Test process and apparatus for testing singulated semiconductor die

• US 6,246,251 B1
• Filed: 04/23/1999
• Issued: 06/12/2001
• Est. Priority Date: 04/24/1998
• Status: Expired due to Fees

• Current Assignee: International Rectifier Corporation (Infineon Technologies AG)
• Original Assignee: International Rectifier Corporation (Infineon Technologies AG)
• Inventors: Gallagher, Wesley C.
• Primary Examiner(s): Metjahic, Safet
• Assistant Examiner(s): Nguyen, Jimmy
• Application Number:
  US09/298,659
• Time in Patent Office: 781 Days
• Field of Search: 324/765, 324/754, 324/755, 324/158.1, 209/573, 209/73
• US Class Current: 324/756.02
• CPC Class Codes: G01R 31/01 Subjecting similar articles in turn to test, e.g. "go/no-go" tests in mass production; Testing objects at points as they pass through a testing station testing of cables continuously passing the testing apparatus G01R31/59; testing dielectric strength or breakdown voltage G01R31/12
• CPC Class Codes: G01R 31/2851 Testing of integrated circuits [IC] G01R31/317 takes precedence; testing individual devices G01R31/26; testing printed circuits G01R31/2801
• CPC Class Codes: G01R 31/2887 involving moving the probe head or the IC under test; docking stations moving single probes G01R1/06705; moving individual probes in multiple probes G01R1/07392

Abstract

A known good die testing apparatus for pre-package testing singulated semiconductor die includes a plurality of test nests for receiving at least one of the singulated semiconductor die, each test nest including first and second portions which are movable away from one another to receive the singulated die, the first portion having a probe card coupled thereto which includes at least one needle for electrically connecting to a first side of the semiconductor die and at least one first edge connector electrically coupled to a respective needle; and at least one test unit in movable communication with respect to the test nests, the test unit being adapted to removably engage the first edge connector of the test nests, the test unit including at least one electrical circuit for performing electrical tests on the semiconductor die.

Claims

1. A known good die testing apparatus for pre-package testing singulated semiconductor die, the testing apparatus comprising:

a plurality of test nests each for receiving a singulated semiconductor die, each test nest including first and second portions which are movable away from one another to receive the singulated die, the first portion having a probe card coupled thereto which includes at least one needle for electrically connecting to a first side of a semiconductor die and at least one first electrical contact pad coupled to a respective needle; and

at least one test unit having at least one electrical member in movable communication with the at least one first electrical contact pad to make electrical contact with the same during a testing of a die, the test unit including at least one electrical circuit for performing electrical tests on the semiconductor die.

2. The known good die testing apparatus of claim 1, wherein the first and second portions are adapted to move away from one another to a substantially open position to receive or release the singulated die and to move towards one another to a substantially closed position such that the at least one needle electrically connects to the first side of the semiconductor die.

3. The known good die testing apparatus of claim 2, wherein each test nest further includes:

a base lead for electrically connecting to a second side of the semiconductor die, opposite to the first side; and

a second edge connector electrically coupled to the base lead,

the test unit being further adapted to removably engage the first and second edge connectors of the test nests.

4. The known good die testing apparatus of claim 3, wherein each test nest further includes an automated pick-and-place apparatus for transferring a semiconductor die to or removing a semiconductor die from the base lead of a respective test nest when the first and second portions are in the substantially open configuration.

5. The known good die testing apparatus of claim 3, wherein each test nest further includes a vacuum device in communication with the base lead at least when a semiconductor die is transferred thereto, the vacuum device biasing the semiconductor die against the base lead at least until the first and second portions are in the substantially closed configuration.

6. The known good die testing apparatus of claim 5, wherein each base lead includes an aperture adapted to direct the vacuum towards the semiconductor die.

7. The known good die testing apparatus of claim 3, wherein each test nest further includes at least one guide fixed to one of the first and second portions and slidably engaging the other of the first and second portions such that the portions may attain the open and closed positions.

8. The known good die testing apparatus of claim 7, wherein the guide of each test nest includes at least one rod fixed to and extending substantially vertically from the first portion, the second portion including a rod engaging portion for slidably engaging the at least one rod.

9. The known good die testing apparatus of claim 8, wherein the rod engaging portion is an aperture extending through a part of the second portion.

10. The known good die testing apparatus of claim 3, wherein each test nest further includes at least one biasing element operable to bias the first and second portions towards one another such that, without external force applied thereto, the portions will tend to attain the substantially closed position.

11. The known good die testing apparatus of claim 10, wherein the biasing element includes at least one spring having one end fixed to the first portion and an opposite end fixed to the second portion, the spring biasing the first and second portions towards one another.

12. The known good die testing apparatus of claim 2, wherein each test nest includes an adjustable stop mechanism operable to adjust the degree to which the first and second portions may be moved towards one another.

13. The known good die testing apparatus of claim 3, wherein each probe card includes at least one needle for connecting to a source metalization on a first side of a MOSFET semiconductor die, at least one needle for connecting to a gate metalization on the first side of the MOSFET semiconductor die, and the base lead is adapted to connect to a drain metalization on a second side of the MOSFET semiconductor die, the second side being opposite to the first side.

14. The known good die testing apparatus of claim 13, wherein each probe card includes at least two needles for making a Kelvin sense connection to the MOSFET semiconductor die.

15. The known good die testing apparatus of claim 3, wherein each test unit includes first and second engagement members which are oppositely disposed and movable toward one another to achieve a substantially open or closed position, each engagement member including at least one terminal for connecting to a respective edge connector of the probe card when the engagement members are in the substantially closed position.

16. The known good die testing apparatus of claim 15, wherein the first and second engagement members form a pair of jaws for electrically coupling the electrical circuit of the test unit to the semiconductor die when the jaws are in the closed position.

17. The known good die testing apparatus of claim 15, wherein the terminals resiliently engage the respective edge connectors.

18. The known good die testing apparatus of claim 15, wherein the terminals include a movable plunger which resiliently engages the respective edge connectors.

19. The known good die testing apparatus of claim 15, wherein the at least one test unit is substantially fixed and the test nests move into communication therewith such that the terminals may engage the respective edge connectors of the test nests.

20. The known good die testing apparatus of claim 19, wherein:

each test unit may perform a substantially different test on each semiconductor die when respective test nests move into communication therewith; and

each semiconductor die need only be contacted one time by the respective needles yet undergoing a plurality of tests.

21. The known good die testing apparatus of claim 2, further comprising a rotatable plate having a periphery, wherein:

each test nest is disposed at the periphery of the plate and is rotated therewith; and

the test units are disposed in a substantially stationary position proximate to the periphery of the plate such that the test nests may communicate with each test unit as they are rotated.

22. The known good die testing apparatus of claim 21, wherein the rotatable plate includes a lifter adapted to bias the first and second portions away from one another as the plate is rotated into a predetermined position such that the semiconductor die may be transferred to or removed from the base leads of respective test nests.

23. The known good die testing apparatus of claim 22, wherein one of the lifter and the test nests include a cam surface adapted to bias the first and second portions away from one another as the plate is rotated into the predetermined position.

24. The known good die testing apparatus of claim 23, wherein the lifter includes the cam surface and one of the first and second portions of the test nests includes a roller, the roller engaging the cam surface such that the first and second portions are biased away from one another as the plate is rotated into the predetermined position.

25. The known good die testing apparatus of claim 13, wherein at least one of the test units include circuitry to perform at least one of the following tests:

avalanche testing, reverse breakdown testing, dynamic switch testing, turn on time testing, turn off time testing, high temperature testing, low temperature testing, Rds on testing, and UIS testing.

26. The known good die testing apparatus of claim 7, further comprising at least one cover member coupled to at least one of the first and second portions of at least one of the test nests, the cover member including a port for fluid communication with a source of substantially inert gas, the cover member being sized and shaped to define a volume at least enclosing the first side of the semiconductor die such that a substantially inert gas environment is obtained when the source of substantially inert gas releases inert gas into the volume.

27. The known good die testing apparatus of claim 26, wherein the one cover member is coupled to the first portion of the test nest over the probe card such that the volume substantially encloses the first side of the semiconductor die when the first and second portions of the test nest attain the closed position.

28. The known good die testing apparatus of claim 27, wherein at least one test unit includes a source of substantially inert gas, the port of the cover member communicating with the source of substantially inert gas when the test unit is in a position to engage the first edge connector of the test nest.

29. The known good die testing apparatus of claim 28, wherein the test unit includes a substantially fixed conduit for channeling the substantially inert gas toward the port of the cover member, the conduit communicating with the port when the test unit is in the position to engage the first edge connector of the test nest.

30. The known good die testing apparatus of claim 29, wherein the conduit is elongated and disposed substantially vertically;

and the port of the cover member is disposed on a top surface thereof such that the conduit communicate with the port the substantially inert gas is directed into the volume and downwardly onto the first surface of the semiconductor die.