Heated PCB interconnect for cooled IC chip modules

• US 6,246,581 B1
• Filed: 10/12/1999
• Issued: 06/12/2001
• Est. Priority Date: 10/12/1999
• Status: Expired due to Fees

• Current Assignee: International Business Machines Corporation
• Original Assignee: International Business Machines Corporation
• Inventors: Singh, Prabjit, Schmidt, Roger R., Mahaney, Howard Victor Jr., Kang, Sukhvinder
• Primary Examiner(s): Picard, Leo P.
• Assistant Examiner(s): DATSKOVSKIY, MICHAIL V
• Application Number:
  US09/415,740
• Time in Patent Office: 609 Days
• Field of Search: 361/700-710, 361/719, 361/689, 361/699, 361/702, 361/701, 361/704, 361/705, 361/683, 165/80.4, 165/104.21, 165/104.22, 165/104.24, 165/104.33, 257/713-715, 174/16.1, 174/15.1, 174/16.3, 219/200, 219/201, 219/209, 219/210, 622/522, 621/50, 62/511, 62/512
• US Class Current: 361/700
• CPC Class Codes: H01L 23/345 Arrangements for heating thermal treatment apparatus H01L21/00
• CPC Class Codes: H01L 23/4985 Flexible insulating substrates H01L23/49572 and H01L23/49855 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 1/0212 Printed circuits or mounted components having integral heating means
• CPC Class Codes: H05K 2201/09263 Meander
• CPC Class Codes: H05K 2201/10378 Interposers
• CPC Class Codes: H05K 2201/10734 Ball grid array [BGA]; Bump grid array
• CPC Class Codes: H05K 2203/1115 Resistance heating, e.g. by current through the PCB conductors or through a metallic mask
• CPC Class Codes: H05K 2203/1121 Cooling, e.g. specific areas of a PCB being cooled during reflow soldering details related to cooling of mounted components H05K1/0203
• CPC Class Codes: H05K 2203/165 Stabilizing, e.g. temperature stabilization

Abstract

A cooling assembly for an integrated circuit chip module wherein an evaporator-cooled IC module is enclosed within an insulated housing and attached to a printed circuit board through an interconnect including a heating element embedded therein.

Claims

1. A cooling assembly for an integrated circuit chip module mounted on a printed circuit board substrate comprising:

an evaporator unit having a thermal interface in thermal communication with said integrated circuit chip module so as to cool said module to a temperature below ambient dew point;

an insulated housing having its base attached to said printed circuit board substrates said base surrounding the outer perimeter of said integrated circuit module so as to enclose said evaporator unit and said integrated circuit module; and

an interconnect layer interposed between and electrically coupling the integrated circuit chip module and the printed circuit board substrate through a pattern of contact connections on the chip module and electrically conducting pads on said interconnect layer, said interconnect layer including a heating element embedded therein between said module and said substrate.

2. The cooling assembly of claim 1 wherein said interconnect layer includes electrically conductive material selected from the group consisting of copper composites, platinum, and gold.

3. The cooling assembly of claim 2 wherein said interconnect layer is a sheet of polycarbonate polymer or polyurethane, having a thickness of about 0.2 mm to about 1 mm.

4. The cooling assembly of claim 1 wherein said interconnect layer includes a heating element which is a line of electrically conductive material.

5. The cooling assembly of claim 4 wherein the line of electrically conductive material is a line of copper.

6. The cooling assembly of claim 1 wherein the interconnect layer includes a pattern of electrical pads to facilitate electrical connection between the integrated circuit chip module and the printed circuit board substrate.

7. The cooling assembly of claim 1 wherein said interconnect layer includes multiple independent heating elements.

8. The cooling assembly of claim 1 wherein multiple interconnect layers are interposed between the integrated circuit chip module and the printed circuit board substrate.