Hermetic package with external patch antenna and associated method

• US 6,243,040 B1
• Filed: 08/03/1999
• Issued: 06/05/2001
• Est. Priority Date: 08/03/1999
• Status: Expired due to Term

• Current Assignee: The Boeing Co.
• Original Assignee: The Boeing Co.
• Inventors: Swanson, Dale W., Woolston, Francis J., Corey, Roger L.
• Primary Examiner(s): Le, Hoanganh
• Assistant Examiner(s): CHEN, SHIH CHAO
• Application Number:
  US09/368,057
• Time in Patent Office: 672 Days
• Field of Search: H01/Q.138, 343/700.MS, 343/878, 343/702, 343/701, 343/745
• US Class Current: 343/700.0MS
• CPC Class Codes: H01Q 1/38 formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H01Q 1/40 Radiating elements coated with or embedded in protective material
• CPC Class Codes: H01Q 9/0407 Substantially flat resonant element parallel to ground plane, e.g. patch antenna dipole H01Q9/285; monopole H01Q9/40

Abstract

An antenna package includes a lid-like structure that fits onto an electrically conductive, metallic box-like structure. The lid-like structure includes an electrically conductive, metallic seal member that is connected to an antenna and defines a primary opening. The antenna includes a dielectric mounted between an inner metallic layer and an outer metallic layer. The connection between the seal member and the antenna is a substantially hermetic, soldered connection between the seal member and the inner metallic layer, such that the inner metallic layer is electrically connected to the seal member. The soldered connection secures the antenna to the seal member such that the inner metallic layer occludes the primary opening. A substantially hermetic, fused connection is provided between the lid-like structure and the box-like structure so that a hermetically sealed chamber is defined within the box-like structure. Electric circuitry is positioned in the chamber and is connected to the antenna. A connector opening or openings may be defined through the seal member, and an electrical connector, such as a coaxial cable, extends through at least one of the connector openings. The lid-like structure can be formed by placing solder between the inner metallic layer of the antenna and the outer surface of the seal member, and introducing a heating tool into the primary opening so as to melt the solder and thereby solder the inner metallic layer to the seal member.

Claims

1. An antenna package, comprising:

a first structure, comprising;

an electrically conductive seal member defining at least one opening,

an antenna comprising a dielectric mounted between an inner metallic layer and an outer metallic layer, and

a substantially hermetic, soldered connection between the seal member and the inner metallic layer, wherein the soldered connection secures the antenna to the seal member such that the inner metallic layer occludes the opening;

a second structure; and

a substantially hermetic connection between the first and second structures, wherein at least the first and second structures, the hermetic connection between the first and second structures and the soldered connection are such that a substantially hermetically sealed chamber is defined at least between the first and second structures.

2. An antenna package according to claim 1, wherein the second structure is a box-like structure and the first structure is a lid-like structure for the box-like structure.

3. An antenna package according to claim 1, wherein the outer metallic layer is substantially electrically isolated from the seal member and the second structure.

4. An antenna package according to claim 1, wherein:

the seal member comprises a peripheral part;

the second structure comprises a peripheral part; and

the hermetic connection between the first and second structures comprises a fused connection between the peripheral part of the seal member and the peripheral part of the second structure.

5. An antenna package according to claim 1, wherein:

the seal member comprises;

an outer surface, wherein at least a portion of the outer surface is adjacent the inner metallic layer,

an inner surface, wherein at least a portion of the inner surface faces and at least partially defines the chamber, and

at least one wall extending between the inner and outer surfaces of the seal member and at least partially extending around the opening; and

the soldered connection extends between at least a portion of the outer surface of the seal member and at least a portion of the inner metallic layer, and the soldered connection also extends between at least a portion of the wall of the seal member and at least a portion of the inner metallic layer.

6. An antenna package according to claim 5, wherein at least a portion of the inner metallic layer faces and at least partially defines the chamber.

7. An antenna package according to claim 5, wherein the outer surface of the seal member comprises plating that is adjacent the inner metallic layer of the antenna.

8. An antenna package according to claim 1, further comprising electronic circuitry positioned in the chamber and an electrical connection between the electronic circuitry and the antenna.

9. An antenna package according to claim 8, further comprising an inert gas within the chamber, wherein the concentration of the gas within the chamber is greater than the concentration of the gas in the ambient air.

10. An antenna package according to claim 9, wherein the gas is nitrogen.

11. An antenna package according to claim 8, wherein:

the package defines a second opening; and

a data cable extends through the second opening and is connected to the electronic circuitry.

12. An antenna package according to claim 11, wherein the second opening is defined through the seal member.

13. An antenna package according to claim 8, wherein the electrical connection between the antenna and the electric circuitry comprises an electrical connector extending between the electronic circuitry and the antenna.

14. An antenna package according to claim 13, wherein:

the package defines a second opening; and

the electrical connector extends through the second opening and comprises a first end connected to the electronic circuitry and a second end connected to the outer metallic layer of the antenna.

15. An antenna package according to claim 14, wherein:

the package defines a third opening; and

a data cable extends through the third opening and is connected to the electronic circuitry.

16. An antenna package according to claim 15, wherein the second and third openings are defined through one or more parts of the package selected from the seal member and the second structure.

17. A method of forming an antenna package, comprising the steps of:

forming a first structure by connecting an inner metallic layer of an antenna to an outer surface of an electrically conductive seal member so that the inner metallic layer hermetically occludes an opening defined through the seal member and an outer metallic layer of the antenna is electrically isolated from the seal member, wherein the connecting step comprises the steps of;

placing solder between the inner metallic layer of the antenna and the outer surface of the seal member, and

introducing a heating tool into the opening to so as to melt the solder and thereby solder the inner metallic layer to the seal member; and

connecting the first structure to a second structure such that an at least partially hermetically sealed chamber is defined at least between the first and second structures.

18. The method of claim 17, wherein the step of placing solder comprises the steps of:

placing the antenna on a substantially horizontal surface so that the inner metallic layer is facing upward;

placing solder on the inner metallic layer while the inner metallic layer is facing upward; and

placing the outer surface of the seal member on the solder while the inner metallic layer is facing upward and the solder is upon the inner metallic layer.