Intra-tool defect offset system
First Claim
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1. A method of analyzing defects in a semiconductor manufacturing process, the method comprising the steps of:
- sending a production lot of wafers through a manufacturing process;
scanning a selected wafer from the production lot of wafers for defects in a selected scanning tool;
sending location information for defects caught during the step of scanning to a defect management system;
combining the location information for defects caught during the step of scanning with offset information for the selected scanning tool to obtain accurate scanning tool defect location information;
selecting a review analysis tool to review the accurate scanning tool defect location information;
combining the accurate scanning tool defect location information with offset information for the selected review analysis tool to obtain accurate review tool defect location information for the selected review analysis tool; and
analyzing in the selected review analysis tool the defects caught during the step of scanning using the accurate review tool defect location information for the selected review analysis tool.
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Abstract
A method of analyzing defects in a semiconductor manufacturing process by removing position offset of a selected scanning tool from the defect location information and adding position offset of a selected review analysis tool. The resulting defect location information from a scanner is based upon a true xy coordinate system and the analysis review tool reviews defect locations based upon its xy coordinate system.
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Citations
6 Claims
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1. A method of analyzing defects in a semiconductor manufacturing process, the method comprising the steps of:
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sending a production lot of wafers through a manufacturing process;
scanning a selected wafer from the production lot of wafers for defects in a selected scanning tool;
sending location information for defects caught during the step of scanning to a defect management system;
combining the location information for defects caught during the step of scanning with offset information for the selected scanning tool to obtain accurate scanning tool defect location information;
selecting a review analysis tool to review the accurate scanning tool defect location information;
combining the accurate scanning tool defect location information with offset information for the selected review analysis tool to obtain accurate review tool defect location information for the selected review analysis tool; and
analyzing in the selected review analysis tool the defects caught during the step of scanning using the accurate review tool defect location information for the selected review analysis tool. - View Dependent Claims (2, 3, 4, 5, 6)
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Specification