Sensor device for non-intrusive diagnosis of a semiconductor processing system
First Claim
1. A movable wireless sensor device for performing diagnostics within a substrate processing system, comprising:
- a support platform having physical dimensions substantially similar to dimensions of a substrate being processed; and
at least one electronic device mounted to the support platform and including a sensor adapted to sense a condition of the support platform and provide condition signals indicative of the condition of the support platform.
1 Assignment
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Accused Products
Abstract
A sensor device, for diagnosing a processing system, generally includes a support platform and one or more sensors mounted on the support platform. The sensor senses a condition, such as direction or inclination or acceleration in one or two axes, of the sensor device and outputs a signal indicative thereof, which is then sent to a transmitter, also mounted to the support platform, for wireless transmission of the signal to a receiver mounted on or near the processing system. The support platform generally has physical characteristics, such as size, profile height, mass, flexibility and/or strength, substantially similar to those of the substrates that are to be processed in the processing system, so the sensor device can be transferred through the processing system in a manner similar to the manner in which production substrates are transferred through the processing system.
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Citations
26 Claims
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1. A movable wireless sensor device for performing diagnostics within a substrate processing system, comprising:
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a support platform having physical dimensions substantially similar to dimensions of a substrate being processed; and
at least one electronic device mounted to the support platform and including a sensor adapted to sense a condition of the support platform and provide condition signals indicative of the condition of the support platform. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26)
the processing system has a plurality of interconnected chambers, an opening between interconnected chambers, and a substrate handler having a substrate support for inserting a substrate through the opening between the interconnected chambers; and
the support platform and the at least one electronic device have a combined profile height low enough to be inserted through the opening while supported on the substrate support.
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23. The sensor device of claim 1 wherein the at least one electronic device is micro-machined onto the support platform.
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24. The sensor device of claim 1 wherein the at least one electronic device is constructed of a ceramic chip carrier mounted to the support platform, with a die for the electronic device formed into the ceramic chip carrier.
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25. The sensor device of claim 1 wherein the at least one electronic device is constructed of a surface-mount integrated circuit chip mounted to the support platform.
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26. The sensor device of claim 1 wherein the support platform has a size substantially similar to a size of a substrate which is to be processed in the processing system.
Specification