Integrated circuit inductors

• US 6,240,622 B1
• Filed: 07/09/1999
• Issued: 06/05/2001
• Est. Priority Date: 07/09/1999
• Status: Expired due to Term

• Current Assignee: Micron Technology, Inc.
• Original Assignee: Micron Technology, Inc.
• Inventors: Ahn, Kie Y., Forbes, Leonard
• Primary Examiner(s): Nguyen, Viet Q.
• Application Number:
  US09/350,601
• Time in Patent Office: 697 Days
• Field of Search: 296/04, 296/05, 296/06, 296/07, 296/031, 257/531, 257/528, 257/541
• US Class Current: 29/604
• CPC Class Codes: H01F 17/0033 with the coil helically wound around a magnetic core
• CPC Class Codes: H01F 27/2804 Printed windings
• CPC Class Codes: H01F 37/00 Fixed inductances not covered by group H01F17/00
• CPC Class Codes: H01L 27/08 including only semiconductor components of a single kind
• CPC Class Codes: Y10S 257/924 with passive device, e.g. capacitor, or battery, as integral part of housing or housing element, e.g. cap
• CPC Class Codes: Y10T 29/4902 Electromagnet, transformer or inductor
• CPC Class Codes: Y10T 29/49037 Using reference point/surface to facilitate measuring
• CPC Class Codes: Y10T 29/49069 Data storage inductor or core
• CPC Class Codes: Y10T 29/49071 by winding or coiling
• CPC Class Codes: Y10T 29/49073 by assembling coil and core
• CPC Class Codes: Y10T 29/49075 including permanent magnet or core

Abstract

The invention relates to an inductor comprising a plurality of interconnected conductive segments interwoven with a substrate. The inductance of the inductor is increased through the use of coatings and films of ferromagnetic materials such as magnetic metals, alloys, and oxides. The inductor is compatible with integrated circuit manufacturing techniques and eliminates the need in many systems and circuits for large off chip inductors. A sense and measurement coil, which is fabricated on the same substrate as the inductor, provides the capability to measure the magnetic field or flux produced by the inductor. This on chip measurement capability supplies information that permits circuit engineers to design and fabricate on chip inductors to very tight tolerances.

Claims

1. An inductor comprising:

a substrate having a first surface;

a ferromagnetic layer formed on the first surface; and

a coil including a plurality of conductive segments subtending the substrate.

2. The inductor of claim 1 wherein the substrate comprises a semiconductor.

3. An inductor comprising:

a substrate; and

a highly conductive path having an inductance value, and the highly conductive path comprising a plurality of interconnected conductive segments interwoven with the substrate, wherein each of the plurality of interconnected conductive segments has a mid-segment cross section profile selected from the group consisting of circular and rectangular.

4. The inductor of claim 3, wherein each of the plurality of interconnected conductive segments is fabricated from a different metal.

5. The inductor of claim 3, wherein each of the plurality of interconnected conductive segments is fabricated from one of two different metals.

6. By An inductor comprising:

a substrate having a first surface;

a ferromagnetic layer formed on the first surface;

a coil including a plurality of conductive segments subtending the substrate; and

an insulating layer formed between the ferromagnetic layer and the first surface.

7. The inductor of claim 6, wherein the coil has a substantially triangular shape.

8. The inductor of claim 6, wherein the coil has a substantially square shape.

9. The inductor of claim 6, wherein the coil has a substantially rectangular shape.

10. The inductor of claim 6, wherein each of the plurality of conductive segments subtending the substrate comprise a substantially hollow conductive segment.

11. The inductor of claim 6, wherein each of the plurality of conductive segments subtending the substrate comprise a conductive segrnent having a substantially square cross-sectional shape.

12. The inductor of claim 6, wherein the coil is formed from copper.

13. The inductor of claim 6, wherein the coil is formed from aluminum.

14. An inductor comprising:

a semiconductor; and

a highly conductive path having an inductance value, and the highly conductive path comprising a plurality of interconnected conductive segments interwoven with the semiconductor, wherein each of the plurality of interconnected conductive segments has a mid-segment cross section profile selected from the group consisting of circular and rectangular.

15. The inductor of claim 14, wherein the semiconductor comprises silicon.

16. The inductor of claim 14, wherein the semiconductor comprises gallium arsenide.

17. The inductor of claim 14, wherein the semiconductor comprises germanium.

18. An inductor comprising:

a substrate; and

a highly conductive path having an inductance value, and the highly conductive path comprising a plurality of interconnected conductive segments interwoven with the substrate, wherein each of the plurality of interconnected conductive segments has a mid-segment cross section profile selected from the group consisting of circular and rectangular, and the substrate is at least partially coated with a ferromagnetic material.

19. The inductor of claim 18, wherein the substrate is at least partially coated with a magnetic oxide.

20. The inductor of claim 18, wherein each of the plurality of interconnected conductive segments is formed from copper.