×

Method and device for full-thickness resectioning of an organ

  • US 6,241,140 B1
  • Filed: 10/25/2000
  • Issued: 06/05/2001
  • Est. Priority Date: 06/19/1998
  • Status: Expired due to Term
First Claim
Patent Images

1. A full-thickness resection system for removing a full-thickness portion of a body organ, the system comprising:

  • a flexible endoscope;

    a stapling mechanism, wherein the endoscope is slidably received through at least a portion of the stapling mechanism, the stapling mechanism comprising;

    an anvil;

    a stapling head coupled to the anvil so that the anvil and the stapling head are moveable with respect to one another between a tissue receiving position and a stapling position, wherein a gap formed between the stapling head and the anvil is larger in the tissue receiving position than it is in the stapling position;

    a position adjusting mechanism for moving at least one of the anvil and the stapling head relative to the other of the anvil and the stapling head between the tissue receiving and stapling positions;

    a staple firing mechanism for sequentially firing, when a plurality of staples are received in the stapling head and the stapling head and the anvil are in the stapling position, the plurality of staples in groups of at least one from the stapling head across the gap against the anvil and through any tissue received in the gap;

    a knife for cutting a portion of tissue received within the gap; and

    a control unit which remains outside the body, the control unit being coupled to the stapling mechanism for controlling operation of the position adjusting mechanism and the staple firing mechanism.

View all claims
  • 0 Assignments
Timeline View
Assignment View
    ×
    ×