Method of forming oxide film on an SOI layer and method of fabricating a bonded wafer

• US 6,239,004 B1
• Filed: 08/18/1998
• Issued: 05/29/2001
• Est. Priority Date: 08/29/1997
• Status: Expired due to Fees

• Current Assignee: Shin-Etsu Handotai Co., Ltd. (Shin-Etsu Chemical Company Limited)
• Original Assignee: Shin-Etsu Handotai Co., Ltd. (Shin-Etsu Chemical Company Limited)
• Inventors: Aga, Hiroji, Mitani, Kiyoshi, Nakano, Masatake
• Primary Examiner(s): Smith, Matthew
• Assistant Examiner(s): YEVSIKOV, VICTOR V
• Application Number:
  US09/135,976
• Time in Patent Office: 1,015 Days
• Field of Search: 438/455, 438/459, 438/151
• US Class Current: 438/455
• CPC Class Codes: H01L 21/2007 Bonding of semiconductor wafers to insulating substrates or to semiconducting substrates using an intermediate insulating layer H01L21/2011 takes precedence; bonding of semiconductor wafers to semiconductor wafers for junction formation H01L21/187
• CPC Class Codes: H01L 21/76251 using bonding techniques

Abstract

In a method of fabricating a bonded wafer, an oxide film is first formed on the surface of at least one of two mirror-polished silicon wafers. The two silicon wafers are superposed such that the mirror-polished surfaces come into close contact with each other, and heat treatment is performed in order to join the wafers together firmly. Subsequently, the thickness of one of the wafers is reduced so as to yield a thin film, the surface of which is then polished and subjected to vapor-phase etching in order to make the thickness of the thin film uniform. Optionally, the vapor-phase-etched surface is then mirror-polished. The surface of the bonded wafer is oxidized, and the generated surface oxide film is then removed. In the method, the thickness of the oxide film formed on the surface of the bonded wafer is made not greater than 50 nm. The method reliably eliminates damage and crystal defects generated during etching in accordance with PACE method or subsequent mirror polishing, and thereby enables relatively simple and low cost manufacture of bonded wafers having a very thin SOI layer that has good thickness uniformity and excellent crystallinity.

Claims

1. A method of fabricating a bonded wafer, comprising the steps of:

forming an oxide film on the surface of at least one of two mirror-polished silicon wafers;

superposing the two silicon wafers such that the mirror-polished surfaces come into close contact with each other;

heat-treating the wafers in order to join the wafers together firmly;

reducing the thickness of one of the wafers so as to yield a thin film;

polishing the surface of the thin film;

performing vapor-phase etching in order to make the thickness of the thin film uniform;

subjecting the surface of the bonded wafer to thermal oxidation to form an oxide film on the surface; and

removing the oxide film formed on the surface of the bonded wafer,

wherein the thickness of the oxide film formed on the surface of the bonded wafer is made not greater than 50 nm.

2. A method of fabricating a bonded wafer according to claim 1, wherein the thickness of the SOI layer after the thickness of the thin film is made uniform through vapor-phase etching is 1 μ

m or less.

3. A method of fabricating a bonded wafer according to claim 1, wherein the step of subjecting the surface of the bonded wafer to thermal oxidation to form an oxide film on the surface is performed at 800°

-1150°

C. for 30-180 minutes in an atmosphere of oxygen gas in nitrogen gas.

4. A method of fabricating a bonded wafer according to claim 1, wherein the step of removing the oxide film formed on the surface of the bonded wafer is carried out by wet etching.

5. A method of fabricating a bonded wafer according to claim 4, wherein the wet etching is carried out by use of an aqueous solution of hydrofluoric acid.

6. A method of fabricating a bonded wafer, comprising the steps of:

forming an oxide film on the surface of at least one of two mirror-polished silicon wafers;

superposing the two silicon wafers such that the mirror-polished surfaces come into close contact with each other;

heat-treating the wafers in order to join the wafers together firmly;

reducing the thickness of one of the wafers so as to yield a thin film;

polishing the surface of the thin film;

performing vapor-phase etching in order to make the thickness of the thin film uniform;

mirror-polishing the vapor-phase-etched surface;

subjecting the surface of the bonded wafer to thermal oxidation to form an oxide film on the surface; and

removing the oxide film formed on the surface of the bonded wafer,

wherein the thickness of the oxide film formed on the surface of the bonded wafer is made not greater than 50 nm.

7. A method of fabricating a bonded wafer according to claim 6, wherein the thickness of the SOI layer after the thickness of the thin film is made uniform through vapor-phase etching or after the vapor-phase-etched surface is mirror-polished is 1 μ

m or less.

8. A method of fabricating a bonded wafer according to claim 6, wherein the step of subjecting the surface of the bonded wafer to thermal oxidation to form an oxide film on the surface is performed at 800°

-1150°

C. for 30-180 minutes in an atmosphere of oxygen gas in nitrogen gas.

9. A method of fabricating a bonded wafer according to claim 6, wherein the step of removing the oxide film formed on the surface of the bonded wafer is carried out by wet etching.

10. A method of fabricating a bonded wafer according to claim 9, wherein the wet etching is carried out by use of an aqueous solution of hydrofluoric acid.