Radio frequency identification tag circuit chip having printed interconnection pads

• US 6,246,327 B1
• Filed: 09/09/1999
• Issued: 06/12/2001
• Est. Priority Date: 06/09/1998
• Status: Expired due to Term

• Current Assignee: Google Technology Holdings LLC (Alphabet Inc.)
• Original Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Inventors: Eberhardt, Noel H.
• Primary Examiner(s): MULLEN, THOMAS J
• Application Number:
  US09/393,097
• Time in Patent Office: 642 Days
• Field of Search: 340/572.1, 340/572.7, 257/758, 257/773, 257/774
• US Class Current: 340/572.1
• CPC Class Codes: H01L 2224/24051 Conformal with the semiconductor or solid-state device
• CPC Class Codes: H01L 2224/24225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/24226 the HDI interconnect connecting to the same level of the item at which the semiconductor or solid-state body is mounted, e.g. the item being planar
• CPC Class Codes: H01L 2224/24227 the HDI interconnect not connecting to the same level of the item at which the semiconductor or solid-state body is mounted, e.g. the semiconductor or solid-state body being mounted in a cavity or on a protrusion of the item
• CPC Class Codes: H01L 24/24 of an individual high density interconnect connector
• CPC Class Codes: H01L 24/82 by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI] interconnection structure between a plurality of semiconductor chips H01L23/5389
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01027 Cobalt [Co]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/07802 not being an ohmic electrical conductor
• CPC Class Codes: H01L 2924/15153 the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/15155 the shape of the recess being other than a cuboid
• CPC Class Codes: H01L 2924/15165 Monolayer substrate
• CPC Class Codes: H01L 2924/19041 being a capacitor
• CPC Class Codes: H01L 2924/19042 being an inductor
• CPC Class Codes: H01L 2924/19043 being a resistor

Abstract

A radio frequency identification tag circuit chip (10) includes a circuit chip (11) having a surface (18) and at least one interconnection pad (12, 14) formed in the surface (18). A layer (24) of insulating material is deposited on the surface and about the at least one interconnection pad (12, 14), and a layer of conductive material (26) is deposited on the insulating material and coupling to the interconnection pad (12, 14).

Claims

1. A radio frequency identification tag circuit chip comprising:

a circuit chip having a surface and at least one interconnection pad formed in the surface; and

a layer of conductive material substantially larger than the at least one interconnection pad and deposited on the surface and coupling to the at least one interconnection pad,

wherein the circuit chip is secured to a substrate, the substrate is formed to include an antenna, and the antenna is coupled to the layer of conductive material.

2. The radio frequency identification tag circuit chip of claim 1, further comprising a layer of insulating material deposited between the surface and the layer of conducting material.

3. The radio frequency identification tag circuit chip of claim 2, wherein the layer of conductive material is printed on the layer of insulating material.

4. The radio frequency identification tag circuit chip of claim 2, wherein the layer of insulating material comprises one of a non-conductive polymer, a non-conductive ink, and a non-conductive adhesive.

5. The radio frequency identification tag circuit chip of claim 2, wherein the layer of insulating material is printed on the surface and the layer of conductive material is printed on the layer of insulating material.

6. The radio frequency identification tag circuit chip of claim 1, wherein the conductive material comprises one of a conductive ink, a conductive polymer and a conductive adhesive.

7. The radio frequency identification tag circuit chip of claim 1, wherein the surface further comprising a side surface of the circuit chip.

8. The radio frequency identification tag circuit chip of claim 1, further comprising a conductive adhesive coupling the conductive material to the antenna.

9. A radio frequency identification tag circuit chip comprising:

a circuit chip having a first interconnection pad and a second interconnection pad;

a layer of insulating material disposed on a surface of the circuit chip, the layer of insulating material formed to include a first aperture and a second aperture, the first aperture and the second aperture arranged to expose the first interconnection pad and the second interconnection pad through the layer of insulating material;

a first layer of conductive material disposed on the layer of insulating material and coupling to the first interconnection pad; and

a second layer of conductive material disposed on the layer of insulating material and coupling to the second interconnection pad,

wherein the surface comprises a first side surface and a second side surface, and wherein the layer of insulating material comprises a first layer of insulating material disposed on the first side surface and a second layer of insulating material disposed on the second side surface.

10. The radio frequency identification tag circuit chip of claim 9, wherein the layer of insulating material is printed on the surface.

11. The radio frequency identification tag circuit chip of claim 9, wherein the first layer of conductive material and the second layer of conductive material are printed on the layer of insulating material.

12. The radio frequency identification tag circuit chip of claim 9, wherein the first layer of conductive material is disposed on the first layer of insulating material and the second layer of conductive material is disposed on the second layer of insulating material.

13. The radio frequency identification tag circuit chip of claim 9, wherein the conductive material comprises one of a conductive ink, conductive polymer and a conductive adhesive.

14. The radio frequency identification tag circuit chip of claim 9, wherein the insulating material comprises one of a non-conductive polymer, a non-conductive ink, and a non-conductive adhesive.

15. A radio frequency identification tag circuit chip comprising:

a circuit chip having a first interconnection pad and a second interconnection pad;

a layer of insulating material disposed on a surface of the circuit chip, the layer of insulating material formed to include a first aperture and a second aperture, the first aperture and the second aperture arranged to expose the first interconnection pad and the second interconnection pad through the layer of insulating material;

a first layer of conductive material disposed on the layer of insulating material and coupling to the first interconnection pad; and

a second layer of conductive material disposed on the layer of insulating material and coupling to the second interconnection pad,

wherein the circuit chip is secured to a substrate, the substrate is formed to include an antenna including a first coupling region and a second coupling region, and the first layer of conductive material is coupled to the first coupling region and the second layer of conductive material is coupled to the second coupling region.

16. The radio frequency identification tag circuit chip of claim 15, further comprising a conductive adhesive coupling the first layer of conductive material and the second layer of conductive material.

17. A radio frequency identification tag comprising:

a substrate, the substrate including an antenna formed on a surface thereof; and

a radio frequency identification tag circuit chip secured to the substrate, the radio frequency identification tag circuit chip formed with at least one printed interconnection pad and the at least one printed interconnection pad coupling the radio frequency identification tag circuit chip to the antenna.

18. The radio frequency identification tag of claim 17, wherein the at least one printed interconnection pad comprises a layer of conductive material printed on a surface of a circuit chip and coupling to an interconnection pad formed on the surface.

19. The radio frequency identification tag of claim 18, wherein the at least one printed interconnection pad comprises a layer of insulating material disposed between the layer of conductive material and the surface.

20. The radio frequency identification tag of claim 19, wherein the insulating material is printed on the surface.

21. The radio frequency identification tag of claim 18, wherein the conductive material comprises one of a conductive ink, a conductive polymer and a conductive adhesive.

22. The radio frequency identification tag of claim 18, wherein the surface further comprises a side surface of the circuit chip.

23. The radio frequency identification tag of claim 18, further comprising a layer of conductive material coupling the at least one printed interconnection pad and the antenna.

24. The radio frequency identification tag of claim 17, wherein the substrate includes a recess and the radio frequency identification tag circuit chip is disposed within the recess.

25. A radio frequency identification tag comprising:

a substrate, the substrate including a recess formed on a surface thereof and an antenna formed on the surface thereof; and

a radio frequency identification tag circuit chip disposed in the recess and secured to the substrate, the radio frequency identification tag circuit chip formed with at least one printed interconnection pad and wherein the at least one printed interconnection pad couples the radio frequency identification tag circuit chip to the antenna.

26. The radio frequency identification tag of claim 25, wherein the at least one printed interconnection pad comprises a layer of conductive material printed on a surface of a circuit chip and coupling to an interconnection pad formed on the surface.

27. The radio frequency identification tag of claim 26, wherein the at least one printed interconnection pad comprises a layer of insulating material disposed between the layer of conductive material and the surface.

28. The radio frequency identification tag of claim 27, wherein the insulating material is printed on the surface.

29. The radio frequency identification tag of claim 26, wherein the conductive material comprises one of a conductive ink, a conductive polymer and a conductive adhesive.

30. The radio frequency identification tag of claim 26, wherein the surface further comprises a side surface of the circuit chip.

31. The radio frequency identification tag of claim 26, further comprising a layer of conductive material coupling the at least one printed interconnection pad and the antenna.

32. The radio frequency identification tag of claim 25, wherein the recess comprises a localized compressed portion of the substrate.

33. The radio frequency identification tag of claim 25, wherein the recess comprises an aperture formed in a laminate secured to the substrate.