterns being connected to each other to form a coil inside the laminated structure, a pair of external electrodes provided at two opposing sides of the laminated structure and connected to the coil. The multilayer type electronic part further includes one or more third ceramic layers, each of the third ceramic layers not including internal electrode pattern and being interposed between the first ceramic layers, and means for connecting the internal electrode patterns formed on the first ceramic layers to form the coil.

Claims

1. A multilayer type electronic part including a laminated structure and a pair of external electrodes, the laminated structure being formed by stacking a plurality of first ceramic layers and two sets of one or more second ceramic layers, the first ceramic layers being provided with internal electrode patterns on top thereof, the second ceramic layers having no internal electrode pattern and the two sets of second ceramic layers being located at a top and a bottom portions of the laminated structure, respectively, the internal electrode patterns being connected to each other to form a coil inside the laminated structure, the laminated structure having a set of a top and a bottom surfaces opposing each other and a set of two opposing side surfaces, the top and the bottom surfaces corresponding to the outermost surfaces of the second ceramic layers, and the pair of external electrodes being provided at the two opposing surfaces of one of the two sets and connected to the coil, the multilayer type electronic part further comprising:

one or more third ceramic layers, the third ceramic layers not including internal electrode pattern and being interposed between the first ceramic layers; and

means for connecting the internal electrode patterns formed on the first ceramic layers to form the coil.

6. The multilayer type electronic part of any one of claims 1 to 5, wherein at least one third ceramic layer is interposed between every two neighboring sets of first ceramic layers, internal electrode patterns of each set of first ceramic layers forming one turn of the coil.

7. The multilayer type electronic part of any one of claims 1 to 5, wherein at least one third ceramic layer is interposed between every two neighboring sets of the first ceramic layers, internal electrode patterns of each set of first ceramic layers forming a half turn of the coil.

8. The multilayer type electronic part of any one of claims 1 to 5, wherein the external electrodes are provided on the top and the bottom surfaces of the laminated structure.

9. The multilayer type electronic part of any one of claims 1 to 5, wherein the two opposing side surfaces are substantially normal to the top and the bottom surfaces and the external electrodes are provided on the two opposing side surfaces.

10. The multilayer type electronic part of claim 6, wherein the external electrodes are provided on the top and the bottom surfaces of the laminated structure.

11. The multilayer type electronic part of claim 6, wherein the two opposing side surfaces are substantially normal to the top and the bottom surfaces and the external electrodes are provided on the two opposing side surfaces.

12. The multilayer type electronic part of claim 7, wherein the external electrodes are provided on the top and the bottom surfaces of the laminated structure.

13. The multilayer type electronic part of claim 7, wherein the two opposing side surfaces are substantially normal to the top and the bottom surfaces and the external electrodes are provided on the two opposing side surfaces.

2. A multilayer type electronic part including a laminated structure and a pair of external electrodes, the laminated structure being formed by stacking a plurality of first ceramic layers and two sets of one or more second ceramic layers, the first ceramic layers being provided with internal electrode patterns on top thereof, the second ceramic layers having no internal electrode pattern and the two sets of second ceramic layers being located at a top and a bottom portions of the laminated structure, respectively, the internal electrode patterns being connected to each other to form a coil inside the laminated structure, the laminated structure having a set of a top and a bottom surfaces opposing each other and a set of two opposing side surfaces, the top and the bottom surfaces corresponding to the outermost surfaces of the second ceramic layers, and the pair of external electrodes being provided at the two opposing surfaces of one of the two sets and connected to the coil, the multilayer type electronic part further comprising:

one or more third ceramic layers, the third ceramic layers not including internal electrode pattern and being interposed between the first ceramic layers; and

a through-hole formed on each of the third ceramic layers and filled with a conductive material to connect the internal electrode patterns formed on the first ceramic layers to form the coil.

3. The multilayer type electronic part of claim 2, wherein each of the third ceramic layers is formed by stacking a plurality of ceramic sheets.

4. The multilayer type electronic part of claim 3, wherein the ceramic sheets constituting each of the third ceramic layers are provided with through-holes at their predetermined locations.

5. The multilayer type electronic part of claim 4, wherein the through-holes of the ceramic sheets are formed by using a laser beam.