Photosensitive resin composition

• US 6,238,840 B1
• Filed: 11/10/1998
• Issued: 05/29/2001
• Est. Priority Date: 11/12/1997
• Status: Expired due to Term

• Current Assignee: Hitachi Chemical Company Limited (Resonac Holdings Corp.)
• Original Assignee: Hitachi Chemical Company Limited (Resonac Holdings Corp.)
• Inventors: Yoshino, Toshizumi, Sato, Kuniaki, Hirayama, Takao, Hirakura, Hiroaki, Ito, Toshihiko
• Primary Examiner(s): Hamilton, Cynthia
• Application Number:
  US09/188,302
• Time in Patent Office: 931 Days
• Field of Search: 430/280.1, 522/100, 522/57
• US Class Current: 430/280.1
• CPC Class Codes: G03F 7/038 Macromolecular compounds which are rendered insoluble or differentially wettable G03F7/075 takes precedence; macromolecular azides G03F7/012; macromolecular diazonium compounds G03F7/021
• CPC Class Codes: H05K 3/287 Photosensitive compositions

Abstract

A photosensitive resin composition comprising (A) a photosensitive resin having one or more carboxyl groups, (B) a special epoxy curing agent, and (C) a photopolymerization initiator is excellent in adhesiveness, heat resistance, resistance to PCT and developability and suitable as a solder resist composition.

Claims

1. A photosensitive resin composition comprising

(A) a carboxyl group-containing photosensitive resin,

(B) an epoxy curing agent represented by the following formula (I):

wherein R¹, R², R³ and R⁴ are independently a hydrogen atom, an alkyl group having 1 to 4 carbon atoms or an aryl group having 6 to 10 carbon atoms, provided that at least one of R¹, R², R³ and R⁴ is an alkyl group having 1 to 4 carbon atoms or an aryl group having 6 to 18 carbon atoms;

R⁵ and R⁶ are independently a hydrogen atom or an alkyl group having 1 to 2 carbon atoms; and

n is 0, 1, 2 or 3, and

(C) a photopolymerization initiator.

2. A photosensitive resin composition according to claim 1, wherein the carboxyl group-containing photosensitive resin has an acid value in the range of 40-250 KOH mg/g.

3. A photosensitive resin composition according to claim 2, wherein said acid value is in the range of 50-150 KOH mg/g.

4. A photosensitive resin composition according to claim 1, wherein at least 50% by weight of said epoxy curing agent, is the epoxy curing agent represented by said formula (I).

5. A photosensitive resin composition comprising:

(A) a carboxyl group-containing photosensitive resin;

(B) an epoxy curing agent represented by the following formula (I);

wherein R¹, R², R³, and R⁴ are independently a hydrogen atom, an alkyl group having 1 to 4 carbon atoms or an aryl group having 6 to 10 carbon atoms, provided that at least one of R¹, R², R³ and R⁴ is an alkyl group having 1 to 4 carbon atoms or an aryl group having 6 to 18 carbon atoms;

R⁵ and R⁶ are independently a hydrogen atom or an alkyl group having 1 to 2 carbon atoms; and

n is 0, 1, 2 or 3;

(C) a photopolymerization initiator; and

(D) a triazine compound.

6. A photosensitive resin composition comprising:

(A) a carboxyl group-containing photosensitive resin, wherein said carboxyl group-containing photosensitive resin (A) is an addition product formed by esterifying an epoxy compound (a) with an unsaturated monocarboxylic acid to obtain an esterified product and then adding an acid anhydride of a saturated or unsaturated polybasic acid to said esterified product;

(B) an epoxy curing agent represented by the following formula (I);

wherein R¹, R², R³, and R⁴ are independently a hydrogen atom, an alkyl group having 1 to 4 carbon atoms or an aryl group having 6 to 10 carbon atoms, provided that at least one of R¹, R², R³ and R⁴ is an alkyl group having 1 to 4 carbon atoms or an aryl group having 6 to 18 carbon atoms;

R⁵ and R⁶ are independently a hydrogen atom or an alkyl group having 1 to 2 carbon atoms; and

n is 0, 1, 2 or 3; and

(C) a photopolymerization initiator.

7. A photosensitive resin composition according to claim 6, wherein said epoxy compound (a) is an epoxy compound formed by reacting epichlorohydrin with a reaction product formed between salicylaldehyde and phenol or cresol.

8. A photosensitive resin composition according to claim 6, wherein said epoxy compound (a) is an epoxy compound having a polyamide unit and/or a polyamide-imide unit in the molecular structure thereof.

9. A photosensitive resin composition according to claim 8, wherein said epoxy compound (a) is an epoxy group-containing polyimide resin or an epoxy group-containing polyamide-imide resin obtained by reacting a carboxyl group-terminated polyamide resin and/or a carboxyl group-terminated polyamide-imide resin (b) with an epoxy resin (c) under a condition that the molar ratio of the epoxy group of (c) to the carboxyl group of (b) is greater than 1.

10. A photosensitive resin composition according to claim 6, wherein said epoxy compound (a) is an epoxy group-containing polyamide resin or an epoxy group-containing polyamide-imide resin obtained by reacting a carboxyl group-terminated polyamide resin and/or a carboxyl group-terminated polyamide-imide resin (b) with an epoxy resin (c) under a condition that the molar ratio of the epoxy group of (c) to the carboxyl group of (b) is greater than 1.

11. A photosensitive resin composition according to claim 10, wherein said carboxyl group-terminated polyamide resin and/or carboxyl group-containing polyamide-imide resin (b) is a resin having a polyalkylene oxide unit and/or a polycarbonate unit in the molecular structure thereof.

12. A photosensitive resin composition comprising

(A) a carboxyl group-containing photosensitive resin,

(B) an epoxy curing agent represented by the following formula (I):

wherein R¹, R ², R³ and R⁴ are independently a hydrogen atom, an alkyl group having 1 to 4 carbon atoms or an aryl group having 6 to 10 carbon atoms, provided that at least one of R¹, R², R³ and R⁴ is an alkyl group having 1 to 4 carbon atoms or an aryl group having 6 to 18 carbon atoms;

R⁵ and R6 are independently a hydrogen atom or an alkyl group having 1 to 2 carbon atoms; and

n is 1, and

(C) a photopolymerization initiator.