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Determining endpoint in etching processes using principal components analysis of optical emission spectra with thresholding

  • US 6,238,937 B1
  • Filed: 01/26/2000
  • Issued: 05/29/2001
  • Est. Priority Date: 09/08/1999
  • Status: Expired due to Term
First Claim
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1. A method for determining an etch endpoint, the method comprising:

  • collecting intensity data representative of optical emission spectral wavelengths during a plasma etch process;

    analyzing at least a portion of the collected intensity data into at most first and second Principal Components with respective Loadings and corresponding Scores; and

    determining the etch endpoint using the respective Loadings and corresponding Scores of the second Principal Component as an indicator for the etch endpoint using thresholding applied to the respective Loadings of the second Principal Component.

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