Photovoltaic device and process for producing the same
First Claim
1. A photovoltaic device comprising a pin junction of a player, an i-layer and an n-layer,wherein the p-layer includes a first p-layer and a second p-layer thereover, the first p-layer having a thickness of 5 nm or less and being uniformly doped with a p-type impurity, and the second p-layer being formed by decomposition of a gas which does not positively incorporate a p-type impurity;
- wherein each of the first p-layer and the second p-layer comprises one of (a) hydrogenated amorphous silicon (a-Si;
H), (b) hydrogenated amorphous germanium (a-Ge;
H), and (c) hydrogenated amorphous silicon germanium (a-SiGe;
H); and
wherein the first p-layer is formed directly on a transparent electrode.
1 Assignment
0 Petitions
Accused Products
Abstract
A photovoltaic device have a pin junction of a p-layer, an i-layer and an n-layer, wherein the p-layer includes a first p-layer and a second p-layer thereover, the first p-layer having a thickness of 5 nm or less and being uniformly doped with a p-type impurity, and the second p-layer being formed by decomposition of a gas which does not positively incorporate a p-type impurity.
-
Citations
14 Claims
-
1. A photovoltaic device comprising a pin junction of a player, an i-layer and an n-layer,
wherein the p-layer includes a first p-layer and a second p-layer thereover, the first p-layer having a thickness of 5 nm or less and being uniformly doped with a p-type impurity, and the second p-layer being formed by decomposition of a gas which does not positively incorporate a p-type impurity; -
wherein each of the first p-layer and the second p-layer comprises one of (a) hydrogenated amorphous silicon (a-Si;
H), (b) hydrogenated amorphous germanium (a-Ge;
H), and (c) hydrogenated amorphous silicon germanium (a-SiGe;
H); and
wherein the first p-layer is formed directly on a transparent electrode. - View Dependent Claims (2, 3, 4, 5, 6)
wherein at least one p-layer adjacent to an n-layer includes a first p-layer which is doped predominantly with the p-type impurity while it is also doped with a smaller amount of an n-type impurity than the p-type impurity and which has a thickness of 5 nm or less, and a second p-layer in which the content of the p-type impurity becomes lower as the second p-layer is closer to the i-layer. -
5. A photovoltaic device according to claim 4, wherein the at least one p-layer has a larger optical band gap on a side to the n-layer and a smaller optical band gap on a side to the i-layer.
-
6. A photovoltaic device according to claim 1, wherein the second p-layer comprises a plurality of layers having light absorption coefficients which are greater as the layers are closer to the i-layer.
-
-
7. A process for producing a photovoltaic device having a pin junction of a p-layer, an i-layer and an n-layer, the process comprising:
-
forming a first p-layers which has a thickness of 5 nm or less and is uniformly doped with a p-type impurity, directly on a transparent electrode;
forming a second p-layer by decomposition of a gas which does not positively incorporate a p-type impurity, thereby to obtain the second p-layer, wherein each of the first p-layer and the second p-layer of the p-layer each comprises one of;
(a) hydrogenated amorphous silicon (a-Si;
H), (b) hydrogenated amorphous germanium (a-Ge;
H), and (c) hydrogenated amorphous silicon germanium (a-SiGe;
H); and
forming the i-layer and n-layer in this order. - View Dependent Claims (8, 9, 10, 11, 12, 13)
-
-
14. A photovoltaic device comprising a pin junction of a p-layer, an i-layer and an n-layer,
wherein the p-layer includes a first p-layer and a second p-layer thereover, the first p-layer having a thickness of 5 nm or less and being uniformly doped with a p-type impurity, and the second p-layer being formed by decomposition of a gas which does not positively incorporate a p-type impurity; - and
wherein the second p-layer comprises a plurality of layers having light absorption coefficients which are greater as the layers are closer to the i-layer.
- and
Specification