Encapsulated installation

• US 6,239,723 B1
• Filed: 07/31/1998
• Issued: 05/29/2001
• Est. Priority Date: 01/31/1996
• Status: Expired due to Fees

• Current Assignee: Siemens AG
• Original Assignee: Siemens AG
• Inventors: Scholl, Gerd, Magori, Valentin, Bulst, Wolf-Eckhart, Sczesny, Oliver, Reindl, Leonhard, Ostertag, Thomas, Bauerschmidt, Peter, Beierl, Ottmar, Lorenz, Dieter
• Primary Examiner(s): Horabik, Michael
• Assistant Examiner(s): Edwards, Jr., Timothy
• Application Number:
  US09/127,517
• Time in Patent Office: 1,033 Days
• Field of Search: 340/870.11, 340/693.5, 340/693.6, 340/647, 324/126, 324/536, 324/514
• US Class Current: 340/870.11
• CPC Class Codes: H01H 9/168 making use of an electromagnetic wave communication
• CPC Class Codes: H02B 13/065 Means for detecting or reacting to mechanical or electrical defects

Abstract

An encapsulated installation, in particular a switching installation for high or medium voltage, includes a plurality of sensors located in an interior of an encapsulation. A central monitoring device is provided for information interchange with the surface acoustic wave sensors. An antenna element of the monitoring device is disposed at the encapsulation and is directed towards the interior. The sensors can be interrogated selectively.

Claims

1. An encapsulated installation for electrical power, comprising:

an encapsulation having an interior and defining different gas areas;

a plurality of sensors to be interrogated selectively, said sensors having respective wireless transmitting/receiving elements, at least some of said sensors being disposed in said interior, and at least some of said sensors being disposed in said different gas areas; and

a monitoring device having an antenna element for wireless information interchange with said sensors, said antenna element being disposed at said encapsulation and directed towards said interior.

2. The encapsulated installation according to claim 1, wherein at least some of said sensors detect different measurement variables.

3. The encapsulated installation according to claim 1, wherein said sensors are active components.

4. The encapsulated installation according to claim 1, wherein said sensors are passive components.

5. The encapsulated installation according to claim 1, wherein said sensors are each disposed in said encapsulation at a potential of said encapsulation.

6. The encapsulated installation according to claim 1, including a conductor associated with said encapsulation, said sensors each disposed in said encapsulation at a potential of said conductor.

7. The encapsulated installation according to claim 1, wherein said encapsulation is metallic.

8. The encapsulated installation according to claim 1, including at least one switching device disposed in said encapsulation for high or medium voltage.

9. The encapsulated installation according to claim 1, including a conductor disposed in said encapsulation for high or medium voltage.

10. The encapsulated installation according to claim 1, wherein said transmitting/receiving elements are constructed for the transmission of optical, acoustic or electromagnetic waves.

11. The encapsulated installation according to claim 1, wherein said sensors are surface acoustic wave sensors.

12. The encapsulated installation according to claim 1, wherein said monitoring device has at least one interface for information interchange with other sensors, measurement sensors or detection devices.

13. The encapsulated installation according to claim 12, wherein said interface is a cable-based interface.

14. The encapsulated installation according to claim 12, wherein said interface is an electrical interface.

15. The encapsulated installation according to claim 12, wherein said interface is an optical interface.

16. The encapsulated installation according to claim 12, wherein said interface is a wireless interface.

17. The encapsulated installation according to claim 12, wherein said interface is provided for coupling to a monitoring device at an equivalent or higher level.

18. The encapsulated installation according to claim 1, wherein said sensors are selectively interrogated using a selective interrogation device.

19. The encapsulated installation according to claim 18, wherein said sensors are selectively interrogated using different channels for information transmission to said respective sensors.

20. The encapsulated installation according to claim 18, wherein said sensors are selectively interrogated using different frequencies for information transmission to said respective sensors.

21. The encapsulated installation according to claim 18, wherein said sensors are selectively interrogated using a frequency multiplex method.

22. The encapsulated installation according to claim 18, wherein said sensors are selectively interrogated using a time division multiplex method.

23. The encapsulated installation according to claim 18, wherein said sensors are selectively interrogated using polarization.

24. The encapsulated installation according to claim 18, wherein said sensors are selectively interrogated using correlation.

25. The encapsulated installation according to claim 18, wherein said sensors are selectively interrogated using an identification in a transmitted or response signal.