RF plasma source for material processing

• US 6,239,553 B1
• Filed: 04/22/1999
• Issued: 05/29/2001
• Est. Priority Date: 04/22/1999
• Status: Expired due to Term

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Applied Materials Incorporated
• Inventors: Barnes, Mike, Tanaka, Tsutomu, Ishikawa, Tetsuya, Niazi, Kaveh
• Primary Examiner(s): Shingleton, Michael B
• Application Number:
  US09/296,934
• Time in Patent Office: 768 Days
• Field of Search: 315/111.21, 315/111.51, 315/111.81, 315/111.91, 118/723 AN, 118/723 I, 118/723 IR, 219/121.48, 156/345
• US Class Current: 315/111.51
• CPC Class Codes: H01J 37/321 the radio frequency energy being inductively coupled to the plasma
• CPC Class Codes: H05H 1/46 using applied electromagnetic fields, e.g. high frequency or microwave energy H05H1/26 takes precedence

Abstract

The present invention provides a plasma source that maintains a low coil voltage in the vicinity of the plasma tube, thereby reducing the capacitive coupling between the coil and the plasma and significantly reducing the erosion from the internal surfaces of the plasma tube. The plasma source generally comprises a coil having a first coil segment and a second coil segment, an RF power source connected to the coil and an enclosure disposed between the first coil segment and the second coil segment. The invention also provides a method for generating a plasma, comprising: disposing an enclosure between a first coil segment and a second coil segment; introducing a gas into the enclosure; and supplying an RF power to the coil segments to excite the gas into a plasma state. The invention provides a variety of coil operations, including symmetrical coil configuration, asymmetrical coil configuration with the matching networks adjusted to provide a low voltage near the plasma chamber, self-resonant configuration, grounded coil center configuration having coil segments driven in parallel and physically grounded near the plasma chamber, and pairs configurations having a plurality of coil segment pairs driven in series or parallel.

Claims

1. An apparatus for providing a plasma from a remote location to a processing chamber, comprising:

a) a coil having a first coil segment and a second coil segment;

b) an RF power source connected to the coil; and

c) an enclosure disposed between the first coil segment and the second coil segment.

2. The apparatus of claim 1, further comprising:

d) a first RF match network connected between the RF power source and the first coil segment; and

e) a second RF match network connected between the second coil segment and a ground.

3. The apparatus of claim 1 wherein an axis through the enclosure is substantially perpendicular to an axis through the coil.

4. The apparatus of claim 1 wherein the first and second coil segments comprise solenoidal windings.

5. The apparatus of claim 1 wherein the first and second coil segments have ferrite cores.

6. The apparatus of claim 1 wherein the coil has an elongated cross-section having a long cross sectional axis extending in a same direction as an axis through the enclosure.

7. The apparatus of claim 6 wherein the coil has an elliptical cross-sectional shape.

8. The apparatus of claim 6 wherein the coil has a rectangular cross-sectional shape.

9. The apparatus of claim 1 wherein the enclosure comprises a cylindrical enclosure having a gas inlet connectable to a gas source and a plasma outlet connectable to the process chamber.

10. The apparatus of claim 9 wherein the enclosure comprises a dielectric material.

11. The apparatus of claim 1 wherein the RF power source is connected to an outer end of each coil segment and wherein an inner end of each coil segment is connected to a ground.

12. The apparatus of claim 11 wherein the coil includes a grounded middle segment connecting the inner ends of the coil segments, wherein the enclosure is disposed adjacent the grounded middle segment.

13. The apparatus of claim 11, further comprising:

d) an RF match network connected between the RF power source and the coil segments.

14. The apparatus of claim 1, further comprising:

d) a first capacitor connected between an outer end of the first coil segment and ground; and

e) a second capacitor connected between an outer end of the second coil segment and ground.

15. The apparatus of claim 14 wherein the RF power source is connected to a middle coil segment between the first coil segment and the second coil segment.

16. The apparatus of claim 1 wherein the coil further comprises a third coil segment and a fourth coil segment and wherein the enclosure is disposed between the third coil segment and the fourth coil segment.

17. The apparatus of claim 16, further comprising:

d) a first RF match network connected between the RF power source and the first coil segment; and

e) a second RF match network connected between the fourth coil segment and a ground.

18. The apparatus of claim 1, further comprising:

d) a faraday shield disposed between the enclosure and the coil segments.

19. An apparatus for plasma processing, comprising:

a) a processing chamber; and

b) a remote plasma source, comprising;

i) a coil having a first coil segment and a second coil segment;

ii) an RF power source connected to the coil; and

iii) an enclosure having a gas inlet connected to a gas source and a plasma outlet connected to the chamber, the enclosure disposed between the first coil segment and the second coil segment.

20. The apparatus of claim 19, wherein the remote plasma source further comprises:

iv) a first RF match network connected between the RF power source and the first coil segment; and

v) a second RF match network connected between the second coil segment and a ground.

21. The apparatus of claim 19 wherein the enclosure comprises a dielectric material.

22. An apparatus for providing a plasma from a remote location to a processing chamber, comprising:

a) a coil having a first coil segment, a second coil segment and a middle segment connecting the first and second coil segments;

b) an RF power source connected to the coil; and

c) an enclosure disposed between the first coil segment and the second coil segment and adjacent the middle segment.

23. The apparatus of claim 22, further comprising:

d) a first RF match network connected between the RF power source and the first coil segment; and

e) a second RF match network connected between the second coil segment and a ground.

24. The apparatus of claim 22 wherein an axis through the enclosure is substantially perpendicular to an axis through the coil.

25. The apparatus of claim 22 wherein the coil has an elongated cross-section having a long cross sectional axis extending in a same direction as an axis through the enclosure.

26. The apparatus of claim 22 wherein the enclosure comprises a cylindrical dielectric enclosure having a gas inlet and a plasma outlet.

27. The apparatus of claim 22, further comprising:

d) an RF match network connected between the RF power source and an outer end of each coil segment; and

wherein the middle segment is connected to a ground.

28. A method for generating a plasma from a remote location to a chamber, comprising:

a) disposing an enclosure between a first coil segment and a second coil segment;

b) introducing a gas into the enclosure; and

c) supplying an RF power to the coil segments to excite the gas into a plasma.

29. The method of claim 28, further comprising:

d) tuning the first coil segment using a first RF match network disposed between an RF power source and the first coil segment; and

e) tuning the second coil segment using a second RF match network disposed between the second coil segment and a ground.

30. The method of claim 28, wherein the step of supplying an RF power to the coil comprises:

i) connecting an outer end of each coil segment to the RF power source; and

ii) grounding an inner end of each coil segment.

31. The method of claim 28, further comprising:

d) connecting a capacitor to an outer end of each coil segment to operate the coil in a self-resonant mode.

32. The method of claim 29, further comprising:

f) flowing the plasma from the enclosure to a processing chamber.

33. The method of claim 28, further comprising:

d) shielding the enclosure using a faraday shield disposed between the enclosure and the coil segments.

34. An apparatus for providing a plasma from a remote location to a processing chamber, comprising:

a) a coil having a first coil segment and a second coil segment, wherein the coil has an elongated cross-section having a long cross sectional axis extending in a same direction as an axis through the enclosure;

b) an RF power source connected to the coil; and

c) an enclosure disposed between the first coil segment and the second coil segment.

35. The apparatus of claim 34 wherein the coil has an elliptical cross-sectional shape.

36. The apparatus of claim 34 wherein the coil has a rectangular cross-sectional shape.

37. The apparatus of claim 34 wherein the coil has a middle segment connecting the first and second coil segments.