Nitride compound semiconductor light emitting device
First Claim
1. A nitride compound semiconductor light emitting device including an active layer, a current blocking layer and a contact layer, wherein said current blocking layer has an opening so that a current can be selectively injected into said active layer, said current blocking layer is interposed between said active layer and said contact layer and said current blocking layer is made of an oxide of a metal selected from the group consisting of titanium (Ti), magnesium (Mg), nickel (Ni), chromium (Cr), scandium (Sc), zinc (Zn), indium (In), tin (Sn) and tungsten (W).
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Abstract
In order to remove the problems in conventional nitride compound semiconductor laser structures, namely, high operation voltage caused by a high resistance in a p-type layer and a high contact resistance of an electrode, damage to the crystal caused by dry etching, insufficient current injection, and the need for a high current density, a nitride compound semiconductor light emitting device has current blocking layers made of n-type B(1−x−y−z)InxAlyGazN (0≦x≦1, 0≦y≦1, 0≦z≦1) single crystal containing an oxide of a predetermined metal, carbon and impurities exhibiting p-type and n-type conductivity, or i-type B(1−x−y−z)InxAlyGazN (0≦x≦1, 0≦y≦1, 0≦z≦1) single crystal in which carriers are inactivated by hydrogen or oxygen to realize an internal current blocking structure without the need for dry etching. By applying a reverse bias voltage, the semiconductor can be activated only along a current path, and the remainder region is utilized as a current blocking layer. When the n-side electrode has a unique three-layered structure, a reduction in contact resistance and good wire bonding are promised.
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Citations
19 Claims
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1. A nitride compound semiconductor light emitting device including an active layer, a current blocking layer and a contact layer, wherein said current blocking layer has an opening so that a current can be selectively injected into said active layer, said current blocking layer is interposed between said active layer and said contact layer and said current blocking layer is made of an oxide of a metal selected from the group consisting of titanium (Ti), magnesium (Mg), nickel (Ni), chromium (Cr), scandium (Sc), zinc (Zn), indium (In), tin (Sn) and tungsten (W).
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2. A nitride compound semitting device having an active layer and a current blocking layer, wherein said current blocking layer has an opening so that a current can be selectively injected into said active layer and said current blocking layer is made of i-type B(1−
- x−
y−
z)InxAlyGazN single-crystal (0≦
x≦
1, 0≦
y≦
1, 0≦
z≦
1) in which carriers are inactivated by hydrogen or oxygen.
- x−
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3. A nitride compound semiconductor light emitting device having an active layer and a current blocking layer, wherein said current blocking layer has an opening so that a current can be selectively injected into said active layer and said current blocking layer is made of B(1−
- x−
y−
z)InxAlyGazN single-crystal (0≦
x≦
1, 0≦
y≦
1, 0≦
z≦
1) including magnesium and oxygen. - View Dependent Claims (4)
- x−
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5. A nitride compound semiconductor light emitting device having a current blocking layer, wherein said current blocking layer is made of an n-type B(1−
- x−
y−
z)InxAlyGazN single-crystal (0≦
x≦
1, 0≦
y≦
1, 0≦
z≦
1) containing both a p-type impurity and an n-type impurity. - View Dependent Claims (6)
- x−
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7. A nitride compound semiconductor light emitting device comprising:
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an electrically conductive nitride compound semiconductor layer;
a current blocking layer stacked on said nitride compound semiconductor layer and having an opening;
a buffer layer made of B(1−
x−
y−
z)InxAlyGazN (0≦
x≦
1, 0≦
y≦
1, 0≦
z≦
1) stacked to cover said current blocking layer and said nitride compound semiconductor layer at said opening; and
a layer made of B(1−
x2−
y2−
z2)Inx2Aly2Gaz2N (0≦
x2≦
1, 0≦
y2≦
1, 0≦
z2≦
1) stacked on said buffer layer.- View Dependent Claims (8, 9, 10, 11, 12, 13, 14, 15)
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16. A nitride compound semiconductor light emitting device comprising:
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a substrate;
a first buffer layer stacked on said substrate;
an electrically conductive layer stacked on said buffer layer and made of B(1−
x1−
y1−
z1)Inx1Aly1Gaz1N (0≦
x1≦
1, 0≦
y1≦
1, 0≦
z1≦
1);
a current blocking layer stacked on said electrically conductive layer and having an opening;
a second buffer layer stacked to cover said current blocking layer and said electrically conductive layer at said opening, said second buffer layer being made of a B(1−
x2−
y2−
z2)Inx2Aly2Gaz2N (0≦
z2≦
1, 0≦
y2≦
1, 0z2≦
1); and
an active layer stacked on said second buffer layer and made of B(1−
x3−
y3−
z3)Inx3Aly3Gaz3N (0≦
x3≦
1, 0≦
y3≦
1, 0≦
z3≦
1).- View Dependent Claims (17, 18, 19)
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Specification