Interposer for semiconductor components having contact balls

• US 6,242,932 B1
• Filed: 02/19/1999
• Issued: 06/05/2001
• Est. Priority Date: 02/19/1999
• Status: Expired due to Term

• Current Assignee: Micron Technology, Inc.
• Original Assignee: Micron Technology, Inc.
• Inventors: Hembree, David R.
• Primary Examiner(s): Metjahic, Safet
• Assistant Examiner(s): LEROUX, ETIENNE PIERRE
• Application Number:
  US09/253,632
• Time in Patent Office: 837 Days
• Field of Search: 324/755, 324/761, 324/765, 439/66-70
• US Class Current: 324/756.02
• CPC Class Codes: G01R 1/0425 Test clips, e.g. for IC's
• CPC Class Codes: G01R 1/0483 Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips for IC's with connecting points around the edges only G01R1/0433
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73253 Bump and layer connectors
• CPC Class Codes: H01L 2924/15184 in different layers of the multilayer substrate
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H05K 1/11 Printed elements for providing electric connections to or between printed circuits
• CPC Class Codes: H05K 3/325 by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor adaptations of leads inserted in holes for press-fit connections H05K3/308

Abstract

An interposer for electrically engaging semiconductor components having contact balls is provided. In a testing embodiment, the interposer configures a test socket for testing semiconductor components with different configurations of contact balls. In an assembly embodiment, the interposer can be used in the fabrication of an electronic assembly, to configure a substrate of the assembly for use with semiconductor components having different configurations of contact balls. The interposer includes a base having external contacts, an interconnect having contacts for electrically engaging the contact balls on the component, and an alignment member for aligning the component to the interconnect. The interconnect contacts can be made using semiconductor fabrication techniques for accommodating small, closely spaced contact balls on the components. In addition, conductors on the base and interconnect can have a “fan out” configuration, which permits contacts on the test socket, or substrate, to have a larger size and pitch than the contact balls on the component.

Claims

1. In a test system for testing a semiconductor component having an array of contact balls and including a socket having a plurality of contacts configured to electrically engage the contact balls, an interposer constructed to configure the socket for testing components having different arrays of contact balls, the interposer comprising:

a base comprising an array of external contact balls configured for mating electrical engagement with the contacts on the socket; and

an interconnect on the base comprising an array of interconnect contacts more closely spaced than, and in electrical communication with the external contact balls on the base, and configured to electrically engage the contact balls on the component;

the interposer interchangeable with a second interposer substantially similar thereto but adapted to configure the socket for electrical communication with a second component having an array of second contact balls.

2. The interposer of claim 1 further comprising an alignment member on the base configured to align the contact balls on the component to the interconnect contacts on the interconnect.

3. The interposer of claim 1 wherein the array of contact balls on the component, the array of external contact balls on the base, and the array of second contact balls on the second component each comprise a ball grid array.

4. The interposer of claim 1 wherein the alignment member comprises a plate or a polymer layer on the interconnect having an opening configured to engage a periphery of the component.

5. In a test system for testing a semiconductor component having contact balls in a first ball grid array and including a socket having a plurality of contacts configured to electrically engage the contact balls, an interposer constructed to configure the socket for testing different components having contact balls in different arrays, the interposer comprising:

a base comprising a plurality of external contact balls in a second ball grid array configured for mating electrical engagement with the contacts on the socket;

an interconnect on the base comprising a plurality of interconnect contacts in electrical communication with the external contact balls on the base and configured to form temporary electrical connections with the contact balls on the component; and

an alignment member on the base configured to align the component to the interconnect;

the interposer interchangeable with a second interposer substantially similar thereto but adapted to configure the interposer and the socket for electrically engaging a different component having a plurality of second contact balls in a different ball grid array.

6. The interposer of claim 5 wherein the alignment member comprises a plate or a polymer layer on the base having an opening for engaging a periphery of the component.

7. The interposer of claim 5 further comprising a plurality of fan out conductors on the base in electrical communication with the interconnect contacts on the interconnect and in electrical communication with the external contact balls on the base.

8. The interposer of claim 5 wherein the interconnect contacts comprise conductive pockets configured to retain the contact balls on the component.

9. The interposer of claim 5 wherein the interconnect contacts comprise conductive pockets in an elastomeric layer configured to retain the contact balls on the component.

10. The interposer of claim 5 wherein the interconnect contacts comprise projections configured to penetrate the contact balls on the component.

11. In a test system for testing semiconductor components including a test socket having contacts for electrically engaging a semiconductor component having contact balls in a first ball grid array, an interposer constructed to configure the test socket for testing different types of semiconductor components with different ball grid arrays comprising:

a base comprising a plurality of external contacts comprising balls in a second ball grid array with a larger pitch than the first ball grid array configured for mating electrical engagement with the contacts on the test socket;

an interconnect on the base comprising a plurality of interconnect contacts in electrical communication with the external contacts on the base and configured to electrically engage the contact balls on the component; and

an alignment member on the base configured to align the component to the interconnect.

12. The interposer of claim 11 wherein the contact balls on the component comprise solder balls.

13. The interposer of claim 12 wherein the external contacts on the base have a first pitch greater than a second pitch of the interconnect contacts.

14. The interposer of claim 13 wherein the component comprises a package or a die.

15. The interposer of claim 11 wherein the alignment member comprises a photoimageable polymer.

16. The interposer of claim 11 wherein the alignment member comprises a plate having an alignment opening for contacting a periphery of the component.

17. An interposer constructed to configure a test socket having a plurality of contacts in a first grid array for testing a semiconductor component having a plurality of contact balls in a second grid array comprising:

a base configured for mounting to the test socket, the base comprising a plurality of external contacts comprising balls configured for electrical engagement with the contacts on the test socket and a plurality of fan out conductors in electrical communication with the external contacts;

an interconnect on the base comprising a plurality of interconnect contacts in the second grid array, the interconnect contacts in electrical communication with the conductors on the base and configured to form temporary electrical connections with the contact balls on the component; and

an alignment member on the base configured to align the component to the interconnect;

the interposer configured for use with a second interposer constructed to configure the socket for electrical communication with a second component having a plurality of second contact balls in a third grid array.

18. The interposer of claim 17 wherein the component comprises a chip scale package.

19. The interposer of claim 18 wherein the contact balls on the component each have a diameter of about 0.127 mm to about 0.762 mm.

20. The interposer of claim 18 wherein the second grid array has a pitch of from about 0.228 mm to 2.0 mm.

21. An interposer for constructing electronic assemblies that include a substrate having a plurality of contacts and a semiconductor component having contact balls in a first grid array comprising:

a base comprising a plurality of external contacts comprising balls in a second grid array bonded to the contacts on the substrate; and

an interconnect on the base comprising a plurality of second contacts in the first grid array, the second contacts in electrical communication with the external contacts on the base and configured to electrically engage the contact balls on the component;

the base and the interconnect configuring the substrate for electrical communication with the contact balls on the component,

the interposer interchangeable with a second interposer substantially similar thereto but adapted to configure the substrate for electrical communication with a second component having a plurality of second contact balls in a grid array different than the first grid array.

22. The interposer of claim 21 wherein the substrate comprises a circuit board and the contacts comprise pads.

23. The interposer of claim 21 wherein the substrate and the component comprise an electronic module or a multi chip module.

24. The interposer of claim 21 wherein the first grid array, the second grid array and the grid array each comprise a ball grid array.

25. An interposer for constructing electronic assemblies that include a substrate having a plurality of contacts and a semiconductor component having a plurality of contact balls comprising:

a base comprising a plurality of external contacts comprising balls in a first ball grid array bonded to the contacts on the substrate;

an interconnect on the base comprising a plurality of second contact balls in a second ball grid array with a smaller pitch than the first ball grid array, in electrical communication with the external contacts on the base and configured to form electrical connections with the contact balls on the component; and

an alignment member on the base for aligning the component to the interconnect;

the base, the interconnect and the alignment member configuring the substrate for electrically engaging the component,

the interposer interchangeable with a second interposer substantially similar thereto but adapted to configure the interposer and the substrate for electrically engaging a second component having a plurality of second contact balls in a third ball grid array.

26. The interposer of claim 25 wherein the substrate comprise a circuit board or a multi chip module board.