Economical silicon-on-silicon hybrid wafer assembly
First Claim
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1. A hybrid silicon wafer assembly, said assembly comprising:
- a high-quality single-crystal silicon thin film coupled to a lower-quality silicon transfer substrate.
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Abstract
An economical hybrid wafer utilizing a lower-quality, lower cost transfer substrate to support a higher-quality thin film. A high-quality thin film (2101) is separated from a donor wafer (2100) and bonded to a transfer, or target, substrate (46). The donor wafer is preferably single-crystal silicon optimized for device fabrication, while the transfer substrate provides mechanical support. The thin film is not grown on the transfer substrate, and thus defects in the transfer substrate are not grown into the thin film. A low-temperature bonding process can provide an abrupt junction between the target wafer and the thin film.
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20 Claims
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1. A hybrid silicon wafer assembly, said assembly comprising:
a high-quality single-crystal silicon thin film coupled to a lower-quality silicon transfer substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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