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Economical silicon-on-silicon hybrid wafer assembly

  • US 6,245,161 B1
  • Filed: 02/19/1998
  • Issued: 06/12/2001
  • Est. Priority Date: 05/12/1997
  • Status: Expired due to Term
First Claim
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1. A hybrid silicon wafer assembly, said assembly comprising:

  • a high-quality single-crystal silicon thin film coupled to a lower-quality silicon transfer substrate.

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