Highly integrated electronic circuit, in particular for use in heart pacemakers

• US 6,245,092 B1
• Filed: 05/17/1999
• Issued: 06/12/2001
• Est. Priority Date: 05/15/1998
• Status: Expired due to Term

• Current Assignee: Biotronik Mess-Und Therapiegeraete GmbH & Company Ingenieurbuero Berlin (Biotronik SE & Company KG)
• Original Assignee: Biotronik Mess und Therapiegeraete GmbH and Co (Biotronik SE & Company KG)
• Inventors: Schaldach, Max Jr.
• Primary Examiner(s): Getzow, Scott M.
• Application Number:
  US09/313,086
• Time in Patent Office: 757 Days
• Field of Search: 607/1, 607/36, 607/37, 607/9, 607/5, 361/749, 361/803, 623/11
• US Class Current: 607/1
• CPC Class Codes: A61N 1/362 Heart stimulators heart defibrillators A61N1/39
• CPC Class Codes: A61N 1/37512 Pacemakers
• CPC Class Codes: A61N 1/3758 Packaging of the components within the casing
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H05K 1/118 specially for flexible printed circuits, e.g. using folded portions
• CPC Class Codes: H05K 1/189 characterised by the use of a flexible or folded printed circuit H05K3/326 takes precedence

Abstract

A highly integrated electronic circuit is provided with a flexible substrate which has a component side and an insulating bottom side as well as with an arrangement, corresponding to the circuit function, of active and passive electronic components. These are mounted on bond pads of the substrate and connected by strip conductors, corresponding to the circuit function.

The substrate is folded along a fold portion so that the sections of the substrate, which are on both sides of the fold portion and equipped with components, are approximately parallel and close to each other.

Claims

1. A highly integrated electronic circuit for use in heart pacemakers, defibrillators and the like, implementing a circuit function and comprising:

a flexible substrate (1) having a component side (2) and an insulating bottom side (14); and

an arrangement, corresponding to the circuit function, of active and passive components (5) on the component side (2) of the substrate (1), which are mounted on bond pads (4) of the substrate (1) and connected via strip conductors (3) on the substrate (1) corresponding to the circuit function, wherein the substrate (1) is folded along a fold portion (11) so that sections (12, 13) of the substrate (1), which are on both sides of the fold portion (11) and equipped with components (5) are approximately parallel and close to each other, and the substrate (1) is provided with standardized test bond pads (9), which are removable prior to said folding of the substrate (1) equipped with components.

2. A circuit according to claim 1, wherein the fold portion (11) is disposed approximately centrally relative to an overall surface of the substrate (1) so that the circuit has an approximately U-shaped configuration.

3. A circuit according to claim 1, wherein the component side (2) of the substrate (1) lies inside in the folded condition.

4. A circuit according to claim 3, wherein an insulating layer (15) is placed between the components (5) turned toward each other on the respective sections (12, 13) of the substrate (1).

5. A circuit according to claim 1, wherein the substrate (1) is provided with integrally attached flexible confection tongues (6) for connection of the circuit to external components (7).

6. A circuit according to claim 1, wherein the test bond pads (9) are arranged in a row (8) on an edge (10) of the substrate (1).

7. A circuit according to claim 1, wherein a radiographically visible mark (24) is disposed on the substrate (1) preferably on a foldable tongue which stands out from an edge of the substrate.

8. A circuit according to claim 1, wherein all the components (5) on the component side (2) are mounted by a uniform bonding process in a single manufacturing operation.

9. A circuit according to claim 8, wherein the components (5) are mounted by one of soldering and gluing.

10. A circuit according to claim 1, wherein active components (5.5) are disposed in a pickaback manner on passive components (5.6) which function as connection elements between the respective active component (5.3) and the substrate (1).

11. A circuit according to claim 1, comprising a structuring of the strip conductors (3) by lithography.

12. A circuit according to claim 1, comprising a structuring of the strip conductors (3) by laser technique.

13. A highly integrated electronic circuit for use in heart pacemakers, defibrillators and the like, implementing a circuit function and comprising:

a flexible substrate (1) having a component side (2) and an insulating bottom side (14);

an arrangement, corresponding to the circuit function, of active and passive components (5) on the component side (2) of the substrate (1), which are mounted on bond pads (4) of the substrate (1) and connected via strip conductors (3) on the substrate (1) corresponding to the circuit function, wherein the substrate (1) is folded along a fold portion (11) so that sections (12, 13) of the substrate (1), which are on both sides of the fold portion (11) and equipped with components (5), are approximately parallel and close to each other; and

at least one external component placed between the components (5) with which the sections (12, 13) of the folded substrate (1) are equipped.

14. A circuit according to claim 13 wherein the at least one external component is a telemetry coil of an implantable cardiological device.

15. A circuit according to claim 13, wherein the fold portion (11) is disposed approximately centrally relative to an overall surface of the substrate (1) so that the circuit has an approximately U-shaped configuration.

16. A circuit according to claim 13, wherein the component side (2) of the substrate (1) lies inside in the folded condition.

17. A circuit according to claim 16, wherein an insulating layer (15) is placed between the components (5) turned toward each other on the respective sections (12, 13) of the substrate (1).

18. A circuit according to claim 13, wherein the substrate (1) is provided with integrally attached flexible connection tongues (6) for connection of the circuit to external components (7).

19. A circuit according to claim 13, wherein a radiographically visible mark (24) is disposed on the substrate (10) preferably on a folded tongue which stands out from an edge of the substrate.

20. A circuit according to claim 13, wherein all the components (5) on the component side (2) are mounted by a uniform bonding process in a single manufacturing operation.

21. A circuit according to claim 20, wherein the components (5) are mounted by one of soldering and gluing.

22. A circuit according to claim 13, wherein active componets (5.5) are disposed in a pickaback manner on passive components (5.6) which function as connection elements between the respective active component (5.5) and the substrate (1).

23. A circuit according to claim 13, comprising a structuring of the strip conductors (3) by lithography.

24. A circuit according to claim 13, comprising a structuring of the strip conductors (3) by laser technique.