Cooled IC chip modules with an insulated circuit board

• US 6,243,268 B1
• Filed: 10/12/1999
• Issued: 06/05/2001
• Est. Priority Date: 10/12/1999
• Status: Expired due to Fees

• Current Assignee: International Business Machines Corporation
• Original Assignee: International Business Machines Corporation
• Inventors: Singh, Prabjit, Schmidt, Roger R., Mahaney, Howard Victor Jr., Kang, Sukhvinder
• Primary Examiner(s): Picard, Leo P.
• Assistant Examiner(s): Datskovsky, Michael
• Application Number:
  US09/416,074
• Time in Patent Office: 602 Days
• Field of Search: 361/711-719, 361/687-699, 361/700-704, 361/743-760, 257/706-727, 174/15.1, 174/16.2, 174/16.3, 165/80.3, 165/80.4, 165/104.21, 165/104.24, 165/104.33, 219/200, 219/201, 219/209, 219/210, 62/521, 622/592, 622/72, 622/73, 621/56, 62/512
• US Class Current: 361/715
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A cooling assembly for an integrated circuit chip module wherein an evaporator-cooled IC module mounted on a printed circuit board is enclosed within an insulated housing, and the area of the printed circuit board adjacent the cooled IC module is encapsulated in an insulated jacket.

Claims

1. A cooling assembly for an integrated circuit chip module mounted on a printed circuit board substrate comprising:

an evaporator unit having a thermal interface in thermal communication with said integrated circuit chip module so as to cool said module to a temperature below ambient dew point;

an insulated housing having its base attached to said printed circuit board substrate and surrounding the outer perimeter of said integrated circuit module so as to enclose said evaporator unit and said integrated circuit module; and

,

an insulated jacket encapsulating an area of the printed circuit board adjacent the area where the insulated housing is attached to the printed circuit board, said insulated jacket further encapsulating both the top side and bottom side of the printed circuit board.

2. The cooling assembly of claim 1 wherein the insulated jacket extends from the area of the printed circuit board adjacent to the area where the insulated housing is attached to the printed circuit board to include the area on the bottom side of the printed circuit board where the module is mounted on the printed circuit board.

3. The cooling assembly of claim 2 wherein the area of the printed circuit board encapsulated by the insulated jacket is in flow communication with the area of the printed circuit board where the module is mounted on the printed circuit board.

4. The cooling assembly of claim 1 wherein electronic devices mounted on the printed circuit board are encapsulated within the insulated jacket.

6. The cooling assembly of claim 3 wherein the insulated jacket extends to encapsulate all of the electronic devices mounted on the printed circuit board.

7. The cooling assembly of claim 1 wherein the insulated jacket is fabricated from thermal insulating material selected from the group consisting of polyurethane foam and expanded polystyrene.

5. The cooling assembly of claim 5 wherein said electronic devices include SRAM chips mounted on the printed circuit board.