Method for fabricating micro inertia sensor
First Claim
1. A method of fabricating a micro inertia sensor, comprising:
- (a) bonding bulk silicon to a glass substrate;
(b) forming an inertia sensor structure by anisotropically etching the bulk silicon;
(c) forming a vacuum space by etching glass below the silicon inertia sensor structure;
(d) depositing a metal for use as an electrode on a top surface and the surface of the silicon inertia sensor structure which has been etched.
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Abstract
A micro inertia sensor fabrication method in which thick silicon bonded to glass is processed at a high sectional ratio, is provided. In this method, silicon is bonded to a glass substrate, the bonded silicon is polished to have a desired thickness, a silicon structure is formed by etching the polished silicon using an RIE method, and the silicon structure is separated from the bottom by selectively etching glass below the silicon structure via grooves in etched silicon. Since the thick silicon bonded to glass is processed at a high sectional ratio, the area and thickness of the silicon to be measured are increased. Also, this method is simple since only one mask is used.
32 Citations
14 Claims
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1. A method of fabricating a micro inertia sensor, comprising:
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(a) bonding bulk silicon to a glass substrate;
(b) forming an inertia sensor structure by anisotropically etching the bulk silicon;
(c) forming a vacuum space by etching glass below the silicon inertia sensor structure;
(d) depositing a metal for use as an electrode on a top surface and the surface of the silicon inertia sensor structure which has been etched. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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Specification