Methods of making microelectronic connections with liquid conductive elements
First Claim
1. A method of operating a microelectronic assembly having first and second elements and having masses of a conductive material electrically interconnecting said elements and having a compliant material surrounding the masses, the method including the step of transmitting signals between said elements through said masses, said masses being in an at least partially liquid state at least some times during operation of the assembly, said compliant layer physically containing said liquid masses.
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Abstract
A method of making a microelectronic assembly includes providing a first element and a second element with confronting, spaced-apart interior surfaces defining a space therebetween and contacts on the interior surfaces and masses of an electrically conductive material having a melting temperature below about 125° C. in the space so that each mass is disposed between a contact on the first element and a contact on the second element and so that the masses electrically connect the contacts to one another. A flowable liquid material is then introduced around the masses and between the confronting surfaces, and the liquid material is then cured to form a compliant dielectric layer disposed between the confronting surfaces and intimately surrounding each mass.
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Citations
9 Claims
- 1. A method of operating a microelectronic assembly having first and second elements and having masses of a conductive material electrically interconnecting said elements and having a compliant material surrounding the masses, the method including the step of transmitting signals between said elements through said masses, said masses being in an at least partially liquid state at least some times during operation of the assembly, said compliant layer physically containing said liquid masses.
Specification