Fully integrated amplified loudspeaker

• US 6,243,472 B1
• Filed: 09/17/1997
• Issued: 06/05/2001
• Est. Priority Date: 09/17/1997
• Status: Expired due to Fees

• Current Assignee: Bilan, Frank Albert, Jules Joseph Jelinek
• Original Assignee: Bilan, Frank Albert, Jules Joseph Jelinek
• Inventors: Bilan, Frank Albert, Jelinek, Jules Joseph
• Primary Examiner(s): Mei, Xu
• Application Number:
  US08/932,738
• Time in Patent Office: 1,357 Days
• Field of Search: 381/159, 381/397, 381/117, 381/161, 381/164, 381/393, 381/394, 381/396, 381/410, 381/412, 381/433, 381/FOR.159, 381/407, 381/400, 381/401, 295/94, 296/091, 361/704, 361/705, 361/706
• US Class Current: 381/117
• CPC Class Codes: H04R 1/06 Arranging circuit leads; Relieving strain on circuit leads
• CPC Class Codes: H04R 9/025 Magnetic circuit
• CPC Class Codes: H04R 9/063 using a plurality of acoustic drivers H04R1/24 and H04R1/403 take precedence
• CPC Class Codes: Y10T 29/49005 Acoustic transducer

Abstract

A fully integrated, low cost, amplified electro-acoustic loudspeaker is disclosed in which an amplifier circuit (30, 130, 230, 330, 930, 1030), radio-frequency receiver amplifier circuit (430, 530), optical receiver amplifier circuit (630, 730), or network based amplifier circuit (830) is directly mounted on the loudspeaker'"'"'s magnetic assembly (105, 505, 705, 805), contained within the loudspeaker'"'"'s moving assembly (20, 29, 629, 42, 45, 50, 65), or a combination thereof. The amplified loudspeaker'"'"'s magnetic assembly (5, 105, 405, 505, 705, 805, 905, 1005) is utilized as an electro-magnetic interference shield and/or a heat dissipating element for the attached electronic circuitry. In selected embodiments of the amplified loudspeaker system, the former (42) containing voice coil (45) is additionally utilized for convection cooling of the amplifier circuit (30, 230) or receiver/amplifier circuit combination (430, 630).

Claims

1. A loudspeaker device comprising:

a magnetic assembly having a magnetic gap;

a former;

a voice coil wound around said former and positioned in said magnetic gap;

a first inductive component wound around a portion of said former positioned outside of said magnetic gap and electrically coupled in series with said voice coil;

a substrate mounted on said former, said substrate comprising a layer of thermally conductive material, and a layer of electrically conductive traces; and

an amplifier circuit thermally coupled to said layer of thermally conductive material, said amplifier circuit comprising an input and a first output,

wherein said first output of said amplifier circuit is electrically coupled to said voice coil through said first inductive component.

2. The loudspeaker device of claim 1 wherein said layer of thermally conductive material comprises aluminum.

3. The loudspeaker device of claim 1 wherein said layer of thermally conductive material comprises beryllium.

4. The loudspeaker device of claim 1 wherein said amplifier circuit comprises at least one integrated circuit.

5. The loudspeaker device of claim 1 wherein said amplifier circuit comprises a class D amplifier.

6. A loudspeaker device comprising:

a magnetic assembly having a magnetic gap;

a former;

a voice coil wound around said former and positioned in said magnetic gap;

a first inductive component wound around a portion of said former positioned outside of said magnetic gap and electrically coupled in series with said voice coil;

a second inductive component a) wound around a portion of said former positioned outside of said magnetic gap, b) electrically coupled in series with said voice coil and c) electrically coupled to said first inductive component through said voice coil;

a first capacitive component electrically coupled between said first inductive component and said voice coil;

a second capacitive component electrically coupled between said second inductive component and said voice coil;

a substrate mounted on said former, said substrate comprising a layer of thermally conductive material, and a layer of electrically conductive traces; and

an amplifier circuit thermally coupled to said layer of thermally conductive material and comprising an input, a first output and a second output,

wherein said first output of said amplifier circuit is electrically coupled to said voice coil through said first inductive component and said second output of said amplifier circuit is electrically coupled to said voice coil through said second inductive component.

7. The loudspeaker device of claim 6 wherein said layer of thermally conductive material comprises aluminum.

8. The loudspeaker device of claim 6 wherein said layer of thermally conductive material comprises beryllium.

9. The loudspeaker device of claim 6 wherein said amplifier circuit comprises an integrated circuit.

10. The loudspeaker device of claim 6 wherein said amplifier circuit comprises a class D amplifier.

11. A loudspeaker device comprising:

a magnetic assembly having a magnetic gap;

a former;

a voice coil wound around said former and positioned in said magnetic gap;

a first inductive component wound around a portion of said former positioned outside of said magnetic gap and electrically coupled in series with said voice coil;

a second inductive component a) wound around a portion of said former positioned outside of said magnetic gap, b) electrically coupled in series with said voice coil and c) electrically coupled to said first inductive component through said voice coil;

a substrate mounted on said former, said substrate comprising a layer of thermally conductive material, and a layer of electrically conductive traces; and

an amplifier circuit thermally coupled to said layer of thermally conductive material and comprising an input, a first output and a second output,

wherein said first output of said amplifier circuit is electrically coupled to said voice coil through said first inductive component and said second output of said amplifier circuit is electrically coupled to said voice coil through said second inductive component.

12. The loudspeaker device of claim 11 wherein said layer of thermally conductive material comprises aluminum.

13. The loudspeaker device of claim 11 wherein said layer of thermally conductive material comprises beryllium.

14. The loudspeaker device of claim 11 wherein said amplifier circuit comprises an integrated circuit.

15. The loudspeaker device of claim 11 wherein said amplifier circuit comprises a class D amplifier.

16. A loudspeaker device comprising:

a magnetic assembly having a magnetic gap;

a former;

a voice coil wound around said former and positioned in said magnetic gap;

a substrate mounted on said former, said substrate comprising a layer of thermally conductive material, and a layer of electrically conductive traces; and

an amplifier circuit thermally coupled to said layer of thermally conductive material and comprising an input and a first output,

wherein said first output of said amplifier circuit is electrically coupled to said voice coil.

17. The loudspeaker device of claim 16 further comprising a power supply mounted on at least one surface of said magnetic assembly and electrically coupled to said amplifier circuit.

18. The loudspeaker device of claim 16 further comprising a radio frequency receiver mounted on said substrate and including an output electrically coupled to said input of said amplifier circuit.

19. The loudspeaker device of claim 18 further comprising a power supply mounted on at least one surface of said magnetic assembly and electrically coupled to said amplifier circuit and to said radio frequency receiver.

20. The loudspeaker device of claim 16 further comprising:

an optical interface mounted on said substrate, said optical interface including an output and a non fiber coupled optical sensor,

wherein said input of said amplifier circuit is electrically coupled to said output of said optical interface.

21. The loudspeaker device of claim 20 further comprising a power supply mounted on at least one surface of said magnetic assembly and electrically coupled to said amplifier circuit and to said optical interface.

22. The loudspeaker device of claim 16 further comprising a radio frequency receiver mounted on at least one surface of said magnetic assembly and including an output electrically coupled to said input of said amplifier circuit.

23. The loudspeaker device of claim 22 further comprising a power supply mounted on at least one surface of said magnetic assembly and electrically coupled to said amplifier circuit and to said radio frequency receiver.

24. The loudspeaker device of claim 16 further comprising an optical interface mounted on at least one surface of said magnetic assembly and including an output electrically coupled to said input of said amplifier circuit.

25. The loudspeaker device of claim 24 further comprising a power supply mounted on at least one surface of said magnetic assembly and electrically coupled to said amplifier circuit and to said optical interface.

26. The loudspeaker device of claim 16 further comprising a network interface mounted on at least one surface of said magnetic assembly and including an output electrically coupled to said input of said amplifier circuit.

27. The loudspeaker device of claim 26 further comprising a power supply mounted on at least one surface of said magnetic assembly and electrically coupled to said amplifier circuit and to said network interface.

28. The loudspeaker device of claim 16 further comprising a first inductive component electrically coupled to said first output of said amplifier circuit and wound around a portion of said former positioned outside of said magnetic gap.

29. The loudspeaker device of claim 28 further comprising a power supply mounted on at least one surface of said magnetic assembly and electrically coupled to said amplifier circuit.

30. The loudspeaker device of claim 28 further comprising a radio frequency receiver mounted on said substrate and including an output electrically coupled to said input of said amplifier circuit.

31. The loudspeaker device of claim 30 further comprising a power supply mounted on at least one surface of said magnetic assembly and electrically coupled to said amplifier circuit and to said radio frequency receiver.

32. The loudspeaker device of claim 28 further comprising:

an optical interface mounted on said substrate, said optical interface including an output and a non fiber coupled optical sensor,

wherein said input of said amplifier circuit is electrically coupled to said output of said optical interface.

33. The loudspeaker device of claim 32 further comprising a power supply mounted on at least one surface of said magnetic assembly and electrically coupled to said amplifier circuit and to said optical interface.

34. The loudspeaker device of claim 28 further comprising a radio frequency receiver mounted on at least one surface of said magnetic assembly and including an output electrically coupled to said input of said amplifier circuit.

35. The loudspeaker device of claim 34 further comprising a power supply mounted on at least one surface of said magnetic assembly and electrically coupled to said amplifier circuit and to said radio frequency receiver.

36. The loudspeaker device of claim 28 further comprising an optical interface mounted on at least one surface of said magnetic assembly and including an output electrically coupled to said input of said amplifier circuit.

37. The loudspeaker device of claim 36 further comprising a power supply mounted on at least one surface of said magnetic assembly and electrically coupled to said amplifier circuit and to said optical interface.

38. The loudspeaker device of claim 28 further comprising a network interface mounted on at least one surface of said magnetic assembly and including an output electrically coupled to said input of said amplifier circuit.

39. The loudspeaker device of claim 38 further comprising a power supply mounted on at least one surface of said magnetic assembly and electrically coupled to said amplifier circuit and to said network interface.

40. The loudspeaker device of claim 28 further comprising:

a second inductive component wound around a portion of said former positioned outside of said magnetic gap and electrically coupled to said voice coil,

wherein said amplifier circuit comprises a second output that is electrically coupled to said second inductive component.

41. The loudspeaker device of claim 40 further comprising a power supply mounted on at least one surface of said magnetic assembly and electrically coupled to said amplifier circuit.

42. The loudspeaker device of claim 40 further comprising a radio frequency receiver mounted on said substrate and including an output electrically coupled to said input of said amplifier circuit.

43. The loudspeaker device of claim 42 further comprising a power supply mounted on at least one surface of said magnetic assembly and electrically coupled to said amplifier circuit and to said radio frequency receiver.

44. The loudspeaker device of claim 40 further comprising:

an optical interface mounted on said substrate, said optical interface including an output and a non fiber coupled optical sensor,

wherein said input of said amplifier circuit is electrically coupled to said output of said optical interface.

45. The loudspeaker device of claim 44 further comprising a power supply mounted on at least one surface of said magnetic assembly and electrically coupled to said amplifier circuit and to said optical interface.

46. The loudspeaker device of claim 40 further comprising a radio frequency receiver mounted on at least one surface of said magnetic assembly and including an output electrically coupled to said input of said amplifier circuit.

47. The loudspeaker device of claim 46 further comprising a power supply mounted on at least one surface of said magnetic assembly and electrically coupled to said amplifier circuit and to said radio frequency receiver.

48. The loudspeaker device of claim 40 further comprising an optical interface mounted on at least one surface of said magnetic assembly and including an output electrically coupled to said input of said amplifier circuit.

49. The loudspeaker device of claim 48 further comprising a power supply mounted on at least one surface of said magnetic assembly and electrically coupled to said amplifier circuit and to said optical interface.

50. The loudspeaker device of claim 40 further comprising a network interface mounted on at least one surface of said magnetic assembly and including an output electrically coupled to said input of said amplifier circuit.

51. The loudspeaker device of claim 50 further comprising a power supply mounted on at least one surface of said magnetic assembly and electrically coupled to said amplifier circuit and to said network interface.

52. The loudspeaker device of claim 16 wherein said layer of thermally conductive material comprises aluminum.

53. The loudspeaker device of claim 16 wherein said layer of thermally conductive material comprises beryllium.

54. The loudspeaker device of claim 16 wherein said amplifier circuit comprises a second output that is electrically coupled to said voice coil.

55. The loudspeaker device of claim 16 wherein said amplifier circuit comprises a linear amplifier.

56. The loudspeaker device of claim 55 wherein said linear amplifier is a class B amplifier.

57. The loudspeaker device of claim 16 wherein said amplifier circuit comprises a class D amplifier.

58. A loudspeaker device comprising:

a magnetic assembly having a magnetic gap;

a former;

a voice coil wound around said former and positioned in said magnetic gap;

a substrate mounted on at least one inside surface of said magnetic assembly, said sustrate comprising a layer of thermally conductive material, and a layer of electrically conductive traces; and

an amplifier circuit a) residing inside of said magnetic assembly, b) thermally coupled to said layer of thermally conductive material c) comprising an input, and d) comprising a first output electrically coupled to said voice coil.

59. The loudspeaker device of claim 58 further comprising a power supply mounted on at least one surface of said magnetic assembly and electrically coupled to said amplifier circuit.

60. The loudspeaker device of claim 58 further comprising a radio frequency receiver mounted on said former and including an output electrically coupled to said input of said amplifier circuit.

61. The loudspeaker device of claim 60 further comprising a power supply mounted on at least one surface of said magnetic assembly and electrically coupled to said amplifier circuit and to said radio frequency receiver.

62. The loudspeaker device of claim 58 further comprising an optical interface mounted on said former, said optical interface including an output and a non fiber coupled optical sensor, wherein said input of said amplifier circuit is electrically coupled to said output of said optical interface.

63. The loudspeaker device of claim 62 further comprising a power supply mounted on at least one surface of said magnetic assembly and electrically coupled to said amplifier circuit and to said optical interface.

64. The loudspeaker device of claim 58 further comprising a radio frequency receiver mounted on at least one surface of said magnetic assembly and including an output electrically coupled to said input of said amplifier circuit.

65. The loudspeaker device of claim 64 further comprising a power supply mounted on at least one surface of said magnetic assembly and electrically coupled to said amplifier circuit and to said radio frequency receiver.

66. The loudspeaker device of claim 58 further comprising an optical interface mounted on at least one surface of said magnetic assembly and including an output electrically coupled to said input of said amplifier circuit.

67. The loudspeaker device of claim 66 further comprising a power supply mounted on at least one surface of said magnetic assembly and electrically coupled to said amplifier circuit and to said optical interface.

68. The loudspeaker device of claim 58 further comprising a network interface mounted on at least one surface of said magnetic assembly and including an output electrically coupled to said input of said amplifier circuit.

69. The loudspeaker device of claim 68 further comprising a power supply mounted on at least one surface of said magnetic assembly and electrically coupled to said amplifier circuit and to said network interface.

70. The loudspeaker device of claim 58 further comprising:

a first inductive component electrically coupled to said first output of said amplifier circuit and wound around a portion of said former positioned outside of said magnetic gap.

71. The loudspeaker device of claim 70 further comprising a power supply mounted on at least one surface of said magnetic assembly and electrically coupled to said amplifier circuit.

72. The loudspeaker device of claim 70 further comprising a radio frequency receiver mounted on said former and including an out-put electrically coupled to said input of said amplifier circuit.

73. The loudspeaker device of claim 72 further comprising a power supply mounted on at least one surface of said magnetic assembly and electrically coupled to said amplifier circuit and to said radio frequency receiver.

74. The loudspeaker device of claim 70 further comprising:

an optical interface mounted on said former, said optical interface including an output and a non fiber coupled optical sensor, wherein said input of said amplifier circuit is electrically coupled to said output of said optical interface.

75. The loudspeaker device of claim 74 further comprising a power supply mounted on at least one surface of said magnetic assembly and electrically coupled to said amplifier circuit and to said optical interface.

76. The loudspeaker device of claim 70 further comprising a radio frequency receiver mounted on at least one surface of said magnetic assembly and including an output electrically coupled to said input of said amplifier circuit.

77. The loudspeaker device of claim 76 further comprising a power supply mounted on at least one surface of said magnetic assembly and electrically coupled to said amplifier circuit and to said radio frequency receiver.

78. The loudspeaker device of claim 70 further comprising an optical interface mounted on at least one surface of said magnetic assembly and including an output electrically coupled to said input of said amplifier circuit.

79. The loudspeaker device of claim 78 further comprising a power supply mounted on at least one surface of said magnetic assembly and electrically coupled to said amplifier circuit and to said optical interface.

80. The loudspeaker device of claim 70 further comprising a network interface mounted on at least one surface of said magnetic assembly and including an output electrically coupled to said input of said amplifier circuit.

81. The loudspeaker device of claim 80 further comprising a power supply mounted on at least one surface of said magnetic assembly and electrically coupled to said amplifier circuit and to said network interface.

82. The loudspeaker device of claim 70 further comprising:

a second inductive component wound around a portion of said former positioned outside of said magnetic gap and electrically coupled to said voice coil,

wherein said amplifier circuit comprises a second output that is electrically coupled to said second inductive component.

83. The loudspeaker device of claim 82 further comprising a power supply mounted on at least one surface of said magnetic assembly and electrically coupled to said amplifier circuit.

84. The loudspeaker device of claim 82 further comprising a radio frequency receiver mounted on said former and including an output electrically coupled to said input of said amplifier circuit.

85. The loudspeaker device of claim 84 further comprising a power supply mounted on at least one surface of said magnetic assembly and electrically coupled to said amplifier circuit and to said radio frequency receiver.

86. The loudspeaker device of claim 82 further comprising:

an optical interface mounted on said former, said optical interface including an output and a non fiber coupled optical sensor, wherein said input of said amplifier circuit is electrically coupled to said output of said optical interface.

87. The loudspeaker device of claim 86 further comprising a power supply mounted on at least one surface of said magnetic assembly and electrically coupled to said amplifier circuit and to said optical interface.

88. The loudspeaker device of claim 82 further comprising a radio frequency receiver mounted on at least one surface of said magnetic assembly and including an output electrically coupled to said input of said amplifier circuit.

89. The loudspeaker device of claim 88 further comprising a power supply mounted on at least one surface of said magnetic assembly and electrically coupled to said amplifier circuit and to said radio frequency receiver.

90. The loudspeaker device of claim 82 further comprising an optical interface mounted on at least one surface of said magnetic assembly and including an output electrically coupled to said input of said amplifier circuit.

91. The loudspeaker device of claim 90 further comprising a power supply mounted on at least one surface of said magnetic assembly and electrically coupled to said amplifier circuit and to said optical interface.

92. The loudspeaker device of claim 82 further comprising a network interface mounted on at least one surface of said magnetic assembly and including an output electrically coupled to said input of said amplifier circuit.

93. The loudspeaker device of claim 92 further comprising a power supply mounted on at least one surface of said magnetic assembly and electrically coupled to said amplifier circuit and to said network interface.

94. The loudspeaker device of claim 58 wherein said layer of thermally conductive material comprises aluminum.

95. The loudspeaker device of claim 58 wherein said layer of thermally conductive material comprises beryllium.

96. The loudspeaker device of claim 58 wherein said amplifier circuit comprises a linear amplifier.

97. The loudspeaker device of claim 58 wherein said amplifier circuit comprises a class D amplifier.

98. A method for convection cooling an amplifier circuit, including an input and an output, in a loudspeaker device utilizing a) a magnetic assembly having a magnetic gap with an associated magnetic field and b) a voice coil wound around a former and positioned in said magnetic gap, said method comprising the steps of:

mounting a substrate on said former, said substrate comprising a layer of thermally conductive material, and a layer of electrically conductive traces;

thermally coupling said amplifier circuit to said layer of thermally conductive material; and

electrically coupling said output of said amplifier to said voice coil;

whereby said former, said voice coil, said substrate and said amplifier circuit move in response to a voltage applied by said output of said amplifier circuit to said voice coil interacting with said magnetic field resulting in said convection cooling of said amplifier circuit.

99. A method for conductive cooling of an amplifier circuit in a loudspeaker device utilizing a) a magnetic assembly having a magnetic gap with an associated magnetic field and b) a voice coil wound around a former and positioned in said magnetic gap, said method comprising the steps of:

mounting a substrate on at least one inside surface of said magnetic assembly, said substrate comprising a layer of thermally conductive material, and a layer of electrically conductive traces; and

thermally coupling said amplifier circuit to said layer of thermally conductive material whereby said layer of thermally conductive material conductively transfers a portion of said heat generated by said amplifier circuit to said inside surface of said magnetic assembly for transfer to said outside surface of said magnetic assembly.

100. A method for fully integrating an amplifier circuit, including an input and an output, in a loudspeaker device utilizing a) a former, b) a magnetic assembly having a magnetic gap and c) a voice coil wound around said former and positioned in said magnetic gap comprising the steps of:

mounting a substrate on said former, said substrate comprising a layer of thermally conductive material, and a layer of electrically conductive traces; and

thermally coupling said amplifier circuit to said layer of thermally conductive material and electrically coupling said output of said amplifier circuit to said voice coil.